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121. 发明授权

US07789680B2 USB device with connected cap 失效
标题翻译：带有连接帽的USB设备
公开(公告)号：US07789680B2
公开(公告)日：2010-09-07
申请号：US12487523
申请日：2009-06-18
申请人： Siew S. Hiew , Nan Nan , Abraham C. Ma
发明人： Siew S. Hiew , Nan Nan , Abraham C. Ma
IPC分类号： H01R13/44
CPC分类号： H01R13/44 , A45C2011/188 , H01R13/5213 , H01R13/6395
摘要： A USB device including a housing and a protective cap that are slidably and/or pivotably connected together such that the protective cap is able to slide and/or pivot between an open position, in which a plug connector extending from the front of the housing is exposed for operable coupling to a host system, and a closed position, in which the protective cap is disposed over the front end portion of the housing to protect the plug connector. A pivoting/sliding mechanism is provided on the housing and cap that secures the protective cap to the housing at all times, including during transitional movements of the protective cap between the opened and closed positions.
摘要翻译：一种USB设备，包括壳体和保护盖，其可滑动地和/或可枢转地连接在一起，使得保护盖能够在打开位置之间滑动和/或枢转，在该打开位置中，从壳体前部延伸的插头连接器暴露以用于可操作地联接到主机系统，以及关闭位置，其中保护盖设置在壳体的前端部分上以保护插头连接器。在壳体和盖上提供枢转/滑动机构，其将保护帽一直固定到壳体，包括在保护盖在打开位置和关闭位置之间的过渡运动期间。

122. 发明申请

US20100110647A1 Molded Memory Card With Write Protection Switch Assembly 失效
标题翻译：带有写保护开关组件的成型存储卡
公开(公告)号：US20100110647A1
公开(公告)日：2010-05-06
申请号：US12684841
申请日：2010-01-08
申请人： Siew S. Hiew , Abraham C. Ma , Nan Nan
发明人： Siew S. Hiew , Abraham C. Ma , Nan Nan
IPC分类号： H05K5/00 , H05K3/30
CPC分类号： H05K3/284 , H01L21/565 , H01L24/73 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/14 , H01L2924/19105 , H01L2924/3025 , H05K1/117 , H05K1/141 , H05K2201/09472 , H05K2201/10053 , H05K2201/10159 , H05K2201/10446 , H05K2203/1316 , Y10T29/4913 , H01L2924/00012 , H01L2224/85 , H01L2924/00
摘要： A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. The molded plastic casing defines a pre-molded switch slot that facilitates an insert-in switch assembly process for mounting a write protect switch. The write protect switch includes a movable switch button engaged in the switch slot, and a switch cap secured over the switch slot.
摘要翻译：一种安全数字设备，包括使用表面贴装技术（SMT）技术安装在PCB上的无源元件的PCBA以及使用板上（COB）技术安装的有源组件（例如，控制器和闪存）。组件仅安装在PCB的一侧，然后在PCB的两侧形成模制塑料外壳，使得部件被包裹在塑料中，并且在PCB表面上形成薄的塑料层组件。模制的塑料外壳形成为包括露出设置在PCB上的金属触点的开口和分开开口的肋。模制的塑料外壳限定了预先模制的开关槽，其有助于插入开关组装过程以安装写保护开关。写保护开关包括接合在开关槽中的可移动开关按钮和固定在开关槽上的开关帽。

123. 发明申请

US20100105251A1 Micro-SD To Secure Digital Adaptor Card And Manufacturing Method 失效
标题翻译： Micro-SD保护数字适配卡和制造方法
公开(公告)号：US20100105251A1
公开(公告)日：2010-04-29
申请号：US12649233
申请日：2009-12-29
申请人： Siew S. Hiew , Abraham C. Ma , Nan Nan
发明人： Siew S. Hiew , Abraham C. Ma , Nan Nan
IPC分类号： H01R27/02 , B32B37/24
CPC分类号： G06F1/1632 , H05K1/117 , H05K3/202 , H05K3/4092 , H05K5/0282 , Y10S439/945 , Y10S439/946 , Y10T29/49126
摘要： A microSD-to-SD adaptor card includes a base substrate having a lead frame structure, a protective cap forming a chamber that encloses eight microSD contact pins of the lead frame structure, and a thermoset plastic casing formed over the protective cap and exposed portions of the base substrate to provide the adaptor card with standard SD card dimensions. A rear opening facilitates insertion of a standard microSD card, whereby the eight contact pads on the microSD card are contacted by the eight microSD contact pins inside the chamber to allow electrical signals generated by the microSD card to be transmitted to a host system by way of a standard SD socket. A grip anchor pin is disposed inside the chamber to engage a grip notch disposed on the microSD card. A pre-molded switch slot is provided on the molded plastic casing, and an insert-in write protect switch is mounted after molding.
摘要翻译： microSD-SD适配器卡包括具有引线框架结构的基底基板，形成包围引线框架结构的八个microSD接触销的腔室的保护盖，以及形成在保护帽和暴露部分上的热固性塑料外壳基板为适配卡提供标准的SD卡尺寸。后开口便于插入标准microSD卡，由此microSD卡上的八个接触垫与室内的八个microSD接触针接触，以使由microSD卡产生的电信号通过以下方式传输到主机系统：标准SD插座。夹紧销钉设置在腔室内以与设置在microSD卡上的把手接合部接合。在模制塑料外壳上设有一个预先模制的开关槽，并在模制后安装插入式写保护开关。

124. 发明授权

US07687921B2 High density memory device manufacturing using isolated step pads 失效
标题翻译：使用隔离踏板的高密度存储器件制造
公开(公告)号：US07687921B2
公开(公告)日：2010-03-30
申请号：US12115482
申请日：2008-05-05
申请人： Siew S. Hiew , Nan Nan , Abraham C. Ma
发明人： Siew S. Hiew , Nan Nan , Abraham C. Ma
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L21/565 , H01L23/3121 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An electronic device includes multiple IC dies stacked in an offset stacking arrangement on a substrate. Each IC die includes electrically isolated step pads that facilitates transmitting a dedicated signal between a (beginning) substrate bonding pad and a selected (terminal) contact pad of any die by way of short bonding wires that extend up the stack between the electrically isolated step pads. A memory devices includes stacked memory IC die, wherein “shared” signal transmission paths are formed by associated bonding wires that link corresponding contact pads of each memory die, and dedicated select/control signals are transmitted to each memory die by separate transmission paths formed in part by associated electrically isolated step pads. Substrate space overhung by the stack is used for passive components and IC dies. Memory controller die may be mounted on the stack and connected by dedicated transmission paths utilizing the electrically isolated step pads.
摘要翻译：电子设备包括以衬底上的偏移堆叠布置堆叠的多个IC管芯。每个IC芯片包括电隔离的步进焊盘，其有助于通过在电隔离的步进焊盘之间延伸堆叠的短接合导线在（开始）衬底焊盘和任何裸片的选定（端子）接触焊盘之间传输专用信号。存储器件包括堆叠存储器IC管芯，其中“共享”信号传输路径由链接每个存储管芯的相应接触焊盘的相关联的接合线形成，并且专用的选择/控制信号通过形成在部分由相关的电隔离步进垫。用于堆叠的衬底空间被用于无源组件和IC模具。存储器控制器管芯可以安装在堆叠上并且通过利用电隔离的步进焊盘的专用传输路径连接。

125. 发明申请

US20090273096A1 High Density Memory Device Manufacturing Using Isolated Step Pads 失效
标题翻译：使用隔离步进垫的高密度存储器件制造
公开(公告)号：US20090273096A1
公开(公告)日：2009-11-05
申请号：US12115482
申请日：2008-05-05
申请人： Siew S. Hiew , Nan Nan , Abraham C. Ma
发明人： Siew S. Hiew , Nan Nan , Abraham C. Ma
IPC分类号： H01L23/49 , H01L21/56
CPC分类号： H01L21/565 , H01L23/3121 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/92 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/4911 , H01L2224/49175 , H01L2224/73265 , H01L2224/85 , H01L2224/92247 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： An electronic device includes multiple IC dies stacked in an offset stacking arrangement on a substrate. Each IC die includes electrically isolated step pads that facilitates transmitting a dedicated signal between a (beginning) substrate bonding pad and a selected (terminal) contact pad of any die by way of short bonding wires that extend up the stack between the electrically isolated step pads. A memory devices includes stacked memory IC die, wherein “shared” signal transmission paths are formed by associated bonding wires that link corresponding contact pads of each memory die, and dedicated select/control signals are transmitted to each memory die by separate transmission paths formed in part by associated electrically isolated step pads. Substrate space overhung by the stack is used for passive components and IC dies. Memory controller die may be mounted on the stack and connected by dedicated transmission paths utilizing the electrically isolated step pads.
摘要翻译：电子设备包括以衬底上的偏移堆叠布置堆叠的多个IC管芯。每个IC芯片包括电隔离的步进焊盘，其有助于通过在电隔离的步进焊盘之间延伸堆叠的短接合导线在（开始）衬底焊盘和任何裸片的选定（端子）接触焊盘之间传输专用信号。存储器件包括堆叠存储器IC管芯，其中“共享”信号传输路径由链接每个存储管芯的相应接触焊盘的相关联的接合线形成，并且专用的选择/控制信号通过形成在部分由相关的电隔离步进垫。用于堆叠的衬底空间用于无源组件和IC模具。存储器控制器管芯可以安装在堆叠上并且通过利用电隔离的步进焊盘的专用传输路径连接。

126. 发明申请

US20080195817A1 SD Flash Memory Card Manufacturing Using Rigid-Flex PCB 审中-公开
标题翻译：使用刚性PCB的SD闪存卡制造
公开(公告)号：US20080195817A1
公开(公告)日：2008-08-14
申请号：US12106517
申请日：2008-04-21
申请人： Siew S. Hiew , Nan Nan , Paul Hsueh , I-Kang Yu , Abraham C. Ma
发明人： Siew S. Hiew , Nan Nan , Paul Hsueh , I-Kang Yu , Abraham C. Ma
IPC分类号： G06F13/00 , H05K3/20
CPC分类号： H05K3/284 , G06K19/077 , G06K19/07732 , H01L23/49855 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/19041 , H05K1/023 , H05K1/117 , H05K1/189 , H05K3/0052 , H05K2201/10159 , H05K2201/2009 , H05K2203/1316 , Y10T29/49128 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A memory card (e.g., SD or MMC) device including a PCBA in which components are mounted on a “rigid-flex” PCB including at least one rigid PCB section and at least one flexible PCB section, and a housing that includes both a pre-molded upper housing portion and a molded casing. The rigid-flex PCB is mounted into the upper housing portion such that standard metal contacts disposed on an upper surface of the rigid-flex PCB are exposed through openings defined the upper housing portion, and such that the flexible section of the rigid-flex PCB over any contours formed on the inside surface of the upper housing portion. The molded casing is then formed by depositing thermoset plastic over the lower surface of rigid-flex PCB.
摘要翻译：包括PCBA的存储卡（例如，SD或MMC）装置，其中部件安装在包括至少一个刚性PCB部分和至少一个柔性PCB部分的“刚性柔性”PCB上，以及壳体，模制的上壳体部分和模制壳体。刚性柔性PCB被安装到上部壳体部分中，使得设置在刚性 - 柔性PCB的上表面上的标准金属触点通过限定上部壳体部分的开口暴露，并且使得柔性柔性PCB的柔性部分超过形成在上壳体部分的内表面上的任何轮廓。然后通过在刚性柔性PCB的下表面上沉积热固性塑料形成模制套管。

127. 发明授权

US07547218B2 Plug and cap for a universal-serial-bus (USB) device 失效
标题翻译：用于通用串行总线（USB）设备的插头和盖
公开(公告)号：US07547218B2
公开(公告)日：2009-06-16
申请号：US11901604
申请日：2007-09-17
申请人： Siew Sin Hiew , Jim Ni , Abraham C. Ma , David Nguyen
发明人： Siew Sin Hiew , Jim Ni , Abraham C. Ma , David Nguyen
IPC分类号： H01R13/44
CPC分类号： H01R13/6395 , H01R24/62 , Y10T29/49838
摘要： Embodiments of a plug and cap of a Universal-Serial-Bus (USB) device have been presented. In one embodiment, a USB device includes a main body, a piece of string, and a cap. The main body has a printed circuit board assembly (PCBA) and a casing, wherein the PCBA is partially housed in the casing, and the PCBA further includes a USB connector protruding out of the casing at a first end of the casing. The piece of string is coupled to the main body and the cap. The cap is detachably coupled to the first end of the casing of the main body to cover the USB connector, wherein the cap remains indirectly coupled to the casing via the piece of string when the cap is detached from the first end of the casing to expose the USB connector.
摘要翻译：已经提出了通用串行总线（USB）设备的插头和盖的实施例。在一个实施例中，USB设备包括主体，弦线和盖。主体具有印刷电路板组件（PCBA）和壳体，其中PCBA部分地容纳在壳体中，并且PCBA还包括在壳体的第一端处从壳体突出的USB连接器。琴弦连接到主体和帽上。盖可拆卸地联接到主体的壳体的第一端以覆盖USB连接器，其中当帽从壳体的第一端分离以暴露时，盖保持通过弦线间接地联接到壳体 USB连接器。

128. 发明授权

US08452912B2 Flash-memory system with enhanced smart-storage switch and packed meta-data cache for mitigating write amplification by delaying and merging writes until a host read 有权
标题翻译：闪存系统具有增强的智能存储交换机和打包的元数据缓存，用于通过延迟和合并写入来缓解写入，直到主机读取
公开(公告)号：US08452912B2
公开(公告)日：2013-05-28
申请号：US12576216
申请日：2009-10-08
申请人： Charles C. Lee , Frank Yu , Abraham C. Ma
发明人： Charles C. Lee , Frank Yu , Abraham C. Ma
IPC分类号： G06F12/00
CPC分类号： G06F12/0246 , G06F12/0866 , G06F2212/1036 , G06F2212/214 , G06F2212/7203 , G06F2212/7207 , G11C13/0004 , G11C16/102 , G11C19/0808 , G11C2211/5641 , G11C2216/30
摘要： A flash memory solid-state-drive (SSD) has a smart storage switch that reduces write acceleration that occurs when more data is written to flash memory than is received from the host. Page mapping rather than block mapping reduces write acceleration. Host commands are loaded into a Logical-Block-Address (LBA) range FIFO. Entries are sub-divided and portions invalidated when a new command overlaps an older command in the FIFO. Host data is aligned to page boundaries with pre- and post-fetched data filling in to the boundaries. Repeated data patterns are detected and encoded by compressed meta-data codes that are stored in meta-pattern entries in a meta-pattern cache of a meta-pattern flash block. The sector data is not written to flash. The meta-pattern entries are located using a meta-data mapping table. Storing host CRC's for comparison to incoming host data can detect identical data writes that can be skipped, avoiding a write to flash.
摘要翻译：闪存固态驱动器（SSD）具有智能存储交换机，可以减少写入快速写入的速度，而写入速度会比从主机接收到的更多的数据写入闪存。页面映射而不是块映射减少写入加速。主机命令加载到逻辑块地址（LBA）范围FIFO中。当新命令与FIFO中的旧命令重叠时，条目被分割，部分无效。主机数据与页边界对齐，前后获取的数据填充到边界。通过存储在元模式闪存块的元模式高速缓存中的元模式条目中的压缩元数据代码来检测和编码重复的数据模式。扇区数据未写入闪存。使用元数据映射表定位元模式条目。存储主机CRC用于与传入主机数据进行比较可以检测可跳过的相同数据写入，避免写入闪存。

129. 发明授权

US08176238B2 Command queuing smart storage transfer manager for striping data to raw-NAND flash modules 有权
标题翻译：命令排队智能存储传输管理器，用于将数据分配到原始NAND闪存模块
公开(公告)号：US08176238B2
公开(公告)日：2012-05-08
申请号：US13104257
申请日：2011-05-10
申请人： Frank Yu , Charles C. Lee , Abraham C. Ma
发明人： Frank Yu , Charles C. Lee , Abraham C. Ma
IPC分类号： G06F12/00 , G06F13/00 , G06F13/28
CPC分类号： G06F12/0246 , G06F3/061 , G06F3/0659 , G06F3/0688 , G06F12/0607 , G06F2212/7208 , G11C13/0004
摘要： A flash module has raw-NAND flash memory chips accessed over a physical-block address (PBA) bus by a NVM controller. The NVM controller is on the flash module or on a system board for a solid-state disk (SSD). The NVM controller converts logical block addresses (LBA) to physical block addresses (PBA). Data striping and interleaving among multiple channels of the flash modules is controlled at a high level by a smart storage transaction manager, while further interleaving and remapping within a channel may be performed by the NVM controllers. A SDRAM buffer is used by a smart storage switch to cache host data before writing to flash memory. A Q-R pointer table stores quotients and remainders of division of the host address. The remainder points to a location of the host data in the SDRAM. A command queue stores Q, R for host commands.
摘要翻译：闪存模块具有通过NVM控制器通过物理块地址（PBA）总线访问的原始NAND闪存芯片。 NVM控制器位于闪存模块或固态硬盘（SSD）的系统板上。 NVM控制器将逻辑块地址（LBA）转换为物理块地址（PBA）。闪存模块的多个通道之间的数据条带化和交织由智能存储事务管理器控制在高电平，而在信道内的进一步的交织和重新映射可由NVM控制器执行。智能存储交换机使用SDRAM缓冲区，在写入闪存之前缓存主机数据。 Q-R指针表存储主机地址的商和余数。剩余部分指向SDRAM中主机数据的位置。命令队列存储主机命令的Q，R。

130. 发明申请

US20110145489A1 HYBRID STORAGE DEVICE 审中-公开
标题翻译：混合存储设备
公开(公告)号：US20110145489A1
公开(公告)日：2011-06-16
申请号：US13032564
申请日：2011-02-22
申请人： I-Kang Yu , Charles C. Lee , Shimon Chen , Abraham C. Ma
发明人： I-Kang Yu , Charles C. Lee , Shimon Chen , Abraham C. Ma
IPC分类号： G06F12/00
CPC分类号： G06F3/0656 , G06F3/0613 , G06F3/068 , G06F3/0685 , G06F3/0688
摘要： A hybrid storage device comprises both solid-state disk (SDD) and at least one hard disk drive (HDD). The hybrid storage device has at least two operational modes: concatenation and safe. According to one aspect, the total capacity of hybrid storage device is the sum of SSD and at least one HDD in a concatenation or big mode, while the total capacity is the capacity of the HDD in a safe mode.
摘要翻译：混合存储设备包括固态盘（SDD）和至少一个硬盘驱动器（HDD）。混合存储设备具有至少两种操作模式：级联和安全。根据一个方面，混合存储设备的总容量是SSD和连接或大模式中的至少一个HDD的总和，而总容量是HDD在安全模式下的容量。

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