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    • 124. 发明授权
    • Needle alignment verification circuit and method for semiconductor device
    • 针对对准验证电路及半导体器件的方法
    • US07323894B2
    • 2008-01-29
    • US11360827
    • 2006-02-23
    • Jong-Hyun ChoiYoung-Hun Seo
    • Jong-Hyun ChoiYoung-Hun Seo
    • G01R31/02
    • G01R1/06794
    • A needle alignment verification circuit includes a sensor pad, a first transmission line, a control element, a data pad, a second transmission line, and a response element. The sensor pad includes an insulation part and a conduction part. The first transmission line is electrically connected to the conduction part and to the interior of the semiconductor device. The control element asserts the first transmission line at a first logic state, and upon receiving the probe signal at the conduction part, transitions the logic state of the first transmission line to a second logic state. The second transmission line provides a predetermined signal to the data pad. The response element controls the second transmission line so that the second transmission line has the state of a verification result voltage for a misalignment state in response to the second logic state.
    • 针对准验证电路包括传感器焊盘,第一传输线,控制元件,数据焊盘,第二传输线和响应元件。 传感器垫包括绝缘部分和导电部分。 第一传输线电连接到导电部分和半导体器件的内部。 控制元件在第一逻辑状态下使第一传输线断言,并且在接收到导通部分的探测信号时,将第一传输线的逻辑状态转换到第二逻辑状态。 第二传输线向数据焊盘提供预定的信号。 响应元件控制第二传输线,使得第二传输线响应于第二逻辑状态具有用于不对准状态的验证结果电压的状态。
    • 125. 发明申请
    • Apparatus and method for signal bus line layout in semiconductor device
    • 半导体器件中信号总线布线的装置和方法
    • US20070238223A1
    • 2007-10-11
    • US11809593
    • 2007-06-01
    • Chang-Ho LeeJong-Hyun Choi
    • Chang-Ho LeeJong-Hyun Choi
    • H01L21/00
    • H01L23/5286H01L24/06H01L2224/02166H01L2224/05554H01L2924/01004H01L2924/01005H01L2924/01006H01L2924/01014H01L2924/01024H01L2924/01033H01L2924/01068H01L2924/01074H01L2924/14
    • A device and method for layout and fabrication of power supply bus lines in an integrated circuit such as a memory circuit are described. In accordance with the present invention, power bus lines and bonding pads of the circuit are not necessarily formed in both edge regions and center regions of the device. The bonding pads are formed in the region according to the package being used, and the power bus lines are formed in the other region. This is accomplished by forming the bonding pads over landing pads. Landing pads are formed in both the center region and the edge region under the top surface of the device. If the device is to be packaged in an edge pad configuration, the bonding pads are formed over the landing pads in the edge region, and power supply bus lines can be formed over the landing pads in the center region. Similarly, if the device is to be packaged in a center pad configuration, the bonding pads are formed over the landing pads in the center region, and the power supply bus lines can be formed over the landing pads in the edge region. The bonding pads are connected to the landing pads by conductive vias. Because the power bus lines are not formed in the same region as bonding pads, they can occupy a relatively large portion of the region in which they are formed. That is, they can be made much larger than they would be using the conventional approach in which both bonding pads and power bus lines are formed in the same region. As a result, the power noise drawbacks of the conventional approach are eliminated.
    • 描述了诸如存储器电路的集成电路中的电源总线布线和制造的装置和方法。 根据本发明,电路的电源总线线路和接合焊盘不一定形成在器件的两个边缘区域和中心区域中。 接合焊盘形成在根据使用的封装的区域中,并且电力总线线路形成在另一区域中。 这通过在着陆垫上形成接合垫来实现。 着陆垫形成在装置的上表面下方的中心区域和边缘区域中。 如果将该器件封装在边缘焊盘配置中,则焊接区形成在边缘区域的着陆焊盘之上,并且电源总线可以形成在中心区域的着陆焊盘上。 类似地,如果要将器件封装在中心焊盘结构中,则接合焊盘形成在中心区域的着陆焊盘之上,并且电源总线可以形成在边缘区域的着陆焊盘上。 接合焊盘通过导电通孔连接到着陆焊盘。 由于电力总线线路不形成在与接合焊盘相同的区域中,所以它们可以占据其形成区域的较大部分。 也就是说,它们可以比使用在相同区域中形成接合焊盘和电力总线线路的常规方法大得多。 结果,消除了常规方法的功率噪声缺点。
    • 128. 发明申请
    • Circuit and method of boosting voltage for a semiconductor memory device
    • 用于半导体存储器件的升压电压的电路和方法
    • US20070133320A1
    • 2007-06-14
    • US11634599
    • 2006-12-06
    • Young-Sun MinJong-Hyun Choi
    • Young-Sun MinJong-Hyun Choi
    • G11C7/00
    • G11C5/145
    • A voltage boosting circuit of a semiconductor memory device for decreasing power consumption can include a first precharge circuit, a second precharge circuit, a first capacitive element, a second capacitive element and a coupling circuit. The first precharge circuit precharges a first node using a first supply voltage and the second precharge circuit precharges a second node using a second supply voltage. The first capacitive element boosts a voltage level of the first node in response to a first pulse signal and the second capacitive element boosts a voltage level of the second node in response to a second pulse signal. The coupling circuit electrically couples the first node to the second node in response to a boosting enable signal and a self-refresh control signal.
    • 用于降低功耗的半导体存储器件的升压电路可以包括第一预充电电路,第二预充电电路,第一电容元件,第二电容元件和耦合电路。 第一预充电电路使用第一电源电压对第一节点进行预充电,并且第二预充电电路使用第二电源电压预充电第二节点。 第一电容元件响应于第一脉冲信号而升高第一节点的电压电平,并且第二电容元件响应于第二脉冲信号而升高第二节点的电压电平。 响应于升压使能信号和自刷新控制信号,耦合电路将第一节点电耦合到第二节点。
    • 129. 发明申请
    • Circuit and method of driving sub-word lines of a semiconductor memory device
    • 驱动半导体存储器件的子字线的电路和方法
    • US20070133318A1
    • 2007-06-14
    • US11634428
    • 2006-12-06
    • Young-Sun MinJong-Hyun Choi
    • Young-Sun MinJong-Hyun Choi
    • G11C5/14
    • G11C8/08
    • A circuit and method of driving a sub-word line of a semiconductor memory device capable of reducing power consumption is disclosed. The sub-word line driving circuit includes a first transistor, a second transistor and a third transistor. The first transistor pre-charges a boost node to a first voltage in response to a main word line driving signal. The second transistor boosts the boost node to a second voltage in response to a sub-word line driving signal, and provides the sub-word line driving signal to a sub-word line. The third transistor provides the main word line driving signal to the sub-word line in response to a third voltage that has a lower level than a logic “high” state of the sub-word line driving signal.
    • 公开了一种驱动能够降低功耗的半导体存储器件的子字线的电路和方法。 子字线驱动电路包括第一晶体管,第二晶体管和第三晶体管。 第一晶体管响应于主字线驱动信号而将升压节点预充电到第一电压。 第二晶体管响应于子字线驱动信号将升压节点升压到第二电压,并将子字线驱动信号提供给子字线。 第三晶体管响应于具有比子字线驱动信号的逻辑“高”状态低的电平的第三电压,将主字线驱动信号提供给子字线。