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    • 115. 发明授权
    • Metal-insulator-semiconductor device having reduced threshold voltage
and high mobility for high speed/low-voltage operation
    • 金属绝缘体半导体器件具有降低的阈值电压和用于高速/低电压操作的高迁移率
    • US5675172A
    • 1997-10-07
    • US441707
    • 1995-05-15
    • Masafumi MiyamotoTatsuya Ishii
    • Masafumi MiyamotoTatsuya Ishii
    • H01L29/43H01L21/265H01L21/336H01L21/8238H01L29/08H01L29/10H01L29/423H01L29/49H01L29/78H01L29/76H01L29/94H01L31/062
    • H01L29/66575H01L21/823807H01L29/1033H01L29/1083H01L29/66659H01L29/7802H01L29/7838H01L21/2652H01L21/26586H01L29/0847H01L29/1095H01L29/66537
    • A MIS device comprising a pair of first doped layers of a second conductivity type forming source/drain regions in a semiconductor base structure of a first conductivity type, and a gate electrode formed in a region between the first doped layers of the second conductivity type on a gate insulating film formed on the semiconductor base structure having a three-layer structure consisting of a second doped layer of the first conductivity type, a third doped layer of the second conductivity type and a fourth doped layer of the first conductivity type having an impurity concentration higher than that of the semiconductor base structure, which are formed in that order in the direction of depth from the surface of a channel region extending between the source/drain regions, the thickness of the third doped layer is determined so that the third doped layer is depleted by the respective built-in potentials of pn junctions formed by the second doped layer and the third doped layer and by the fourth doped layer and the third doped layer, respectively. Even when the MIS device of this structure is miniaturized, the subthreshold swing can be reduced to a value small enough to enable the lowering of the threshold voltage, the electric field intensity in the interface of the gate insulating film is reduced to enhance the carrier mobility and hence the MIS device is suitable for low-voltage operation.
    • 一种MIS器件,包括在第一导电类型的半导体基底结构中形成源极/漏极区的第二导电类型的一对第一掺杂层和形成在第二导电类型的第一掺杂层之间的区域中的栅电极 形成在具有由第一导电类型的第二掺杂层,第二导电类型的第三掺杂层和具有杂质的第一导电类型的第四掺杂层组成的三层结构的半导体基底结构上的栅绝缘膜 浓度高于半导体基底结构的浓度,其从在源/漏区之间延伸的沟道区的表面的深度方向依次形成,第三掺杂层的厚度被确定为使得第三掺杂 层被由第二掺杂层和第三掺杂层形成的pn结的相应内置电位以及由fo 第二掺杂层和第三掺杂层。 即使当这种结构的MIS器件小型化时,亚阈值摆幅也可以减小到足以使阈值电压降低的值,从而降低栅极绝缘膜的界面中的电场强度,从而提高载流子迁移率 因此MIS器件适用于低电压工作。
    • 117. 发明授权
    • Semiconductor memory device including junction field effect transistor
and capacitor and method of manufacturing the same
    • 包括结场效应晶体管和电容器的半导体存储器件及其制造方法
    • US5243209A
    • 1993-09-07
    • US788396
    • 1991-11-06
    • Tatsuya Ishii
    • Tatsuya Ishii
    • G11C11/404H01L21/82H01L27/10H01L27/108H01L29/808
    • H01L29/8083H01L21/82H01L27/10808H01L27/10823
    • A dynamic random access memory includes a memory cell including a junction field effect transistor and a capacitor. A first conductivity-type semiconductor layer is formed on a main surface of a semiconductor substrate. The semiconductor layer includes a columnar part extending from the main surface of the semiconductor substrate and having a top surface and a sidewall surface. The junction field effect transistor is formed in the columnar part, and the capacitor is formed on the top surface of the columnar part. The junction field effect transistor includes a second conductivity-type impurity region and a gate electrode. The second conductivity-type impurity region is formed on the sidewall surface of the columnar part. The gate electrode is formed to surround the sidewall surface of the columnar part to be electrically in contact with the second conductivity-type impurity, region. The capacitor includes a storage node, a dielectric film, and a cell plate electrode. The storage node is formed to be electrically in contact with the top surface of the columnar part. The dielectric film is formed on the storage node. The cell plate electrode is formed on the dielectric film. It is possible to attain higher degree of integration and higher density of the memory cell without causing variation in the characteristics of the transistor included in the memory cell and without decreasing the noise margin of operation of the semiconductor substrate.
    • 动态随机存取存储器包括具有结型场效应晶体管和电容器的存储单元。 第一导电型半导体层形成在半导体衬底的主表面上。 半导体层包括从半导体衬底的主表面延伸并具有顶表面和侧壁表面的柱状部分。 结型场效应晶体管形成在柱状部分中,电容器形成在柱状部分的顶表面上。 结型场效应晶体管包括第二导电型杂质区和栅电极。 第二导电型杂质区域形成在柱状部分的侧壁表面上。 栅电极被形成为围绕柱状部分的侧壁表面与第二导电型杂质区电接触。 电容器包括存储节点,电介质膜和电池板电极。 存储节点形成为与柱状部件的顶表面电接触。 电介质膜形成在存储节点上。 电池板电极形成在电介质膜上。 可以获得更高的集成度和更高密度的存储单元,而不会引起包括在存储单元中的晶体管的特性的变化,并且不会降低半导体衬底的工作噪声容限。
    • 118. 发明授权
    • Semiconductor memory device with two storage nodes
    • 半导体存储器件具有两个存储节点
    • US5010379A
    • 1991-04-23
    • US369965
    • 1989-06-22
    • Tatsuya Ishii
    • Tatsuya Ishii
    • H01L27/04G11C11/404H01L21/822H01L21/8242H01L27/10H01L27/108
    • H01L27/10829G11C11/404
    • A semiconductor memory device includes a p-type semiconductor substrate (1), a trench (16) formed on the substrate (1), a first region (19) of a capacitor cell plate formed on the side walls and the bottom surface of the trench (16) and formed by an n-type impurity layer, two capacitor storage nodes (2a) having their surfaces covered by capacitor dielectric films (7a, 8a) and formed along the side walls of the trench (16) for facing to each other, a second region (3a) of the cell plate formed of an electrically conductive material, the second region (3a) being interposed between the two storage nodes (2a) and connected to the first region (19) of the cell plate at the bottom surface of the trench (16), and n-channel type field effect transistors (9, 10, 12, 18, 28) each connected to one of the storage nodes (2a) and formed on the substrate (1).
    • 半导体存储器件包括p型半导体衬底(1),形成在衬底(1)上的沟槽(16),形成在侧壁上的电容器单元板的第一区域(19)和 沟槽(16)并由n型杂质层形成,其两个电容器存储节点(2a)的表面被电容器电介质膜(7a,8a)覆盖并且沿着沟槽(16)的侧壁形成,以面对每个 另一方面,由导电材料形成的电池板的第二区域(3a),第二区域(3a)插入在两个存储节点(2a)之间并且连接到电池板的第一区域(19) 沟槽(16)的底表面和分别连接到一个存储节点(2a)并形成在衬底(1)上)的n沟道型场效应晶体管(9,10,12,18,28)。