专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

111. 外观设计

USD646810S1 Light emitting diode lamp 有权
公开(公告)号：USD646810S1
公开(公告)日：2011-10-11
申请号：US29389739
申请日：2011-04-15
申请人： Nobuyoshi Takeuchi , Tsugihiro Matsuda , Masahiro Miki , Hideo Nagai , Takaari Uemoto
设计人： Nobuyoshi Takeuchi , Tsugihiro Matsuda , Masahiro Miki , Hideo Nagai , Takaari Uemoto

112. 发明申请

US20110079795A1 SEMICONDUCTOR LIGHT EMITTING DEVICE, ILLUMINATION MODULE, ILLUMINATION APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING ELEMENT 有权
标题翻译：半导体发光装置，照明模块，照明装置，制造半导体发光装置的方法以及制造半导体发光元件的方法
公开(公告)号：US20110079795A1
公开(公告)日：2011-04-07
申请号：US12967185
申请日：2010-12-14
申请人： Hideo Nagai
发明人： Hideo Nagai
IPC分类号： H01L33/16 , H01L33/42 , H01L33/48 , H01L33/36
CPC分类号： H01L25/0753 , H01L33/0095 , H01L33/20 , H01L33/38 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor light emitting device (10) is provided with a base substrate (12) and three LED chips (14A, 14B, and 14C) disposed on the base substrate (12). Each LED chip (14A, 14B, and 14C) includes a semiconductor multilayer structure (20) and has a rhombus shape with interior angles of approximately 60° and approximately 120° in plan view. Each semiconductor multilayer structure (20) has an HCP single crystal structure and includes a light emission layer (24). The LED chips (14A, 14B, and 14C) are arranged on the base substrate (12) so as to face one another at a vertex forming the larger interior angle in plan view. With this arrangement, the LED chips (14A, 14B, and 14C) as a whole form a substantially regular hexagonal shape.
摘要翻译：半导体发光器件（10）设置有基底（12）和设置在基底（12）上的三个LED芯片（14A，14B和14C）。每个LED芯片（14A，14B和14C）包括半导体多层结构（20），并且在平面图中具有约60°和约120°的内角的菱形。每个半导体多层结构（20）具有HCP单晶结构并且包括发光层（24）。 LED芯片（14A，14B，14C）以平面图形成较大内角的顶点彼此相对配置在基底基板（12）上。利用这种布置，LED芯片（14A，14B和14C）整体形成基本上规则的六边形形状。

113. 发明授权

US07906731B2 Light emitting module, lighting device and display device 有权
标题翻译：发光模块，照明装置和显示装置
公开(公告)号：US07906731B2
公开(公告)日：2011-03-15
申请号：US12612553
申请日：2009-11-04
申请人： Nobuyuki Matsui , Hideo Nagai , Keiji Nishimoto , Toshifumi Ogata
发明人： Nobuyuki Matsui , Hideo Nagai , Keiji Nishimoto , Toshifumi Ogata
IPC分类号： H01L33/00
CPC分类号： F21V29/004 , F21V19/0055 , F21V29/763 , F21Y2105/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K3/0061 , H05K2201/09018 , H05K2201/10106 , Y10S362/80 , H01L2924/00014
摘要： A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.
摘要翻译：照明装置包括散热器70，插座10和LED模块60. LED模块60具有在由绝缘板和金属板构成的金属基底63的顶侧的中心部分中的发光单元62 。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热器70侧突出。 LED模块60在发光单元62的围绕根据插座10的按压单元14T，14L和14D被按压的状态下安装在散热器70上。将发光单元62的环绕压在散热器70确保LED模块60的翘曲的中心部分接触散热器70。

114. 发明授权

US07859002B2 Light-emitting device 有权
标题翻译：发光装置
公开(公告)号：US07859002B2
公开(公告)日：2010-12-28
申请号：US12303458
申请日：2007-08-06
申请人： Hideo Nagai , Masa-aki Suzuki , Tadaaki Ikeda
发明人： Hideo Nagai , Masa-aki Suzuki , Tadaaki Ikeda
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/48091 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A light-emitting device (1) having a base (10) and a light-emitting element (11) placed on the base (10) includes a first sealing material layer (12) covering the light-emitting element (11) and a second sealing material layer (13) surrounding a side surface of the first sealing material layer (12), wherein the refractive index of the first sealing material layer (12) and the refractive index of the second sealing material layer (13) are different from each other. The light-emitting device (1) is capable of controlling a radiation pattern from the light-emitting element (11) by controlling the refractive index of the first sealing material layer (12) and the refractive index of the second sealing material layer (13). This can facilitate the miniaturization and reduction in thickness of the light-emitting device (1), and prevent the decrease in a light output efficiency of the light-emitting device (1).
摘要翻译：具有放置在基座（10）上的基座（10）和发光元件（11）的发光器件（1）包括覆盖发光元件（11）的第一密封材料层（12）围绕所述第一密封材料层（12）的侧表面的第二密封材料层（13），其中所述第一密封材料层（12）的折射率和所述第二密封材料层（13）的折射率不同于彼此。发光装置（1）能够通过控制第一密封材料层（12）的折射率和第二密封材料层（13）的折射率来控制来自发光元件（11）的辐射图案）。这可以促进发光装置（1）的厚度的小型化和减小，并且防止发光装置（1）的光输出效率的降低。

115. 发明授权

US07791091B2 Semiconductor light-emitting device, light-emitting module and lighting unit 有权
标题翻译：半导体发光器件，发光模块和照明单元
公开(公告)号：US07791091B2
公开(公告)日：2010-09-07
申请号：US11720981
申请日：2005-12-07
申请人： Hideo Nagai
发明人： Hideo Nagai
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L24/17 , H01L33/486 , H01L33/62 , H01L33/641 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05666 , H01L2224/05673 , H01L2224/48091 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/15787 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A semiconductor light-emitting device (1) includes a semiconductor multilayer film (11), a base material (12) for supporting the semiconductor multilayer film (11), a first feed terminal (17a), and a second feed terminal (17b). A protruding portion (12c) is formed on the back surface (12b) of the base material (12) that is opposite to the principal surface (12a) facing the semiconductor multilayer film (11). The first and second feed terminals (17a, 17b) are formed in contact with at least one selected from the portions (12d) of the back surface (12b) other than the protruding portion (12c) and the sides (12e) of the base material (12). The end face (121c) of the protruding portion (12c) is insulated electrically from the first and second feed terminals (17a, 17b). With this configuration, the semiconductor light-emitting device can improve the heat dissipation and achieve high integration easily.
摘要翻译：半导体发光器件（1）包括半导体多层膜（11），用于支撑半导体多层膜（11）的基底材料（12），第一馈电端子（17a）和第二馈电端子（17b）。在与所述半导体多层膜（11）相对的与所述主面相对的基材（12）的背面（12b）上形成有突出部（12c）。第一和第二馈电端子（17a，17b）形成为与除了突出部分（12c）之外的后表面（12b）的部分（12d）和基部的侧面（12e）中的至少一个接触材料（12）。突出部分（12c）的端面（121c）与第一和第二馈电端子（17a，17b）电绝缘。利用这种结构，半导体发光装置可以提高散热性，容易实现高集成化。

116. 发明授权

US07728231B2 Light emitting module, lighting device, and display device 有权
标题翻译：发光模块，照明装置和显示装置
公开(公告)号：US07728231B2
公开(公告)日：2010-06-01
申请号：US11577584
申请日：2005-10-24
申请人： Nobuyuki Matsui , Hideo Nagai , Keiji Nishimoto , Toshifumi Ogata
发明人： Nobuyuki Matsui , Hideo Nagai , Keiji Nishimoto , Toshifumi Ogata
IPC分类号： H01L33/00
CPC分类号： F21V29/004 , F21V19/0055 , F21V29/763 , F21Y2105/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/73265 , H05K1/0203 , H05K3/0061 , H05K2201/09018 , H05K2201/10106 , Y10S362/80 , H01L2924/00014
摘要： A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.
摘要翻译：照明装置包括散热器70，插座10和LED模块60. LED模块60具有在由绝缘板和金属板构成的金属基底63的顶侧的中心部分中的发光单元62 。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热器70侧突出。 LED模块60在发光单元62的围绕根据插座10的按压单元14T，14L和14D被按压的状态下安装在散热器70上。将发光单元62的环绕压在散热器70确保LED模块60的翘曲的中心部分接触散热器70。

117. 发明授权

US07683377B2 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same 有权
标题翻译：半导体发光器件及其制造方法以及使用其的照明装置及显示装置
公开(公告)号：US07683377B2
公开(公告)日：2010-03-23
申请号：US10563268
申请日：2004-07-12
申请人： Hideo Nagai
发明人： Hideo Nagai
IPC分类号： H01L27/15
CPC分类号： H01L27/156 , H01L23/16 , H01L25/0753 , H01L33/20 , H01L2224/48091 , H01L2224/73265 , H01L2924/00
摘要： The present invention aims to provide a semiconductor light emitting device (1) that may be firmly attached to a substrate with maintaining excellent light emitting efficiency, and a manufacturing method of the same, and a lighting apparatus and a display apparatus using the same. In order to achieve the above object, the semiconductor light emitting device (1) according to the present invention includes a luminous layer (23), a light transmission layer (10) disposed over a main surface of the luminous layer (23), and having depressions (11) on a surface facing away from the luminous layer (23), and a transmission membrane (70) disposed on the light transmission layer (10) so as to follow contours of the depressions, and light from the luminous layer (23) is irradiated so as to pass through the light transmission layer (10) and the transmission membrane (70).
摘要翻译：本发明的目的在于提供一种能够以保持良好的发光效率而牢固地附着到基板的半导体发光器件（1）及其制造方法，以及使用该半导体发光器件的照明装置和显示装置。为了实现上述目的，根据本发明的半导体发光器件（1）包括发光层（23），设置在发光层（23）的主表面上的透光层（10），以及在背离发光层（23）的表面上具有凹陷（11），以及透光膜（70），其设置在光透射层（10）上以便跟随凹陷的轮廓，以及来自发光层 23）被照射以穿过透光层（10）和透射膜（70）。

118. 发明申请

US20100065861A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20100065861A1
公开(公告)日：2010-03-18
申请号：US12515372
申请日：2008-08-01
申请人： Hideo Nagai
发明人： Hideo Nagai
IPC分类号： H01L33/00
CPC分类号： H01L33/50 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L25/0753 , H01L27/15 , H01L33/22 , H01L33/38 , H01L33/382 , H01L33/42 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device 1 includes a base 2 and a light-emitting element 3 that is disposed on the base 2. The light-emitting element 3 is made up of a plurality of semiconductor layers including a light-emitting layer, and at the same time, is covered with a wavelength converting portion 4 that includes a wavelength converting material. The light-emitting layer emits primary light, and the wavelength converting material absorbs part of the primary light and emits secondary light. The luminance of the primary light emitted from the edge portion of the light extraction surface of the light-emitting device 3 is higher than the luminance of the primary light emitted from the inner region located inside the edge portion, and the ratio of the primary light and the secondary light that are emitted from a light extraction surface 6 of the wavelength converting portion 4 is substantially uniform across the light extraction surface 6 of the wavelength converting portion 4. Thereby, a light color difference across the light extraction surface of the wavelength converting portion that covers the light-emitting element can be reduced further, and it is possible to irradiate an irradiation surface with light of uniform color.
摘要翻译：发光装置1包括基座2和设置在基座2上的发光元件3.发光元件3由包括发光层的多个半导体层构成，并且在同时覆盖有包括波长转换材料的波长转换部分4。发光层发射一次光，并且波长转换材料吸收一次光并发射二次光。从发光装置3的光提取面的边缘部分发射的初级光的亮度高于从位于边缘部分内侧的内部区域发射的一次光的亮度，并且初级光并且从波长转换部分4的光提取表面6发射的次级光在波长转换部分4的光提取表面6上基本上均匀。由此，波长转换的光提取表面上的光色差可以进一步减少覆盖发光元件的部分，并且可以用均匀颜色的光照射照射表面。

119. 发明授权

US07675075B2 Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device 有权
标题翻译：半导体发光元件，发光模块，照明装置，显示元件及半导体发光元件的制造方法
公开(公告)号：US07675075B2
公开(公告)日：2010-03-09
申请号：US10567510
申请日：2004-08-09
申请人： Hideo Nagai
发明人： Hideo Nagai
IPC分类号： H01L29/201 , H01L29/205 , H01L29/207 , H01L29/40 , H01L23/48 , H01L23/52 , H01L21/00 , H01L21/28 , H01L21/3205 , H01L21/44
CPC分类号： H01L33/10 , F21K9/00 , H01L21/568 , H01L24/24 , H01L24/82 , H01L27/156 , H01L33/20 , H01L33/38 , H01L33/382 , H01L33/387 , H01L33/50 , H01L33/505 , H01L33/62 , H01L2224/32225 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2933/0016 , H01L2933/0083 , H01L2924/00
摘要： An LED array chip (2), which is one type of a semiconductor light emitting device, includes an array of LEDs (6), a base substrate (4) supporting the array of the LEDs (6), and a phosphor film (48). The array of LEDs (6) is formed by dividing a multilayer epitaxial structure including a light emitting layer into a plurality of portions. The phosphor film (48) covers an upper surface of the array of the LEDs (6) and a part of every side surface of the array of LEDs (6). Here, the part extends from the upper surface to the light emitting layer.
摘要翻译：作为一种半导体发光器件的LED阵列芯片（2），包括LED阵列（6），支撑LED阵列（6）的基底（4）和荧光体膜（48））。 LED阵列（6）通过将包括发光层的多层外延结构分成多个部分而形成。荧光体膜（48）覆盖LED（6）的阵列的上表面和LED阵列（6）的每个侧表面的一部分。这里，部分从上表面延伸到发光层。

120. 发明申请

US20100038665A1 LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20100038665A1
公开(公告)日：2010-02-18
申请号：US12444832
申请日：2007-10-12
申请人： Kenji Sugiura , Hideo Nagai , Tetsushi Tamura , Kenji Ueda , Kazuyuki Okano
发明人： Kenji Sugiura , Hideo Nagai , Tetsushi Tamura , Kenji Ueda , Kazuyuki Okano
IPC分类号： H01L33/00
CPC分类号： H01L33/508 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A light-emitting device (1) includes a base (10), a light-emitting element (11) placed on the base (10), and a wavelength converting layer (12) that covers the light-emitting element (11). The wavelength converting layer (12) includes a wavelength converting portion (13) that converts a wavelength of light from the light-emitting element (11), and a light guide portion (14) made of a light-transmitting material, and the light guide portion (14) extends from a light-emitting element (11) side to a light extraction side of the wavelength converting layer (12). Consequently, it is possible to provide a light-emitting device that can be miniaturized and reduced in thickness easily and can prevent a decrease in the light extraction efficiency.
摘要翻译：发光器件（1）包括基底（10），放置在基底（10）上的发光元件（11）和覆盖发光元件（11）的波长转换层（12）。波长转换层（12）包括：转换来自发光元件（11）的光的波长的波长转换部（13），以及由透光材料构成的导光部（14）引导部分（14）从发光元件（11）侧延伸到波长转换层（12）的光提取侧。因此，可以容易地提供可以小型化和减小厚度的发光装置，并且可以防止光提取效率的降低。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式