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111. 发明申请

US20110139502A1 WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD 有权
标题翻译：接线板制造方法，半导体器件制造方法及接线板
公开(公告)号：US20110139502A1
公开(公告)日：2011-06-16
申请号：US13034083
申请日：2011-02-24
申请人： Kazuhiro Kobayashi , Junichi Nakamura , Kentaro Kaneko
发明人： Kazuhiro Kobayashi , Junichi Nakamura , Kentaro Kaneko
IPC分类号： H05K1/11
CPC分类号： H01L21/6835 , H01L21/4853 , H01L21/4857 , H01L23/49816 , H01L23/49827 , H01L24/16 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2221/68345 , H01L2224/13099 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/48227 , H01L2224/8121 , H01L2224/81815 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01088 , H01L2924/014 , H01L2924/15174 , H01L2924/15311 , H01L2924/351 , H05K1/113 , H05K3/205 , H05K3/28 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2201/0376 , H05K2201/09563 , H05K2201/2072 , Y10T29/49156 , Y10T29/49165 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip-chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are arranged, and has a structure in which insulating layers of a first layer 122, a second layer 124, a third layer 126 and a fourth layer 128 are provided. The first layer 122 has a first insulating layer 121 and a second insulating layer 123. A protruded portion 132 which is protruded in a radial direction (a circumferential direction) from an outer periphery at one surface side of a first electrode pad 130 is formed on a whole periphery over a boundary surface between the first insulating layer 121 and the second insulating layer 123.
摘要翻译：半导体器件100具有半导体芯片110被倒装安装在布线板120上的结构。布线板120具有多层结构，其中布置有多个布线层和多个绝缘层，并且具有提供第一层122，第二层124，第三层126和第四层128的绝缘层的结构。第一层122具有第一绝缘层121和第二绝缘层123.在第一电极焊盘130的一个表面侧的外周沿径向（周向）突出的突出部132形成在在第一绝缘层121和第二绝缘层123之间的边界表面上的整个外围。

112. 发明授权

US07934714B2 Sheet post-processing apparatus, image forming apparatus, and image forming system 有权
标题翻译：片材后处理装置，图像形成装置和图像形成系统
公开(公告)号：US07934714B2
公开(公告)日：2011-05-03
申请号：US12216481
申请日：2008-07-07
申请人： Ichiro Ichihashi , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Naohiro Kikkawa , Kazuhiro Kobayashi , Tomohiro Furuhashi , Makoto Hidaka , Hitoshi Hattori , Junichi Tokita , Akira Kunieda , Hiroshi Maeda , Tomoichi Nomura
发明人： Ichiro Ichihashi , Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Naohiro Kikkawa , Kazuhiro Kobayashi , Tomohiro Furuhashi , Makoto Hidaka , Hitoshi Hattori , Junichi Tokita , Akira Kunieda , Hiroshi Maeda , Tomoichi Nomura
IPC分类号： B65H37/04
CPC分类号： B65H31/3081 , B65H9/101 , B65H2301/4213 , B65H2301/42142 , B65H2301/42266 , B65H2404/232 , B65H2513/51 , B65H2801/27 , G03G15/6547 , B65H2220/02
摘要： A sheet post-processing apparatus includes a sheet stacking unit, a moving member, and a discharging member. The moving member moves up the pile stacked on the sheet stacking unit to one of a plurality of scooping positions, and the discharging member receives the pile from the moving member at the one of the scooping positions and scoops up the pile by supporting a bottom edge of the pile for discharging the pile out of the sheet stacking unit.
摘要翻译：片材后处理装置包括片材堆积单元，移动构件和排出构件。移动构件将堆叠在片材堆积单元上的绒头向上移动到多个舀取位置中的一个，并且排出构件在一个舀取位置处从移动构件接收堆垛，并通过支撑底部边缘用于将堆放出纸堆叠单元的堆。

113. 发明授权

US07918017B2 Electronic component taking out apparatus 有权
标题翻译：电子部件取出装置
公开(公告)号：US07918017B2
公开(公告)日：2011-04-05
申请号：US12439566
申请日：2007-08-28
申请人： Kazuhiro Kobayashi
发明人： Kazuhiro Kobayashi
IPC分类号： H05K3/30 , G01B11/14
CPC分类号： H05K13/021 , H01L21/67144 , H01L21/681 , Y10T29/49131 , Y10T29/53052 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).
摘要翻译：识别并识别预先标记的多个参考电子部件（M1，M2），并且位于要取出的电子部件附近的多个参考电子部件（M1，M2）的位置（2a）并且使用存储在存储装置（11f）中的晶片映射文件（MF）中的分量排列信息来计算待取出的电子部件的位置（2a）。

114. 发明申请

US20110064541A1 Spine formation device, post-processing apparatus, and bookbinding system 有权
标题翻译：脊柱形成装置，后处理装置和装订系统
公开(公告)号：US20110064541A1
公开(公告)日：2011-03-17
申请号：US12805721
申请日：2010-08-17
申请人： Naohiro Kikkawa , Nobuyoshi Suzuki , Shinji Asami , Kazuhiro Kobayashi , Tomohiro Furuhashi , Kiichiroh Gotoh
发明人： Naohiro Kikkawa , Nobuyoshi Suzuki , Shinji Asami , Kazuhiro Kobayashi , Tomohiro Furuhashi , Kiichiroh Gotoh
IPC分类号： B42C99/00 , B42C1/00 , B41L43/12 , B65H39/00
CPC分类号： B65H45/18 , B65H2301/51232 , B65H2701/13212 , B65H2701/1829 , G03G15/6544 , G03G2215/00936
摘要： An spine formation device includes a sheet conveyer, a contact member including a first row of grooves provided in a contact surface thereof to house a projection projecting from a folded portion of a bundle of folded sheets, a driving unit to move the contact member, first and second sandwiching units to squeeze the bundle, a discharge unit, and a controller. The first row of grooves extends in parallel to the folded portion of the bundle and includes at least a first pair of grooves inclined in different directions with an interval therebetween varying in size with location of the grooves in a first direction perpendicular to a sheet conveyance direction. The contact member is moved to change the size of interval between the first pair of grooves at a position aligned with the projection projecting from the folded portion of the bundle of folded sheets.
摘要翻译：一种脊柱形成装置，包括：片材输送器;接触构件，包括设置在其接触表面中的第一排槽，用于容纳从折叠片折叠部折叠的突起;第一驱动单元，用于使接触构件移动以及第二夹持单元来挤压束，放电单元和控制器。所述第一排凹槽平行于所述束的折叠部分延伸，并且至少包括在不同方向上倾斜的第一对凹槽，其间隔处于与所述凹槽的位置垂直于薄片输送方向的第一方向上的位置变化。移动接触构件以在与折叠的片材折叠部的折叠部分突出的突出部对准的位置处改变第一对槽之间的间隔尺寸。

115. 发明申请

US20100220183A1 COMPONENT PLACING APPARATUS 有权
标题翻译：组件放置设备
公开(公告)号：US20100220183A1
公开(公告)日：2010-09-02
申请号：US12666853
申请日：2008-05-15
申请人： Shinya Yoro , Kazuhiro Kobayashi , Yasuhiro Suzuki , Yasunori Naitoh , Yasuyoshi Hongashi
发明人： Shinya Yoro , Kazuhiro Kobayashi , Yasuhiro Suzuki , Yasunori Naitoh , Yasuyoshi Hongashi
IPC分类号： H04N7/18
CPC分类号： H01L21/67144 , H01L21/681
摘要： [Problems] To provide a component placing apparatus capable of effectively preventing the occurrence of a suction error by appropriately adjusting a displacement between respective coordinate systems of a placing head and imaging device while efficiently performing suction position recognition using the imaging device that is movable independently of the placing head.[Means for Solving the Problems] A component mounting apparatus (1) includes a placing head (4) that transports a chip component (6) supplied from a component supply portion (5) by sucking the chip component (6), and a suction position recognition camera (32) that is provided to be movable independently of the placing head (4) and takes an image of the chip component (6) before the placing head (4) sucks the chip component (6) from the component supply portion (5). A control unit (40) that controls an operation of the component mounting apparatus (1) checks a correlation of the respective coordinate systems of the placing head (4) and the suction position recognition camera (32) at predetermined timing and corrects an amount of movement when the placing head (4) accesses the chip component (6) in the component supply portion (5) on the basis of this correlation.
摘要翻译：本发明提供一种能够通过适当地调整放置头和成像装置的各坐标系之间的位移而有效地防止吸引误差的发生的部件放置装置，同时使用能够独立于放置头。（解决问题的方案）一种部件安装装置（1），包括：放置头（4），其通过吸取芯片部件（6）来输送从部件供给部（5）供给的芯片部件（6）位置识别摄像机（32），其被设置为能够独立于所述放置头（4）移动，并且在所述放置头（4）从所述部件供给部分（4）吸取所述芯片部件（6）之前拍摄所述芯片部件（6）的图像，（5）。控制部件安装装置（1）的操作的控制单元（40）在预定定时检查放置头（4）和抽吸位置识别摄像机（32）的各坐标系的相关性，并校正基于该相关性，放置头（4）进入部件供给部（5）中的芯片部件（6）时的移动。

116. 发明授权

US07764804B2 Panel-typed loud speaker and an exciter therefor 失效
标题翻译：面板式扬声器及其激励器
公开(公告)号：US07764804B2
公开(公告)日：2010-07-27
申请号：US11514652
申请日：2006-09-01
申请人： Yoshizumi Ohta , Kazuhiro Kobayashi
发明人： Yoshizumi Ohta , Kazuhiro Kobayashi
IPC分类号： H04R25/00
CPC分类号： H04R17/00 , H04R7/045
摘要： An exciter for a panel-type loud speaker comprises a bimorph and a bimorph holding member. The bimorph comprises a plate member and a pair of piezoelectric ceramic layers, each formed on the opposite sides of the plate member. The bimorph holding member is holds one end of the bimorph and comprises a bimorph end holding portion for holding the one end of the bimorph, which comprises a three-layer embedded section embedding the pair of piezoelectric ceramic layers and the plate member sandwiched therebetween at the one end of the bimorph, and an extension embedded section in which an extension of the plate member is embedded, and a mounting protrusion protruding from the bimorph end holding portion, wherein a distal end of the mounting protrusion is connected to the diaphragm so that the bimorph is disposed on the diaphragm with a space interposed between the bimorph and the diaphragm.
摘要翻译：用于面板式扬声器的激励器包括双压电晶片和双压电晶片保持构件。双压电晶片包括板构件和一对压电陶瓷层，每个压电陶瓷层形成在板构件的相对侧上。双压电晶片保持构件保持双压电晶片的一端，并且包括用于保持双压电晶片的一端的双压电晶片端部保持部分，其包括嵌入一对压电陶瓷层的三层嵌入部分和夹在其间的板构件双压电晶片的一端和嵌入板构件的延伸部的延伸嵌入部分和从双压电晶片端部保持部突出的安装突起，其中安装突起的远端连接到隔膜，使得双压电晶片设置在隔膜上，插入在双压电晶片和隔膜之间的空间。

117. 发明申请

US20100083488A1 ELECTRONIC COMPONENT TAKING OUT APPARATUS, SURFACE MOUNTING APPARATUS AND METHOD FOR TAKING OUT ELECTRONIC COMPONENT 有权
标题翻译：采用电子元件的电子元件，表面安装装置和采用电子元件的方法
公开(公告)号：US20100083488A1
公开(公告)日：2010-04-08
申请号：US12439566
申请日：2007-08-28
申请人： Kazuhiro Kobayashi
发明人： Kazuhiro Kobayashi
IPC分类号： B23P19/00
CPC分类号： H05K13/021 , H01L21/67144 , H01L21/681 , Y10T29/49131 , Y10T29/53052 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A plurality of reference electronic components (M1, M2) marked in advance are identified and recognized, and the positions of the plurality of the reference electronic components (M1, M2) positioned in the vicinity of an electronic component to be taken out (2a) and component arrangement information in a wafer mapping file (MF) stored in a storage device (11f) are used to calculate the position of the electronic component to be taken out (2a).
摘要翻译：识别并识别预先标记的多个参考电子部件（M1，M2），并且位于要取出的电子部件附近的多个参考电子部件（M1，M2）的位置（2a）并且使用存储在存储装置（11f）中的晶片映射文件（MF）中的分量排列信息来计算待取出的电子部件的位置（2a）。

118. 发明授权

US07690633B2 Sheet processing apparatus and image forming apparatus including stapling and folding mechanism 有权
标题翻译：片材处理装置和包括装订和折叠机构的图像形成装置
公开(公告)号：US07690633B2
公开(公告)日：2010-04-06
申请号：US11635043
申请日：2006-12-07
申请人： Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Shohichi Satoh , Akira Kunieda , Tomoichi Nomura , Hiroshi Maeda , Kazuhiro Kobayashi
发明人： Masahiro Tamura , Nobuyoshi Suzuki , Shuuya Nagasako , Shohichi Satoh , Akira Kunieda , Tomoichi Nomura , Hiroshi Maeda , Kazuhiro Kobayashi
IPC分类号： B65H37/04
CPC分类号： B41L43/02 , B41L43/12 , B42C1/125 , B65H37/04 , B65H45/18 , B65H2801/09 , G03G15/6582
摘要： A sheet processing apparatus may include a conveyance path and a tray. The conveyance path may convey sheets. The tray may receive the sheets conveyed from the conveyance path. The tray may include a stapler and a folding member. The stapler may staple the sheets. The folding member may fold the stapled sheets and may be provided upstream from the stapler relative to a sheet conveyance direction.
摘要翻译：片材处理设备可以包括输送路径和托盘。传送路径可以传送片材。托盘可以接收从输送路径输送的纸张。托盘可以包括订书机和折叠构件。订书机可以装订纸张。折叠构件可以折叠装订的片材并且可以相对于片材传送方向设置在订书机的上游。

119. 发明申请

US20100065322A1 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20100065322A1
公开(公告)日：2010-03-18
申请号：US12557847
申请日：2009-09-11
申请人： Michiro Ogawa , Kazuhiro Kobayashi , Kentaro Kaneko
发明人： Michiro Ogawa , Kazuhiro Kobayashi , Kentaro Kaneko
IPC分类号： H05K1/02 , B32B38/00
CPC分类号： H05K3/188 , H01L21/563 , H01L21/568 , H01L23/49816 , H01L23/49822 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81385 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/12042 , H01L2924/15311 , H05K1/0313 , H05K1/09 , H05K1/113 , H05K3/205 , H05K3/244 , H05K3/282 , H05K3/383 , H05K3/4682 , H05K2201/09472 , H05K2201/09563 , H05K2203/0361 , Y10T29/4916 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed.
摘要翻译：布线板包括从最外绝缘层的开口部分露出的焊盘。焊盘包括：第一金属层，其表面从布线板露出; 第二金属层，设置在第一金属层上，由有效防止基板内的通孔内的金属扩散入第一金属层的材料形成; 以及设置在第二金属层和通孔之间的第三金属层，并且由比第二金属层更难被氧化的材料形成。第三金属层的厚度相对较厚，优选选择为第二金属层的厚度的三倍以上。第三金属层的侧表面和要连接通孔的第三金属层的表面被粗糙化。

120. 发明申请

US20100032196A1 MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：多层接线板，半导体封装及其制造方法
公开(公告)号：US20100032196A1
公开(公告)日：2010-02-11
申请号：US12537391
申请日：2009-08-07
申请人： Kentaro KANEKO , Kazuhiro Kobayashi , Yoshiki Okushima , Kotaro Kodani
发明人： Kentaro KANEKO , Kazuhiro Kobayashi , Yoshiki Okushima , Kotaro Kodani
IPC分类号： H05K1/16 , H05K1/11 , B32B37/00
CPC分类号： H05K1/113 , B32B37/02 , B32B2457/08 , H01L21/4846 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L24/02 , H01L24/16 , H01L2221/68345 , H01L2224/0401 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H05K3/20 , H05K3/421 , H05K3/4644 , H05K3/4682 , H05K2201/037 , H05K2201/09527 , H05K2201/0979 , H05K2201/09981 , Y10T156/10 , H01L2924/00012 , H01L2924/00
摘要： In a multilayer wiring board having a wiring layer, a pad, an insulating layer provided between the wiring layer and the pad, and a plurality of connecting vias provided on the insulating layer and connecting the wiring layer to the pad, the connecting vias are provided on a peripheral edge of the pad.
摘要翻译：在具有布线层，焊盘，设置在布线层和焊盘之间的绝缘层以及设置在绝缘层上并将布线层连接到焊盘的多个连接通孔的多层布线板中，提供连接通孔在垫的外围边缘。

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