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111. 发明授权

US08919143B2 Air-cooling wall with slidable heat exchangers 有权
标题翻译：具有滑动式热交换器的空气冷却壁
公开(公告)号：US08919143B2
公开(公告)日：2014-12-30
申请号：US13115390
申请日：2011-05-25
申请人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
发明人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
IPC分类号： F28D11/00 , F25D23/12 , H05K7/20
CPC分类号： H05K7/2079
摘要： An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).
摘要翻译：提供了一种空气冷却装置，其包括通过数据中心的电子机架的冷却空气的冷却壁。空气冷却壁与电子机架的空气入口侧或空气出口侧分开设置并且与空气出口侧分开设置，并且包括与电子机架分离设置的壁板支撑结构，支撑一个或多个可滑动的墙板。可滑动壁板包括可滑动地支撑并设置成与电子机架的空气出口或空气入口侧间隔开的空气 - 液体热交换器。热交换器从穿过热交换器的空气中提取热量，并且可以在支撑结构内沿横向于穿过机架的气流方向的方向滑动。通过支撑结构的热交换器的可滑动支撑件便于进入电子机架的空气出口或空气入口侧。

112. 发明授权

US08591625B2 Server rack front door with contamination filter and sensor 有权
标题翻译：服务器机柜前门，带有污染过滤器和传感器
公开(公告)号：US08591625B2
公开(公告)日：2013-11-26
申请号：US13295078
申请日：2011-11-13
申请人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
发明人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
IPC分类号： B01D46/46
CPC分类号： B01D46/10 , B01D46/103 , B01D2279/45
摘要： An apparatus, system, and method for preventing server contamination. The system includes a server rack and a contamination filter secured to the server rack. The contamination filter may be configured to filter particulate substances and/or chemical substances from air. The system may include a reaction coupon configured to indicate the presence of particulate substances and/or chemical substances in the air.
摘要翻译：一种用于防止服务器污染的设备，系统和方法。该系统包括一个服务器机架和一个固定在服务器机架上的污染过滤器。污染过滤器可以被配置为从空气中过滤颗粒物质和/或化学物质。该系统可以包括配置为指示空气中颗粒状物质和/或化学物质的存在的反应试剂。

113. 发明授权

US08493738B2 Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效
标题翻译：冷却电子系统，散热器将电子卡耦合到冷轨
公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内或从插座中取出卡。液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

114. 发明授权

US08322029B2 Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof 失效
标题翻译：导热复合材料界面，使用其的冷却电子组件及其制造方法
公开(公告)号：US08322029B2
公开(公告)日：2012-12-04
申请号：US13087678
申请日：2011-04-15
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Keith F. Fogel , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Keith F. Fogel , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K3/20 , F28F7/00
CPC分类号： H01L23/3677 , H01L2224/78301 , Y10T29/49128 , Y10T29/4935 , H01L2924/00014
摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.
摘要翻译：提供了复合界面和制造方法，用于将冷却组件连接到电子设备。界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。至少一些线部分地位于较高热通量的第一区域上，并且部分地延伸在较低热通量的第二区域上，其中第一和第二区域是要冷却的表面的不同区域。这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

115. 发明申请

US20120254400A1 SYSTEM TO IMPROVE OPERATION OF A DATA CENTER WITH HETEROGENEOUS COMPUTING CLOUDS 有权
标题翻译：改进具有异质计算云的数据中心的操作的系统
公开(公告)号：US20120254400A1
公开(公告)日：2012-10-04
申请号：US13077578
申请日：2011-03-31
申请人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
IPC分类号： G06F15/173
CPC分类号： G06F9/5094 , Y02D10/22
摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.
摘要翻译：改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。

116. 发明授权

US08230906B2 Dual-chamber fluid pump for a multi-fluid electronics cooling system and method 有权
标题翻译：双腔流体泵用于多流体电子冷却系统和方法
公开(公告)号：US08230906B2
公开(公告)日：2012-07-31
申请号：US12850104
申请日：2010-08-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H05K7/20218
摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.
摘要翻译：为多流体电子冷却系统和方法提供双室流体泵。泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸第一流体冷却剂进入第一泵送室。

117. 发明授权

US08051897B2 Redundant assembly for a liquid and air cooled module 有权
标题翻译：液体和空气冷却模块的冗余组件
公开(公告)号：US08051897B2
公开(公告)日：2011-11-08
申请号：US11290899
申请日：2005-11-30
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28F7/00 , H05K7/20 , H05K5/00
CPC分类号： H05K7/20772
摘要： A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.
摘要翻译：提供了一种用于空气和液体冷却模块的冗余组件。冗余冷却组件包括空气和液体冷却模块，其具有与附接辅助抽屉热连通的冷板。辅助抽屉装有一个热交换器，一个带有管道的液体泵，使得热交换器，带管道的液体泵和冷板形成一个封闭的液体冷却回路。辅助抽屉还容纳空气移动装置，使得空气可以容易地通过空气移动装置和热交换器以提供空气冷却。在本发明的一个实施例中，在泵或空气移动装置或两者都遇到故障的情况下，翅片设置在冷板上以提供冷却。在替代实施例中，多个泵和/或多个空气移动装置可以使用或不使用冷板翅片来提供冗余。

118. 发明申请

US20110056675A1 APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) 审中-公开
标题翻译：通过液体冷却电子架（S）调节冷却剂流动阻力的装置和方法
公开(公告)号：US20110056675A1
公开(公告)日：2011-03-10
申请号：US12556040
申请日：2009-09-09
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
IPC分类号： G05D23/00 , F28F13/00
CPC分类号： H05K7/20709 , H05K7/20272 , H05K7/20281 , H05K7/20736 , H05K7/20763 , H05K7/2079
摘要： Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.
摘要翻译：提出了通过一个或多个液冷电子机架来调节冷却剂流动阻力的装置和方法。流量限制器与热交换组件的多个热交换管部分相关联地使用，或者与供给多个热交换组件的多个冷却剂供应管线或冷却剂返回管路相关联地使用。与相应的热交换管部分（或相应的热交换组件）相关联的流量限制器设置在管部分（或热交换组件）的冷却剂通道入口或冷却剂通道出口处。这些流量限制器通过热交换管部分或通过热交换组件来调节冷却剂流动阻力，以通过调整冷却剂流量来增强管部分内部或通过热交换组件的整体热传递。在一个实施例中，流量限制器定制跨越多个热交换管部分或跨多个热交换组件的冷却剂流量分配差。

119. 发明授权

US07731079B2 Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled 失效
标题翻译：冷却装置及其制造方法，其中在要冷却的表面上原位形成冷板
公开(公告)号：US07731079B2
公开(公告)日：2010-06-08
申请号：US12143289
申请日：2008-06-20
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Bruce K. Furman , Madhusudan K. Iyengar , Paul A. Lauro , Roger R. Schmidt , Da-Yuan Shih , Robert E. Simons
IPC分类号： B23K31/02
CPC分类号： H01L23/4735 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。制造方法包括：获得焊料材料; 将焊料材料设置在要冷却的表面上; 回流和成形设置在待冷却表面上的焊料材料，以将焊料材料构成为具有从其延伸的多个翅片的基底。除了在待冷却的表面上原位配置，基底同时冶金结合到待冷却的表面上。构造为具有从其延伸的多个翅片的基底的焊料材料是通过其被冶金结合到要冷却的表面热连接到要冷却的表面的单个整体结构。

120. 发明授权

US07641101B2 Method of assembling a cooling system for a multi-component electronics system 失效
标题翻译：组装多组件电子系统的冷却系统的方法
公开(公告)号：US07641101B2
公开(公告)日：2010-01-05
申请号：US11539907
申请日：2006-10-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/20772 , H05K7/20009 , Y10T29/4935 , Y10T29/49359 , Y10T29/49895
摘要： A cooling system assembly method including: providing a support fixture having a multi-level support surface and multiple positioning dowels extending therefrom; positioning multiple liquid-cooled cold plates on the support surface employing the multiple dowels, the dowels providing relative positioning and alignment of the cold plates for facilitating subsequent coupling thereof to electronic components to be cooled; sealing multiple coolant-carrying tubes in fluid communication with the cold plates; and sealing a header subassembly to the coolant-carrying tubes to provide an assembled liquid-based cooling system. In operation, the support fixture facilitates shipping of the assembled cooling system by maintaining the components in fixed relation. A transfer fixture is employed in removing the cooling system from the support fixture and placing the cooling system in engagement with the electronics system. The transfer fixture includes multiple clips engaging and holding components of cooling system in fixed relation when removed from the support fixture.
摘要翻译：一种冷却系统组装方法，包括：提供具有多级支撑表面的支撑夹具和从其延伸的多个定位销; 使用多个销钉将多个液冷冷板定位在支撑表面上，该销钉提供冷板的相对定位和对准，以便于其随后与要冷却的电子部件的耦合; 密封与冷板流体连通的多个冷却剂供给管; 并将集管组件密封到冷却剂供给管以提供组装的基于液体的冷却系统。在操作中，支撑夹具有助于通过将部件保持固定关系来运输组装的冷却系统。使用转移夹具来从支撑固定装置移除冷却系统并将冷却系统放置在与电子系统接合的位置。转移夹具包括多个夹具，当从支撑固定装置移除时，将固定关系的冷却系统的部件接合并保持。

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