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101. 发明授权

US08503061B2 Electro-optic rearview mirror assembly for vehicle 有权
标题翻译：电动车后视镜组件
公开(公告)号：US08503061B2
公开(公告)日：2013-08-06
申请号：US13262091
申请日：2010-03-30
申请人： John T. Uken , Michael J. Baur , Ian A. McCabe , Hamid Habibi
发明人： John T. Uken , Michael J. Baur , Ian A. McCabe , Hamid Habibi
IPC分类号： G02F1/153 , G02B7/182
CPC分类号： B60R16/0215 , B60R1/04 , B60R1/088 , G02F1/133553 , G02F1/153 , G02F1/157 , Y10T29/49162 , Y10T29/49169
摘要： A reflective element assembly for a vehicular mirror assembly includes a front substrate, a rear substrate, an electro-optic medium disposed between the front and rear substrates and a transmission-reducing thin film coating established at the fourth surface of the rear substrate. A window is established through the transmission-reducing thin film coating and is substantially devoid of the thin film coating at a location where a sensor is disposed behind the reflective element and having a field of view through the reflective element and through the window. A portion of the transmission-reducing thin film coating at and around the window locally varies in physical thickness, with a minimum physical thickness of the thin film coating being closest to the window and with the physical thickness of the thin film coating generally increasing to a generally maximum physical thickness of the thin film coating at a distance from the window.
摘要翻译：用于车辆用反射镜组件的反射元件组件包括前基板，后基板，设置在前基板和后基板之间的电光介质和在后基板的第四表面处建立的减透薄膜涂层。通过透射率降低薄膜涂层建立窗口，并且在传感器设置在反射元件后面并具有通过反射元件和通过窗口的视场的位置上基本上没有薄膜涂层。在窗口处和周围的透射率降低薄膜涂层的一部分局部地在物理厚度上变化，薄膜涂层的最小物理厚度最接近窗口，并且薄膜涂层的物理厚度通常增加到通常距离窗户一定距离的薄膜涂层的最大物理厚度。

102. 发明授权

US08493739B2 Lightweight audio system for automotive applications and method 有权
公开(公告)号：US08493739B2
公开(公告)日：2013-07-23
申请号：US13208635
申请日：2011-08-12
申请人： Chris R. Snider , Vineet Gupta , Joseph K. Huntzinger , Michael G. Coady , Curtis Allen Stapert , Kevin Earl Meyer , Timothy D. Garner , Allen E. Oberlin
发明人： Chris R. Snider , Vineet Gupta , Joseph K. Huntzinger , Michael G. Coady , Curtis Allen Stapert , Kevin Earl Meyer , Timothy D. Garner , Allen E. Oberlin
IPC分类号： H05K7/20
CPC分类号： H05K9/0007 , B29C59/16 , B60R11/02 , G06F11/00 , H04B1/082 , H04R1/02 , H05K1/0215 , H05K1/141 , H05K5/0217 , H05K5/0221 , H05K5/0226 , H05K7/20409 , H05K7/20418 , H05K7/20436 , H05K9/0047 , H05K9/0079 , H05K9/0081 , H05K13/00 , H05K2201/09081 , H05K2201/10386 , H05K2201/10446 , Y10T16/547 , Y10T16/5476 , Y10T29/49002 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49169 , Y10T29/49172 , Y10T29/4957 , Y10T29/49826 , Y10T29/49861 , Y10T29/5313 , Y10T74/20396 , Y10T403/70 , Y10T403/77 , Y10T428/24289
摘要： A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

103. 发明申请

US20130181356A1 MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES 有权
公开(公告)号：US20130181356A1
公开(公告)日：2013-07-18
申请号：US13675523
申请日：2012-11-13
申请人： MICRON TECHNOLOGY, INC.
发明人： Teck Kheng Lee
IPC分类号： H01L21/56 , H01L23/538
CPC分类号： H01L23/5226 , H01L21/56 , H01L21/561 , H01L23/3128 , H01L23/481 , H01L23/5384 , H01L24/19 , H01L24/83 , H01L24/97 , H01L2224/82039 , H01L2224/82047 , H01L2224/83192 , H01L2224/8385 , H01L2224/92144 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01R43/16 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , H01L2224/82 , H01L2924/00
摘要： Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate.

104. 发明申请

US20130168374A1 METHOD AND DEVICE FOR CONTROLLING CURRENT FLOW THROUGH A WELDING CLAMP 审中-公开
标题翻译：用于通过焊接夹具控制电流的方法和装置
公开(公告)号：US20130168374A1
公开(公告)日：2013-07-04
申请号：US13339504
申请日：2011-12-29
申请人： Mark R. Christopher , Thomas Don Lahti , Jeffery Ray Ihde , Gary A. Thyssen , Michael Todd Klegin , Timothy Jay Reitmeyer
发明人： Mark R. Christopher , Thomas Don Lahti , Jeffery Ray Ihde , Gary A. Thyssen , Michael Todd Klegin , Timothy Jay Reitmeyer
IPC分类号： B23K9/32 , B23K9/00 , H01R43/00 , B21J13/08
CPC分类号： B23K9/321 , B23K37/006 , H01R11/24 , Y10T29/49169
摘要： A method and device for controlling current flow through a welding clamp are provided. One welding clamp includes a first contact piece configured to contact a workpiece and to provide a first current path that limits current flow. The welding clamp also includes a second contact piece configured to contact the workpiece and to provide a second current path. When the welding clamp is being clamped to the workpiece, the first contact piece is configured to contact the workpiece prior to the second contact piece. In addition, the welding clamp is configured so that current flows through the first current path prior to flowing through the second current path when the welding clamp is being clamped to the workpiece.
摘要翻译：提供了一种用于控制通过焊接夹具的电流的方法和装置。一个焊接夹具包括构造成接触工件并提供限制电流流动的第一电流路径的第一接触件。焊接夹具还包括构造成接触工件并提供第二电流路径的第二接触件。当焊钳被夹紧在工件上时，第一接触件构造成在第二接触件之前接触工件。另外，焊接夹具被构造成使得当焊接夹具被夹持到工件时，电流在流过第二电流路径之前流过第一电流路径。

105. 发明授权

US08459611B2 System for the simultaneous introduction of two items into a conduit 有权
公开(公告)号：US08459611B2
公开(公告)日：2013-06-11
申请号：US12214093
申请日：2008-06-17
申请人： Jerry L. Allen
发明人： Jerry L. Allen
IPC分类号： B63B35/03 , B65H59/00 , E21C29/16 , H02G1/08 , H01R43/00
CPC分类号： H02G1/086 , Y10T29/49117 , Y10T29/49123 , Y10T29/49169 , Y10T29/49194 , Y10T29/532
摘要： A system (10) for simultaneously introducing a cable (11) and another item (21) into a conduit (12) includes a pushing machine (13) and an air blower (15) which introduces the cable (11) into the conduit (12). The conduit (12) is split near the pushing machine (13) so that the item (21) may be attached to the cable (11) by means of an attachment device (25) carried by a bullet head (23) at the leading end of the cable (11). Alternatively, a projectible (35) may be attached to the leading end of the cable (11) and the item (21) may be attached at the junction of the cable (11) and projectile (35). A block (18) then connects the split ends (16, 17) of the conduit (12), and the cable (11) and other item (21) may then be moved together through the conduit (12) by the pushing machine (13) and air blower (15) which moves air against the projectile (35) to assist such movement.

106. 发明申请

US20130141910A1 Method for assembling LEDs to a ceramic heat conductive piece and a structure produced by the method 审中-公开
标题翻译：将LED组装到陶瓷导热片上的方法以及通过该方法制造的结构
公开(公告)号：US20130141910A1
公开(公告)日：2013-06-06
申请号：US13310765
申请日：2011-12-04
申请人： Tzu-Yu Liao
发明人： Tzu-Yu Liao
IPC分类号： F21V29/00 , C04B41/51 , H01L21/64 , F21V21/00 , H01R43/02
CPC分类号： F21K9/90 , F21K9/232 , F21V3/00 , F21V29/74 , F21V29/86 , F21Y2105/10 , F21Y2115/10 , Y10T29/49169
摘要： A method for assembling LEDs to a ceramic heat conductive piece comprises: mixing ceramic materials together and subjecting the mixed ceramic materials to hot pressing to form the ceramic heat conductive piece, the ceramic heat conductive piece has a cold end; subjecting the cold end of the ceramic heat conductive piece to sliver printing, drying process and silver reduction process to form the silver layer; choosing conductive binders, and applying the conductive binders to the silver layer by coating process; attaching the LEDs between paired conductive binders by welding; getting a finished product. The structure produced by the method is such that the LEDs are located between the paired conductive binders, and each of the LEDs includes a LED wafer disposed on a substrate, so that the heat generated by the LEDs can be transmitted quickly to the ceramic heat conductive piece via the conductive binders and the silver layer.
摘要翻译：将陶瓷导热片组装在一起的方法包括：将陶瓷材料混合在一起，并对混合的陶瓷材料进行热压以形成陶瓷导热片，陶瓷导热片具有冷端; 对陶瓷导热片的冷端进行条纹印花，干燥处理和银还原处理以形成银层; 选择导电粘合剂，并通过涂布工艺将导电粘合剂施加到银层; 通过焊接将LED连接在成对的导电粘合剂之间; 得到成品。通过该方法制造的结构使得LED位于成对的导电粘合剂之间，并且每个LED包括设置在基板上的LED晶片，使得由LED产生的热可以快速传递到陶瓷导热通过导电粘合剂和银层。

107. 发明授权

US08451017B2 Membrane probing method using improved contact 有权
标题翻译：膜探测方法使用改进的接触
公开(公告)号：US08451017B2
公开(公告)日：2013-05-28
申请号：US12818521
申请日：2010-06-18
申请人： K. Reed Gleason , Michael A. Bayne , Kenneth Smith , Timothy Lesher , Martin Koxxy
发明人： K. Reed Gleason , Michael A. Bayne , Kenneth Smith , Timothy Lesher , Martin Koxxy
IPC分类号： G01R31/00 , G01R1/067 , H01R43/20
CPC分类号： G01R1/0735 , G01R1/06733 , G01R1/06738 , G01R3/00 , H01R13/2414 , H01R13/2464 , H01R43/16 , H05K3/20 , H05K3/4007 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49121 , Y10T29/4913 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165 , Y10T29/49169 , Y10T29/49174 , Y10T29/49204 , Y10T29/49208 , Y10T29/49218 , Y10T29/49815 , Y10T29/49824 , Y10T29/49826 , Y10T29/53509
摘要： A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
摘要翻译：优选由延性材料构成的基板和具有用于接触测试装置上的接触焊盘的所得装置的所需形状的工具与基板接触。该工具优选地由比基板更硬的材料构成，使得可以容易地在其中形成凹陷。优选图案化的电介质（绝缘）层由衬底支撑。导电材料位于凹陷内，然后优选地研磨以从电介质层的顶表面去除多余的并提供平整的整个表面。在电介质层和导电材料上形成迹线。然后优选在整个表面上图案化聚酰亚胺层。然后通过任何合适的方法去除衬底。

108. 发明授权

US08438709B2 Method of fabricating a piezoelectric vibrator 失效
标题翻译：制造压电振子的方法
公开(公告)号：US08438709B2
公开(公告)日：2013-05-14
申请号：US12372179
申请日：2009-02-17
申请人： Masashi Numata , Yasuo Kawada , Sadao Oku
发明人： Masashi Numata , Yasuo Kawada , Sadao Oku
IPC分类号： H04R17/10 , H01R43/20
CPC分类号： H03H9/1021 , H01L2224/45144 , H01L2224/48091 , Y10T29/42 , Y10T29/49169 , Y10T29/49179 , H01L2924/00014 , H01L2924/00
摘要： A method for fabricating a piezoelectric vibrator includes inserting a filling member formed with a through hole inside of a ring having a substantially cylindrical shape, and inserting one piece of a lead to the through hole of the filling member to project from both sides of the ring. The method further includes sintering the filling member along with the ring and the lead to integrate in an airtight manner, subjecting an exciting electrode of the piezoelectric vibrating piece to a bump connection with an inner lead portion of the lead projected from the ring, subjecting another exciting electrode on a side of the piezoelectric vibrating piece opposed to the other exciting electrode to wire bonding with the ring, and press-fitting the ring to an opening portion of a case and sealing the piezoelectric vibrating piece connected with the inner lead portion inside of the case in an airtight manner.
摘要翻译：一种制造压电振动器的方法，包括将形成有通孔的填充构件插入到具有大致圆筒形状的环内，并将一片引线插入到填充构件的通孔以从环的两侧突出。该方法还包括将填充构件与环和引线一起烧结，以气密的方式整合，使压电振动片的激励电极与从环突出的引线的内引线部分碰撞连接，对另一个在压电振动片的与该另一个激励电极相对的一侧的激励电极与环引线接合，并将环压配合到壳体的开口部分，并将与内引线部分连接的压电振动片密封在案件以气密的方式。

109. 发明申请

US20130114234A1 LIGHTWEIGHT ELECTRONIC SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD 有权
标题翻译：用于汽车应用的轻型电子系统和方法
公开(公告)号：US20130114234A1
公开(公告)日：2013-05-09
申请号：US13668461
申请日：2012-11-05
申请人： Delphi Technologies, Inc.
发明人： CHRIS R. SNIDER , MARK A. JACKSON
IPC分类号： H05K5/02 , H05K9/00 , H05K13/00
CPC分类号： H05K9/0007 , B29C59/16 , B60R11/02 , G06F11/00 , H04B1/082 , H04R1/02 , H05K1/0215 , H05K1/141 , H05K5/0217 , H05K5/0221 , H05K5/0226 , H05K7/20409 , H05K7/20418 , H05K7/20436 , H05K9/0047 , H05K9/0079 , H05K9/0081 , H05K13/00 , H05K2201/09081 , H05K2201/10386 , H05K2201/10446 , Y10T16/547 , Y10T16/5476 , Y10T29/49002 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49169 , Y10T29/49172 , Y10T29/4957 , Y10T29/49826 , Y10T29/49861 , Y10T29/5313 , Y10T74/20396 , Y10T403/70 , Y10T403/77 , Y10T428/24289
摘要： A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.
摘要翻译：用于车辆应用的轻便音频播放器实际上是“无紧固件”，并且包括由聚合物基材料形成的折叠盒，以形成用于接收音频设备的细节以及用于电气控制和显示所需的电路板。这种情况是复合结构，包括一个插入模制的导电丝网。丝网通过暴露的金属丝网垫和相邻的接地夹提供电路板的屏蔽和接地。侧壁关闭构件限定自身接合附件特征，用于固定到壳体，提供与电线屏蔽的电自身接地和与内部功率器件的热接地。主要组件和组件在最终组装过程中是自固定的，无需专用工具，夹具和组装设备。

110. 发明申请

US20130097858A1 Manufacturing Method for a Sensor of a Thermal Flow Measuring Device 有权
标题翻译：热流量测量装置传感器的制造方法
公开(公告)号：US20130097858A1
公开(公告)日：2013-04-25
申请号：US13709114
申请日：2012-12-10
申请人： Endress + Hauser Flowtec AG
发明人： Alex Pfau
IPC分类号： H05K13/04 , B23K26/20
CPC分类号： H05K13/04 , B23K26/20 , G01F1/684 , G01F1/692 , Y10T29/49169 , Y10T29/49174
摘要： A method for the manufacture of a sensor for a thermal flow measuring device, wherein the sensor has at least one housing with a first open end and a second open end. The first open end is securable in a sensor holder; and at least one resistance thermometer is inserted into the housing through the second open end of the housing and the second open end of the housing is closed. Cables for electrical contacting of the resistance thermometer lead out of the housing through the first open end of the housing.
摘要翻译：一种用于制造用于热流测量装置的传感器的方法，其中所述传感器具有至少一个具有第一开口端和第二开口端的壳体。第一个开口端可以安装在传感器支架上; 并且至少一个电阻温度计通过壳体的第二开口端插入壳体中，并且壳体的第二开口端关闭。电阻温度计的电气接触电缆通过外壳的第一个开口端引出外壳。

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