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101. 发明授权

US09012932B2 White LED assembly with LED string and intermediate node substrate terminals 有权
标题翻译：白色LED组件，带LED灯串和中间节点基板端子
公开(公告)号：US09012932B2
公开(公告)日：2015-04-21
申请号：US14285599
申请日：2014-05-22
申请人： Bridgelux, Inc.
发明人： Tao Xu , Michael Solomensky
IPC分类号： H01L33/58 , H01L27/15 , H01L25/075 , H01L25/16 , H01L33/00 , H01L33/62 , H01L33/40 , H01L33/50 , F21K99/00 , F21Y105/00
CPC分类号： H01L25/0753 , F21K9/64 , F21Y2107/50 , F21Y2115/10 , H01L25/167 , H01L27/153 , H01L33/005 , H01L33/405 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： A white LED assembly includes a string of series-connected blue LED dice mounted on a substrate. The substrate has a plurality of substrate terminals. A first of the substrate terminals is coupled to be a part of first end node of the string. A second of the substrate terminals is coupled to be a part of an intermediate node of the string. A third of the substrate terminals is coupled to be a part of a second end node of the string. Other substrate terminals may be provided and coupled to be parts of corresponding other intermediate nodes of the string. A single contiguous amount of phosphor covers all the LED dice, but does not cover any of the substrate terminals. In one example, the amount of phosphor contacts the substrate and has a circular periphery. All the LEDs are mounted to the substrate within the circular periphery.
摘要翻译：白色LED组件包括安装在基板上的一串串联连接的蓝色LED管芯。基板具有多个基板端子。衬底端子中的第一个被耦合为串的第一端节点的一部分。衬底端子中的第二个被耦合为串的中间节点的一部分。衬底端子中的三分之一被耦合为串的第二端节点的一部分。可以提供其它衬底端子并将其耦合为串的相应的其它中间节点的部分。单个相邻量的荧光体覆盖所有LED骰子，但不覆盖任何基板端子。在一个示例中，荧光体的量与基板接触并且具有圆形周边。所有的LED在圆形周边内安装到基板上。

102. 发明申请

US20150097203A1 DIE EMITTING WHITE LIGHT 有权
标题翻译： DIE发光白光
公开(公告)号：US20150097203A1
公开(公告)日：2015-04-09
申请号：US14046644
申请日：2013-10-04
申请人： BRIDGELUX, INC.
发明人： Babak Imangholi , Khashayar Phil Oliaei , Scott West
IPC分类号： H01L33/50
CPC分类号： H01L33/502 , H01L33/0095 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.
摘要翻译：公开了各种方法和装置。一种方法可以包括将至少一个管芯设置在载体衬底上的位置上，在至少一个管芯中的每一个上形成至少一个柱形突起，在至少一个柱形突起和至少一个管芯上形成磷光体层，去除荧光体层的顶部以暴露所述至少一个柱形突起，以及去除位于两个相邻裸片之间的磷光体层的侧部。装置可以包括包括顶部，底部和侧面的模具。荧光体层可以设置在模具的顶部，底部和侧面上。荧光体层可以在模具的顶表面和侧表面上具有基本相等的厚度，以及设置在模具的顶表面上的一个或多个柱形凸块。

103. 发明申请

US20140226333A1 LED-BASED REPLACEMENT FOR FLUORESCENT LIGHT SOURCE 有权
标题翻译：基于LED的氟光源替代
公开(公告)号：US20140226333A1
公开(公告)日：2014-08-14
申请号：US14180351
申请日：2014-02-13
申请人： BRIDGELUX, INC.
发明人： Ghulam Hasnain , Calvin B. Ward
IPC分类号： F21K99/00 , F21V29/00
CPC分类号： F21K9/275 , F21K9/27 , F21K9/272 , F21V19/001 , F21V29/004 , F21V29/10 , F21V29/70 , F21V29/89 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10 , H05K1/0209 , H05K2201/10106 , Y02B20/386
摘要： A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of LEDs mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to DC power that powers the LEDs. The light source is powered from the output of the existing fluorescent ballast. The light source can utilize the existing metallic enclosure as a heat-radiating surface and/or direct air heat transfer from the surface of the heat-dissipating structure.
摘要翻译：公开了一种适于替代现有荧光灯中现有荧光管的光源。光源包括安装在散热结构上的多个LED，与光源要替换的荧光管的荧光管连接器相配合的第一和第二插头适配器，以及从荧光管转换功率的电力适配器将第一和第二插头适配器上的镇流器提供给为LED供电的直流电源。光源由现有荧光灯镇流器的输出端供电。光源可以利用现有的金属外壳作为散热表面和/或从散热结构的表面直接进行空气热传递。

104. 发明申请

US20140138715A1 LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION 有权
标题翻译：包含优化镜头配置的发光二极管阵列的发光组件
公开(公告)号：US20140138715A1
公开(公告)日：2014-05-22
申请号：US14046903
申请日：2013-10-04
申请人： Bridgelux, Inc.
发明人： Wenhui Zhang , Tao Tong , Zhengqing Gan
IPC分类号： H01L25/075 , H01L33/50 , H01L33/58
CPC分类号： H01L25/0753 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
摘要： Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
摘要翻译：发光组件包括多个发光二极管（LED）管芯，其布置并连接到共同的衬底上以形成具有期望的最佳堆积密度的LED阵列。 LED管芯彼此连接并连接到基板上的着陆焊盘，用于经由互连装置从外部电源接收电力。组件包括透镜结构，其中每个LED管芯包括设置在其上的光学透镜，其被配置为促进最佳光透射。每个光学透镜的直径在相应LED芯片的尺寸的约1.5至3倍之间，并且成形为半球形。圆角片与相邻的光学透镜是一体的并插入在相邻的光学透镜之间，并且在相邻的光学透镜之间提供足够的空间，使得相邻光学透镜的直径彼此不相交。

105. 发明申请

US20140131747A1 Packaging Photon Building Blocks Having Only Top Side Connections In A Molded Interconnect Structure 有权
标题翻译：包装模制互连结构中仅具有顶侧连接的光子构件
公开(公告)号：US20140131747A1
公开(公告)日：2014-05-15
申请号：US14156617
申请日：2014-01-16
申请人： Bridgelux, Inc.
发明人： R. Scott West , Tao Tong , Mike Kwon
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2224/73265 , H01L2924/07811 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2933/0075 , H01L2924/00014 , H01L2924/00
摘要： Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.
摘要翻译：标准化的光子构建块被封装在模制的互连结构中以形成各种LED阵列产品。没有电导体穿过安装有LED管芯的基板的顶表面和底表面之间。高反射材料的微点喷射到顶面上。衬底顶表面上的着陆垫连接到布置在互连结构的唇缘下侧的接触垫。在焊料回流工艺中，光子构建块在互连结构内自对准。互连结构中的导体通过接触焊盘和着陆焊盘电耦合到光子构建块中的LED管芯。压缩成型用于在LED管芯上形成透镜，并留下覆盖着色焊盘的硅胶闪光层。通过在闪光层处的喷砂颗粒去除着陆垫上方的闪光层。

106. 发明授权

US08690382B2 Gradient optics for even light distribution of led light sources 有权
标题翻译：梯度光学器件用于均匀配光的LED光源
公开(公告)号：US08690382B2
公开(公告)日：2014-04-08
申请号：US13292033
申请日：2011-11-08
申请人： Todd Farmer
发明人： Todd Farmer
IPC分类号： F21V3/00 , F21V9/10 , F21V11/00
CPC分类号： F21V3/049 , F21K9/27 , F21K9/60 , F21S8/04 , F21V5/00 , F21V5/007 , F21V5/008 , F21V7/04 , F21V13/04 , F21Y2103/10 , F21Y2115/10 , G02B3/0087 , G02B5/021 , G02B5/205 , Y10T29/49002
摘要： Gradient optics for even light distribution of LED light sources. In an aspect, an apparatus is provided for uniform distribution of light emitted from a light source. The apparatus includes a panel coupled to receive the light emitted from the light source, and gradient optics disposed on the panel, the gradient optics providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light. In another aspect, an apparatus includes means for receiving the light emitted from the light source, and means for providing a matching transparency gradient that is aligned with the light source to evenly distribute the emitted light.
摘要翻译：梯度光学用于LED光源的均匀分布。在一方面，提供了一种用于从光源发射的光的均匀分布的装置。该装置包括耦合以接收从光源发射的光的面板和设置在面板上的梯度光学元件，梯度光学器件提供与光源对准的匹配透明度梯度以均匀分布发射的光。在另一方面，一种装置包括用于接收从光源发射的光的装置，以及用于提供与光源对准的匹配透明度梯度以均匀分布发射光的装置。

107. 发明授权

US08668361B2 LED-based replacement for fluorescent light source 有权
标题翻译： LED替代荧光灯源
公开(公告)号：US08668361B2
公开(公告)日：2014-03-11
申请号：US12888111
申请日：2010-09-22
申请人： Ghulam Hasnain , Calvin B. Ward
发明人： Ghulam Hasnain , Calvin B. Ward
IPC分类号： H01R33/00 , F25D27/00
CPC分类号： F21K9/275 , F21K9/27 , F21K9/272 , F21V19/001 , F21V29/004 , F21V29/10 , F21V29/70 , F21V29/89 , F21Y2101/00 , F21Y2103/10 , F21Y2115/10 , H05K1/0209 , H05K2201/10106 , Y02B20/386
摘要： A light source that is adapted to replace existing fluorescent tubes in an existing fluorescent light fixture is disclosed. The light source includes a plurality of LEDs mounted on a heat-dissipating structure, first and second plug adapters that mate with the florescent tube connectors of the fluorescent tube the light source is to replace, and a power adapter that converts power from a fluorescent tube ballast presented on the first and second plug adapters to DC power that powers the LEDs. The light source is powered from the output of the existing fluorescent ballast. The light source can utilize the existing metallic enclosure as a heat-radiating surface and/or direct air heat transfer from the surface of the heat-dissipating structure.
摘要翻译：公开了一种适于替代现有荧光灯中现有荧光管的光源。光源包括安装在散热结构上的多个LED，与光源要替换的荧光管的荧光管连接器相配合的第一和第二插头适配器，以及从荧光管转换功率的电力适配器将第一和第二插头适配器上的镇流器提供给为LED供电的直流电源。光源由现有荧光灯镇流器的输出端供电。光源可以利用现有的金属外壳作为散热表面和/或从散热结构的表面直接进行空气热传递。

108. 发明申请

US20140048832A1 Micro-Bead Blasting Process for Removing a Silicone Flash Layer 有权
标题翻译：用于去除硅酮闪光层的微珠爆破过程
公开(公告)号：US20140048832A1
公开(公告)日：2014-02-20
申请号：US14060860
申请日：2013-10-23
申请人： Bridgelux, Inc.
发明人： R. Scott West , Tao Tong , Mike Kwon
IPC分类号： H01L33/56 , H01L33/58
CPC分类号： H01L33/56 , B24C1/003 , B24C1/04 , B24C3/322 , H01L25/0753 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H01L2933/005 , H01L2924/00 , H01L2924/00014
摘要： Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.
摘要翻译：使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。喷嘴位于闪光层顶表面三十毫米内。从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

109. 发明授权

US08597988B2 System for flash-free overmolding of led array substrates 有权
标题翻译： LED阵列基板的无闪光包覆成型系统
公开(公告)号：US08597988B2
公开(公告)日：2013-12-03
申请号：US12977596
申请日：2010-12-23
申请人： Alexander Shaikevitch , Vahid Moshtagh
发明人： Alexander Shaikevitch , Vahid Moshtagh
IPC分类号： H01L23/28
CPC分类号： B29C65/50 , B29D11/00298 , B29D11/00807 , H01L21/566 , H01L21/568 , H01L33/52 , H01L2924/0002 , H01L2933/005 , Y10T156/10 , Y10T156/17 , H01L2924/00
摘要： System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.
摘要翻译： LED阵列基板的无闪光包覆成型系统。在一方面，提供了一种用于将封装成型到LED阵列基板上的方法。该方法包括将保护带附着到基底的基底表面上，使得保护带中的开口与基底的LED器件对准，并将成型材料施加到模制工具的模制表面上，并且通过开口露出的部分基底在保护胶带中。该方法还包括以选定的压力和选定的温度将成型表面和基底表面压在一起，从而在基片上露出的保护带中的开口的部分上形成封装，将模制表面与基片表面分开，并且去除保护带，使得模塑材料从衬底上除去，留下干净的模制衬底。

110. 发明申请

US20130194815A1 Circuit Board for LED Applications 有权
标题翻译： LED应用电路板
公开(公告)号：US20130194815A1
公开(公告)日：2013-08-01
申请号：US13705897
申请日：2012-12-05
申请人： Bridgelux, Inc.
发明人： Michael N. Gershowitz
IPC分类号： F21V21/00
CPC分类号： F21V21/00 , F21V23/004 , H05K1/0209 , H05K1/0256 , H05K1/056 , H05K1/18 , H05K2201/09027 , H05K2201/09063 , H05K2201/09781 , H05K2201/10106
摘要： Circuit boards are designed and configured for mounting light emitting devices (LEDs), such as for LED light bulb and LED light tube applications, and are capable of passing a non-isolated, mains powered, electrical strength test.
摘要翻译：电路板设计和配置用于安装发光器件（LED），例如用于LED灯泡和LED灯管应用，并且能够通过非隔离的市电供电的电气强度测试。

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