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    • 101. 发明申请
    • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • 半导体器件及其制造方法
    • US20110062433A1
    • 2011-03-17
    • US12880259
    • 2010-09-13
    • Shunpei YAMAZAKI
    • Shunpei YAMAZAKI
    • H01L29/12H01L21/16
    • H01L29/7869H01L27/1225H01L2924/0002H01L2924/00
    • It is an object to provide a semiconductor device with less power consumption as a semiconductor device including a thin film transistor using an oxide semiconductor layer. It is an object to provide a semiconductor device with high reliability as a semiconductor device including a thin film transistor using an oxide semiconductor layer. In the semiconductor device, a gate electrode layer (a gate wiring layer) intersects with a wiring layer which is electrically connected to a source electrode layer or a drain electrode layer with an insulating layer which covers the oxide semiconductor layer of the thin film transistor and a gate insulating layer interposed therebetween. Accordingly, the parasitic capacitance formed by a stacked-layer structure of the gate electrode layer, the gate insulating layer, and the source or drain electrode layer can be reduced, so that low power consumption of the semiconductor device can be realized.
    • 本发明的目的是提供具有较少功耗的半导体器件作为包括使用氧化物半导体层的薄膜晶体管的半导体器件。 本发明的目的是提供具有高可靠性的半导体器件作为包括使用氧化物半导体层的薄膜晶体管的半导体器件。 在半导体装置中,栅电极层(栅极布线层)与与覆盖薄膜晶体管的氧化物半导体层的绝缘层电连接的源电极层或漏电极层的布线层相交叉, 插入其间的栅极绝缘层。 因此,可以减小由栅极层,栅极绝缘层和源极或漏极电极层的堆叠层结构形成的寄生电容,从而可以实现半导体器件的低功耗。
    • 106. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20110012118A1
    • 2011-01-20
    • US12835907
    • 2010-07-14
    • Shunpei YAMAZAKIJunichiro SAKATAHiroyuki MIYAKEHideaki KUWABARAHideki UOCHI
    • Shunpei YAMAZAKIJunichiro SAKATAHiroyuki MIYAKEHideaki KUWABARAHideki UOCHI
    • H01L27/12H01L29/786H01L21/84
    • H01L27/1225H01L27/124H01L29/45
    • An object is to improve the aperture ratio of a semiconductor device. The semiconductor device includes a driver circuit portion and a display portion (also referred to as a pixel portion) over the same substrate. The driver circuit includes a channel-etched thin film transistor for driver circuit and a driver circuit wiring formed using metal. Source and drain electrodes of the thin film transistor for the driver circuit are formed using a metal. A channel layer of the thin film transistor for the driver circuit is formed using an oxide semiconductor. The display portion includes a bottom-contact thin film transistor for a pixel and a display portion wiring formed using an oxide conductor. Source and drain electrode layers of the thin film transistor for the pixel are formed using an oxide conductor. A semiconductor layer of the thin film transistor for the pixel is formed using an oxide semiconductor.
    • 目的是提高半导体器件的开口率。 半导体器件包括驱动器电路部分和在同一衬底上的显示部分(也称为像素部分)。 驱动器电路包括用于驱动电路的通道蚀刻薄膜晶体管和使用金属形成的驱动电路布线。 用于驱动电路的薄膜晶体管的源极和漏极由金属形成。 使用氧化物半导体形成用于驱动电路的薄膜晶体管的沟道层。 显示部分包括用于像素的底接触薄膜晶体管和使用氧化物导体形成的显示部分布线。 用于像素的薄膜晶体管的源极和漏极电极层使用氧化物导体形成。 使用氧化物半导体形成用于像素的薄膜晶体管的半导体层。
    • 108. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20100327351A1
    • 2010-12-30
    • US12821477
    • 2010-06-23
    • Shunpei YAMAZAKI
    • Shunpei YAMAZAKI
    • H01L29/786H01L29/78H01L21/336
    • H01L21/84H01L21/28052H01L21/76895H01L27/1203H01L29/665H01L29/6653
    • An object is to reduce the resistance of each member included in a transistor, to improve ON current of the transistor, and to improve performance of an integrated circuit. A semiconductor device including an n-channel FET and a p-channel FET which are provided over a single crystal semiconductor substrate with an insulating layer provided therebetween and are isolated by an element isolation insulating layer. In the semiconductor device, each FET includes a channel formation region including a semiconductor material, a conductive region which is in contact with the channel formation region and includes the semiconductor material, a metal region in contact with the conductive region, a gate insulating layer in contact with the channel formation region, a gate electrode in contact with the gate insulating layer, and a source or drain electrode partly including the metal region.
    • 目的是降低晶体管中包括的每个元件的电阻,以提高晶体管的导通电流,并提高集成电路的性能。 一种包括n沟道FET和p沟道FET的半导体器件,其设置在单晶半导体衬底上,其间设置有绝缘层,并通过元件隔离绝缘层隔离。 在半导体装置中,每个FET包括:包含半导体材料的沟道形成区域,与沟道形成区域接触并包括半导体材料的导电区域,与导电区域接触的金属区域,栅极绝缘层 与沟道形成区域接触,与栅极绝缘层接触的栅极电极和部分地包括金属区域的源极或漏极电极。
    • 109. 发明申请
    • PHOTOELECTRIC CONVERSION DEVICE
    • 光电转换器件
    • US20100307590A1
    • 2010-12-09
    • US12792175
    • 2010-06-02
    • Shunpei YAMAZAKIKazuo NISHI
    • Shunpei YAMAZAKIKazuo NISHI
    • H01L31/00
    • H01L31/1884C23C14/0676H01L31/022466H01L31/022483H01L31/046H01L31/0463H01L31/0465H01L31/076H01L31/077H01L31/202Y02E10/548Y02P70/521
    • The present invention provides a technique in which a cheap zinc oxide material can be used as a light-transmitting conductive film of a photoelectric conversion device. The present invention is a photoelectric conversion device including, between a first electrode and a second electrode, at least one unit cell in which a first impurity semiconductor layer having one conductivity type, a semiconductor layer, and a second impurity semiconductor layer having a conductivity type opposite to the first impurity semiconductor layer are sequentially stacked and a semiconductor junction is included. The first electrode or the second electrode includes conductive oxynitride containing zinc and aluminum. In the conductive oxynitride containing zinc and aluminum: the relative proportion of the zinc is less than or equal to 47 at. % and higher than that of the aluminum; and the relative proportion of the aluminum is higher than that of nitrogen.
    • 本发明提供了可以使用便宜的氧化锌材料作为光电转换装置的透光导电膜的技术。 本发明是一种光电转换装置,在第一电极和第二电极之间包括至少一个单元电池,其中具有一种导电类型的第一杂质半导体层,半导体层和具有导电类型的第二杂质半导体层 与第一杂质半导体层相对的顺序堆叠并且包括半导体结。 第一电极或第二电极包括含有锌和铝的导电氮氧化物。 在含有锌和铝的导电氮氧化物中:锌的相对比例小于或等于47at。 %以上; 铝的相对比例高于氮。