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101. 发明授权

US09165714B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US09165714B2
公开(公告)日：2015-10-20
申请号：US13479397
申请日：2012-05-24
申请人： Makoto Ogawa , Akihiro Motoki , Atsuko Saito , Kenji Masuko , Toshinobu Fujiwara
发明人： Makoto Ogawa , Akihiro Motoki , Atsuko Saito , Kenji Masuko , Toshinobu Fujiwara
IPC分类号： H01G4/228 , H01G2/20 , H01G4/008 , C25D5/12 , C25D3/30 , C25D3/12
CPC分类号： H01G4/008 , C25D3/12 , C25D3/30 , C25D5/12
摘要： An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.
摘要翻译：抑制晶须生长并且具有优异的可焊性的电子部件优选为层叠陶瓷电容器，包括例如长方体形状的电子部件元件。端子电极的外部电极位于电子元件的第一和第二端面上。包含电镀Ni的第一电镀膜位于外部电极的表面上。第二镀膜位于第一镀膜的表面上。第二镀膜具有包括第一镀层和第二镀层的堆叠结构。第二镀层比第一镀层具有较低的致密化程度。

102. 发明授权

US08665053B2 Laminated ceramic electronic component and manufacturing method therefor 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US08665053B2
公开(公告)日：2014-03-04
申请号：US13411863
申请日：2012-03-05
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Wataru Ogawa
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Wataru Ogawa
IPC分类号： H01F5/00
CPC分类号： H01G4/30 , H01C7/13 , H01C7/18 , H01F17/0013 , H01F27/292 , H01G4/12 , H01G4/2325
摘要： A method for manufacturing a laminated ceramic electronic component enables formation of a plating film as at least a portion of an external electrode which connects exposed ends of internal electrodes. A component main body including a plurality of ceramic layers and a plurality of internal electrodes partially exposed from the component main body is prepared such that the component main body has a conductive region formed by diffusion of a conductive component included in the internal electrodes at the end surfaces of the ceramic layers located between adjacent exposed ends of the plurality of internal electrodes. The ceramic layers are preferably composed of a glass ceramic containing a glass component of about 10 weight % or more. A plating film is formed directly on the component main body by growing the exposed ends of the internal electrodes and the conductive region as nucleuses for plating deposition.
摘要翻译：层叠陶瓷电子部件的制造方法能够形成作为连接内部电极的露出端的外部电极的至少一部分的电镀膜。制备包括多个陶瓷层和从部件主体部分露出的多个内部电极的部件主体，使得部件主体具有由末端包括在内部电极中的导电部件的扩散形成的导电区域位于多个内部电极的相邻的露出端之间的陶瓷层的表面。陶瓷层优选由含有约10重量％以上的玻璃成分的玻璃陶瓷构成。通过使内部电极和导电区域的露出端生长成电镀沉积的核，直接在部件主体上形成镀膜。

103. 发明授权

US08542137B2 Decoding encoded data 失效
标题翻译：对编码数据进行解码
公开(公告)号：US08542137B2
公开(公告)日：2013-09-24
申请号：US13313772
申请日：2011-12-07
申请人： Kiyoshi Takemura , Nobuyoshi Tanaka , Makoto Ogawa , Tadayuki Okada
发明人： Kiyoshi Takemura , Nobuyoshi Tanaka , Makoto Ogawa , Tadayuki Okada
IPC分类号： H03M7/40
CPC分类号： H03M7/4031 , G06T9/005 , H03M7/30 , H03M7/40 , H03M7/46
摘要： Data encoded by replacing each of a plurality of characters with bit strings is received. On the basis of definition information, at least one of the characters is recorded as corresponding to each of the bit lengths, and decode information is generated based on the number of characters, wherein the decode information includes bit string information for sorting the bit strings in a bit length order that is a predetermined order associated with bit lengths. In response to receiving a particular bit length, character information in which the characters are sorted in the bit length order is generated by inserting a character corresponding to the particular bit length into a position corresponding to the particular bit length in an array in which at least one of the bit lengths.
摘要翻译：接收通过用位串替换多个字符中的每一个而编码的数据。基于定义信息，至少一个字符被记录为与每个比特长度对应，并且基于字符数生成解码信息，其中解码信息包括用于对位列中的比特串进行排序的比特串信息与位长度相关联的预定顺序的位长度顺序。响应于接收到特定比特长度，通过将与特定比特长度相对应的字符插入与阵列中的特定比特长度相对应的位置来生成字符以比特长度顺序排序的字符信息，其中至少一个比特长度。

104. 发明申请

US20130221638A1 AIR BAG AND AIR BAG DEVICE 有权
标题翻译：空气袋和空气袋装置
公开(公告)号：US20130221638A1
公开(公告)日：2013-08-29
申请号：US13883220
申请日：2011-11-02
申请人： Teruhiko Hiruta , Mitsuo Maruoka , Makoto Ogawa , Yoshihiro Kobayashi
发明人： Teruhiko Hiruta , Mitsuo Maruoka , Makoto Ogawa , Yoshihiro Kobayashi
IPC分类号： B60R21/20
CPC分类号： B60R21/2342 , B60R21/20 , B60R21/203 , B60R21/2338 , B60R21/239 , B60R2021/23382 , B60R2021/2395
摘要： In an air bag main body which inflates step by step in a first stage and a second stage by bonding its peripheral edge portion and bonding its inner side than the peripheral edge portion, a connecting member bridging between a lid member opening and closing a vent hole and a coupling member can be always set to a tension state by arranging an adjusting portion in the coupling member which defining a maximum facing distance between a front panel and a rear panel in the tension state in each of the first stage and the second stage, and whereby a closed state of the vent hole can be maintained.
摘要翻译：在第一阶段和第二阶段通过粘接其周边部分并使其内侧与周缘部分相粘合的气囊主体中的连接构件，其连接在打开和关闭通气孔的盖构件之间并且通过在所述联接构件中布置调节部分，通过在所述第一和第二平台的每一个中在张力状态下限定前面板和后面板之间的最大面向距离，总是将联接构件设置为张力状态，从而可以保持通气孔的关闭状态。

105. 发明授权

US08508913B2 Laminate type electronic component and manufacturing method therefor 有权
标题翻译：层压型电子元件及其制造方法
公开(公告)号：US08508913B2
公开(公告)日：2013-08-13
申请号：US13337445
申请日：2011-12-27
申请人： Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
发明人： Masahito Saruban , Makoto Ogawa , Wataru Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Yoji Yamamoto
IPC分类号： H01G4/228
CPC分类号： H01G4/232 , H01G4/012 , H01G4/30
摘要： In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.
摘要翻译：在层压型电子部件的制造方法中，在通过使成膜主体中的多个内部电极的露出端上沉积的镀层析出来形成至少部分地限定外部电极的镀膜之后进行热处理电镀膜的存在不仅可以干扰湿气的释放，而且还可能导致镀膜中的起泡或凸起缺陷，同时通过蒸发除去组分主体中的电镀溶液等水分。为了避免这种问题，在内部电极的延伸部分中形成将暴露端分割为多个部分的切割。因此，电镀膜包括在与切口的位置相对应的位置沿堆叠方向延伸的狭缝。

106. 发明授权

US08503160B2 Laminate type ceramic electronic component and manufacturing method therefor 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US08503160B2
公开(公告)日：2013-08-06
申请号：US13208416
申请日：2011-08-12
申请人： Masahito Saruban , Makoto Ogawa , Akihiro Motoki , Takehisa Sasabayashi , Takayuki Kayatani
发明人： Masahito Saruban , Makoto Ogawa , Akihiro Motoki , Takehisa Sasabayashi , Takayuki Kayatani
IPC分类号： H01G4/228 , H01G7/00
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度。为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积组件主体的端面。然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。

107. 发明授权

US08319594B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08319594B2
公开(公告)日：2012-11-27
申请号：US13354369
申请日：2012-01-20
申请人： Koji Sato , Yukio Sanada , Makoto Ogawa , Yasuhiro Nishisaka
发明人： Koji Sato , Yukio Sanada , Makoto Ogawa , Yasuhiro Nishisaka
IPC分类号： H01F5/00
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： A ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The first and second external electrodes are disposed on a principal surface, which is directed to the mounting surface side, of the ceramic body so as to face each other with a predetermined gap region therebetween. The external electrodes each include a base layer and a Cu plating layer which covers the base layer. In each of the first and second external electrodes, an expression 0.1≦t/d≦0.5 is satisfied, where t is a thickness of the Cu plating layer at an end of the base layer on a gap region side, and d is a distance from the end of the base layer on the gap region side to an end of the Cu plating layer on the gap region side.
摘要翻译：陶瓷电子部件包括陶瓷体，第一外部电极和第二外部电极。第一外部电极和第二外部电极被设置在陶瓷体的朝向安装面侧的主面上，以便在它们之间以预定的间隙区域彼此面对。外部电极各自包括基层和覆盖基层的Cu镀层。在第一外部电极和第二外部电极中的每一个中，满足表达式0.1＆nlE; t / d＆nlE; 0.5，其中t是在间隙区域侧的基底层的端部处的Cu镀层的厚度，d是从间隙区域侧的基底层的端部到间隙区域侧的Cu镀层的端部的距离。

108. 发明授权

US08315036B2 Ceramic electronic component and method for manufacturing the same 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：US08315036B2
公开(公告)日：2012-11-20
申请号：US12405399
申请日：2009-03-17
申请人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Junichi Saito , Shunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/232 , Y10T29/435
摘要： A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.
摘要翻译：陶瓷电子部件包括陶瓷体和设置在陶瓷体的表面的多个外部电极。外部电极包括含有各自涂覆有金属膜的玻璃颗粒的镀层。镀层通过电镀金属和金属涂覆的玻璃颗粒的共沉积形成。

109. 发明授权

US08254081B2 Laminated ceramic electronic component and manufacturing method thereof 有权
标题翻译：层压陶瓷电子部件及其制造方法
公开(公告)号：US08254081B2
公开(公告)日：2012-08-28
申请号：US12617879
申请日：2009-11-13
申请人： Seiichi Nishihara , Shuji Matsumoto , Akihiro Motoki , Makoto Ogawa
发明人： Seiichi Nishihara , Shuji Matsumoto , Akihiro Motoki , Makoto Ogawa
IPC分类号： H01G4/00
CPC分类号： H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the external electrode and the component main body. A brazing material containing Ti is applied to at least one portion of a surface on which external electrodes of a component main body is formed, and by baking this brazing material, a metal layer containing Ti is formed. Moreover, the external electrodes are formed by a plating process so as to coat at least the metal layer, and a heating process is then carried out so as to cause counter diffusion between the metal layer and the plated film that is to form the external electrodes.
摘要翻译：在层叠陶瓷电子部件中，通过在部件主体的外表面上直接进行电镀处理，在其上形成外部电极，试图提高形成外部电极的镀膜之间的粘合强度和组件主体。将包含Ti的钎料施加到其上形成有组分主体的外部电极的表面的至少一部分，并且通过烘烤该钎焊材料，形成含有Ti的金属层。此外，外部电极通过电镀工艺形成，以便至少涂覆金属层，然后进行加热处理，以使金属层和形成外部电极的镀膜之间产生反扩散。

110. 发明授权

US08194391B2 Multilayer ceramic electronic component and manufacturing method thereof 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US08194391B2
公开(公告)日：2012-06-05
申请号：US12340570
申请日：2008-12-19
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
IPC分类号： H01G4/20 , H01G4/06 , B05D5/12
CPC分类号： H01G4/12 , H01G4/005 , H01G4/232
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译：提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

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