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    • 108. 发明授权
    • Image forming apparatus
    • 图像形成装置
    • US07773925B2
    • 2010-08-10
    • US12042719
    • 2008-03-05
    • Hiroaki Ikeda
    • Hiroaki Ikeda
    • G03G15/00G03G15/01G03G15/16
    • G03G15/0131G03G15/5058G03G2215/00059G03G2215/0141G03G2215/0161
    • A misregistration correcting unit correcting image misregistration on an endless belt in an electrophotographic image forming apparatus is disclosed that includes an image creation part that creates on the endless belt misregistration correction pattern sets each including a pattern of mark groups each being one of a horizontal line mark group formed of horizontal line segment marks and an oblique line mark group formed of oblique line segment marks; a position detecting part that detects the mark positions; a position detection counting part that counts the number of the detected positions of each mark group and detects an abnormal mark group whose number of the detected positions is other than a prescribed number; a detection result storing part that stores information on the detected mark positions; and a misregistration calculating part that calculates the amount of misregistration based on the stored position information excluding that of the abnormal mark group.
    • 公开了一种校正电子照相图像形成装置中的环形带上的图像重合失调的对准校正单元,其包括在环形带对准校正图案组中产生的图像创建部件,每个包括标记组的图案,每个标记组是水平线标记 由水平线段标记组成的组和由斜线段标记形成的斜线标记组; 检测标记位置的位置检测部; 位置检测计数部,其对每个标记组的检测位置的数量进行计数,并检测检测到的位置数不同于规定数量的异常标记组; 检测结果存储部,其存储关于检测到的标记位置的信息; 以及基于除了异常标记组的位置信息之外的存储位置信息来计算重合失调量的重合排列计算部。
    • 109. 发明授权
    • Stacked semiconductor memory device and control method thereof
    • 叠层半导体存储器件及其控制方法
    • US07763496B2
    • 2010-07-27
    • US11708579
    • 2007-02-21
    • Hiroaki IkedaKayoko Shibata
    • Hiroaki IkedaKayoko Shibata
    • H01L21/44
    • H01L25/0657H01L2224/16145H01L2224/16225H01L2225/06513H01L2225/06517H01L2225/06527H01L2225/06541H01L2225/06586H01L2924/15311
    • A stacked semiconductor memory device includes an interface chip and a plurality of core chips, in which the interface chip and the plurality of core chips are stacked. The core chips are mutually connected by a plurality of data through electrodes. The core chips each include a plurality of memory arrays. In response to an access request, the plurality of memory arrays corresponding to a predetermined data through electrode are activated, and the plurality of activated memory arrays and the predetermined data through electrode are sequentially connected. Thereby, even though it requires approximately ten-odd ns for transferring the first data, similarly to the conventional case, it is possible to transfer the subsequent data at high speed determined by the reaction rate (1 to 2 ns) of the through electrode. As a result, it becomes possible to increase a bandwidth while suppressing the number of through electrodes.
    • 堆叠式半导体存储器件包括接口芯片和多个芯片,其中接口芯片和多个芯片芯片堆叠在其中。 核心芯片通过电极通过多个数据相互连接。 核心芯片各自包括多个存储器阵列。 响应于访问请求,对应于预定数据通过电极的多个存储器阵列被激活,并且多个激活的存储器阵列和预定的数据通过电极被顺序地连接。 因此,即使对于传送第一数据需要大约十几ns,与常规情况类似,可以以通过电极的反应速率(1至2ns)确定的高速传送随后的数据。 结果,可以在抑制贯通电极的数量的同时增加带宽。