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    • 103. 发明申请
    • Semiconductor substrate processing apparatus
    • 半导体基板处理装置
    • US20080045029A1
    • 2008-02-21
    • US11975578
    • 2007-10-19
    • Steven VerhaverbekeBrian Brown
    • Steven VerhaverbekeBrian Brown
    • B08B3/00H01L21/461
    • H01L21/67155B08B3/12B08B7/04H01L21/67017H01L21/67051H01L21/67057
    • According to one aspect of the invention, a semiconductor substrate processing apparatus and a method for processing semiconductor substrates are provided. The semiconductor substrate processing apparatus may include a semiconductor substrate support, a dispense head positioned over the semiconductor substrate support, a liquid container, and a transport subsystem. A semiconductor substrate may be placed on the semiconductor substrate support while a first semiconductor processing liquid is dispensed thereon. The wafer may also be spun by the semiconductor substrate support to remove the first semiconductor processing liquid. The transport subsystem may transport the semiconductor substrate to the liquid container where the semiconductor substrate may be immersed in a second semiconductor processing liquid. The semiconductor substrate may then be removed from the second semiconductor processing liquid while vapor is directed at a surface of the semiconductor substrate where the semiconductor substrate contacts a surface of the second semiconductor processing liquid.
    • 根据本发明的一个方面,提供半导体衬底处理装置和半导体衬底的处理方法。 半导体衬底处理设备可以包括半导体衬底支撑件,位于半导体衬底支架上方的分配头,液体容器和运输子系统。 半导体衬底可以放置在半导体衬底支撑件上,同时分配第一半导体处理液体。 也可以通过半导体衬底支撑来旋转晶片以移除第一半导体处理液体。 输送子系统可以将半导体衬底输送到半导体衬底浸入第二半导体处理液中的液体容器。 然后可以从第二半导体处理液体中去除半导体衬底,同时蒸汽指向半导体衬底的表面,其中半导体衬底与第二半导体处理液体的表面接触。
    • 104. 发明申请
    • Apparatus for single-substrate processing with multiple chemicals and method of use
    • 具有多种化学品的单基板处理装置和使用方法
    • US20070254098A1
    • 2007-11-01
    • US11413651
    • 2006-04-28
    • Alexander KoRichard EndoBrian BrownKent ChildRalph Wadensweiller
    • Alexander KoRichard EndoBrian BrownKent ChildRalph Wadensweiller
    • B05D3/12B05C13/02
    • H01L21/67051B05D1/005B05D7/56
    • A single-substrate apparatus for wet chemical processing of one or multiple sides of a substrate is described. Embodiments of the present invention enable multiple chemicals to be applied to the substrate in succession and reclaimed substantially free of cross contamination between chemicals. In an embodiment of the present invention, a rotatable fluid diverter is positioned between a rotatable pedestal and a nonrotatable multi-level catch cup to funnel fluid shed from a substrate to a predetermined level of the catch cup. The rotatable fluid diverter is designed to expel fluid over a narrow spray angle and thereby enable the pitch of the levels in the catch cup to be reduced so that the chamber volume of the single-substrate apparatus is reduced. In another embodiment of the present invention, the rotatable pedestal is moveable so that the fluid shed from the substrate can be directed to away from the multi-level catch cup.
    • 描述了用于衬底的一个或多个侧面的湿化学处理的单衬底装置。 本发明的实施方案使多种化学品能够连续地应用于基材并且基本上没有化学品之间的交叉污染而被回收。 在本发明的一个实施例中,可转动的流体转向器位于可转动的底座和不可转动的多级夹紧杯之间,用于使流体从衬底排出到捕捉杯的预定水平。 可旋转流体转向器被设计成在窄的喷雾角度上排出流体,从而使得捕获杯中的液位的间距减小,使得单基底装置的腔体积减小。 在本发明的另一个实施例中,可旋转底座是可移动的,使得从衬底脱落的流体可以被引导离开多级抓杯。