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91. 发明授权

US07617600B2 Process of making an electronic circuit device having flexibility and a reduced footprint 失效
标题翻译：制造具有灵活性和减少的占地面积的电子电路器件的工艺
公开(公告)号：US07617600B2
公开(公告)日：2009-11-17
申请号：US10855510
申请日：2004-05-28
申请人： Yasutaka Takeuchi , Hironao Hayashi
发明人： Yasutaka Takeuchi , Hironao Hayashi
IPC分类号： H05K3/36 , H05K3/22
CPC分类号： H05K3/20 , H05K3/0014 , H05K3/284 , H05K2201/0133 , H05K2203/0156 , H05K2203/0769 , H05K2203/0786 , H05K2203/302 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49146 , Y10T29/49169 , Y10T29/49171
摘要： An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a water-soluble polymer as an insulating material to the baseboard, and forming an electronic module by mounting electronic parts to wires formed on the baseboard. The formation of the electronic circuit may also include removing the baseboard from the electronic module by dissolving the baseboard in water and deforming and resin-encapsulating the electronic module, which includes the electronic parts and wires in the state of lacking the baseboard.
摘要翻译：一种仅从电子模块移除基板形成的电子电路。电子电路可以通过提供由水溶性材料制成的基板，将水溶性聚合物作为绝缘材料施加到基板上，并且通过将电子部件安装在形成在基板上的电线来形成电子模块来形成。电子电路的形成还可以包括通过将踢脚板溶解在水中并使包含电子部件和电线的电子模块在缺少踢脚板的状态下变形和树脂封装而从电子模块中移除基板。

92. 发明授权

US07364769B2 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof 失效
标题翻译：用于在基板上形成布线图案的装置和方法，以及电子装置及其制造方法
公开(公告)号：US07364769B2
公开(公告)日：2008-04-29
申请号：US10844428
申请日：2004-05-13
申请人： Yoshihiro Yoshida , Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi
发明人： Yoshihiro Yoshida , Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi
IPC分类号： B41M3/12
CPC分类号： H05K3/207 , H01L21/4867 , H01L51/0022 , H01L51/0024 , H05K1/0306 , H05K3/386 , H05K2203/0143 , H05K2203/0786 , H05K2203/1105 , H05K2203/1173
摘要： A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.
摘要翻译：布线图案形成装置包括：转印板15，用于将布线图案布置以形成在基板10上;布线材料馈送器2，用于将布线材料11馈送到转印板15上;以及能量馈送器用于通过布线材料馈送器6向馈送给转印板15的布线材料11供给能量。通过利用从能量供给器6,7供给的能量，当将材料11从供料器2供给到转印板15时的布线材料11的粘度与布线材料11的粘合性不同，当材料11 从转印板15转印到基板10上。

93. 发明申请

US20070151661A1 ETCHED DIELECTRIC FILM IN HARD DISK DRIVES 审中-公开
标题翻译：硬盘驱动器中的蚀刻电介质膜
公开(公告)号：US20070151661A1
公开(公告)日：2007-07-05
申请号：US11685065
申请日：2007-03-12
申请人： Guoping Mao , Rui Yang
发明人： Guoping Mao , Rui Yang
IPC分类号： B32B37/00
CPC分类号： B32B15/08 , B32B38/10 , B32B2311/00 , B32B2379/08 , C08J7/12 , C09K13/02 , G11B5/484 , G11B5/486 , H05K1/028 , H05K1/0393 , H05K1/056 , H05K3/002 , H05K3/381 , H05K2201/0141 , H05K2201/0154 , H05K2201/0191 , H05K2201/0397 , H05K2201/09036 , H05K2203/0353 , H05K2203/0786 , H05K2203/0793 , Y10T156/1052 , Y10T428/12
摘要： An etched dielectric film for use in a hard disk drive. The dielectric film has a thickness of about 25 μm or greater when it is attached to a supporting metal substrate, and is subsequently etched to a thickness of about 20 μm or less.
摘要翻译：用于硬盘驱动器的蚀刻电介质膜。当电介质膜连接到支撑金属基底上时，该介电膜具有约25μm或更大的厚度，随后被蚀刻至约20μm或更小的厚度。

94. 发明授权

US06946035B2 Method of cleaning substrate 失效
标题翻译：清洗基材的方法
公开(公告)号：US06946035B2
公开(公告)日：2005-09-20
申请号：US10828347
申请日：2004-04-21
申请人： Masaaki Suzuki
发明人： Masaaki Suzuki
IPC分类号： B08B3/10 , B08B3/02 , B08B3/04 , B08B3/12 , B08B7/00 , G02F1/13 , G02F1/1333 , H01L21/304 , H05K3/26 , B08B7/04
CPC分类号： B08B3/022 , B08B3/04 , B08B3/12 , B08B7/0042 , B08B7/0057 , H05K3/26 , H05K2203/0786 , H05K2203/107 , H05K2203/1509 , Y10S134/902
摘要： Dirt, particularly of inorganic matter, attached to a substrate, such as a glass substrate for liquid crystal devices, is effectively removed by irradiating the substrate with ultraviolet rays including 184.9 nm and 253.7 nm in an oxygene-containing atmosphere in advance of wet cleaning with pure water. As a result, the wet cleaning time and the amount of pure water can be reduced.
摘要翻译：在含有氧基的气氛中，在含有氧气的气氛中用含有184.9nm和253.7nm的紫外线照射基板，例如用于液晶装置的基板，例如液晶装置用玻璃基板，特别是无机物质的污垢，纯净水。结果，可以减少湿清洗时间和纯水量。

95. 发明授权

US06923919B2 Liquid crystal polymers for flexible circuits 失效
标题翻译：用于柔性电路的液晶聚合物
公开(公告)号：US06923919B2
公开(公告)日：2005-08-02
申请号：US09947082
申请日：2001-09-04
申请人： Rui Yang , Guoping Mao
发明人： Rui Yang , Guoping Mao
IPC分类号： C08J7/12 , C09K13/02 , H01L21/60 , H05K3/00 , H05K3/38 , C30B33/00
CPC分类号： C09K13/02 , C08J7/12 , H05K3/002 , H05K3/381 , H05K2201/0141 , H05K2201/0397 , H05K2203/0786
摘要： A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering.When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50° C. to 120° C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using etchant compositions as previously described.
摘要翻译：一种提供金属种子液晶聚合物的方法，包括以下步骤：通过施加包含碱金属氢氧化物和增溶剂的水溶液作为液晶聚合物基材的蚀刻剂组合物来提供待处理的液晶聚合物基材。蚀刻的液晶聚合物基板的进一步处理包括在蚀刻的液晶聚合物基板上沉积粘附金属层。可以使用化学镀金属或真空沉积金属例如溅射来沉积粘附金属层。当使用化学镀金属时，施加到液晶聚合物上的锡（II）溶液提供处理过的液晶聚合物基质，其中施加钯（II）溶液提供金属种子液晶聚合物。蚀刻剂组合物包含在35重量％的水中的溶液。％至55重量％％的碱金属盐和10wt。％〜35重量％溶解在溶液中的％的增溶剂以提供适于在50℃至120℃的温度下蚀刻液晶聚合物的蚀刻剂组合物。包括具有通孔和相关形状空隙的液晶聚合物膜的柔性电路可以使用如前所述的蚀刻剂组合物形成。

96. 发明申请

US20050035462A1 Selective application of conductive material to circuit boards by pick and place 失效
标题翻译：导电材料通过拾取和放置选择性地应用于电路板
公开(公告)号：US20050035462A1
公开(公告)日：2005-02-17
申请号：US10917029
申请日：2004-08-11
申请人： Morgan Johnson
发明人： Morgan Johnson
IPC分类号： H05K3/02 , H05K3/34 , H05K3/40 , H01L29/74
CPC分类号： H05K3/4015 , H05K3/027 , H05K3/341 , H05K2203/0191 , H05K2203/0769 , H05K2203/0786 , Y10T428/12493 , Y10T428/12507 , Y10T428/12514
摘要： A component for use in manufacturing circuit boards, such as printed circuit boards, or flex substrates is adapted for use with pick-and-place equipment to provide a first material overlay disposed over a second material base layer. Such a component may include a first electrically conductive material disposed over a second electrically conductive material, and a soluble tape backing disposed over and attached to the second electrically conductive material. The component may be attached to a circuit board by solder relow, after which the soluble tape backing is removed. Although typical embodiments involve electrically conductive materials, it is noted that an electrically insulating material can also be disposed over and attached to an underlying material which itself is disposed on a circuit board.
摘要翻译：用于制造电路板（例如印刷电路板或柔性基板）的部件适于与拾取和放置设备一起使用，以提供设置在第二材料基层上的第一材料覆盖层。这样的部件可以包括设置在第二导电材料上的第一导电材料和设置在第二导电材料上并附着到第二导电材料上的可溶性带背。组件可以通过焊料回流连接到电路板，然后除去可溶性胶带背衬。虽然典型的实施例涉及导电材料，但应注意的是，电绝缘材料也可以设置在本身设置在电路板上的下层材料上并附着于其上。

97. 发明申请

US20050001017A1 WATER SOLUBLE PROTECTIVE PASTE FOR MANUFACTURING PRINTED CIRCUIT BOARDS 失效
标题翻译：用于制造印刷电路板的水溶性保护胶
公开(公告)号：US20050001017A1
公开(公告)日：2005-01-06
申请号：US10707724
申请日：2004-01-07
申请人： Stefano Oggioni
发明人： Stefano Oggioni
IPC分类号： H05K3/28 , B23K31/00
CPC分类号： H05K3/282 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01079 , H05K3/1275 , H05K2203/049 , H05K2203/0534 , H05K2203/0786 , H01L2924/00
摘要： An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. After deposition the layer is dried until a solid protective film is obtained. An additional advantage obtained by the present invention is that the protective layer can be deposited also by means of an offset printing process, avoiding the use of the stencil and of the screening steps. Screening process is a labourious operation which requires very sophisticated equipment and a very high precision in the design of the stencil. Because of these requirements, screening is an expensive process. On the other hand offset printing is a very simple, cheap and reliable method. In addition, the film forming properties allow the material to create a protective film even with a thin deposited film.
摘要翻译：改进的水溶性保护膏和在制造步骤期间保护电子板表面上的金属电路和焊盘的方法。将增稠剂添加到糊料中，使糊剂分配更容易和更有效。沉积后，将层干燥直到得到固体保护膜。通过本发明获得的另外的优点是保护层也可以通过胶版印刷工艺沉积，避免使用模版和筛选步骤。筛选过程是一项精心的操作，需要非常精密的设备和极高的模具设计精度。由于这些要求，筛选是一个昂贵的过程。另一方面，胶印是一种非常简单，便宜可靠的方法。此外，成膜性能即使用薄的沉积膜也能够使材料形成保护膜。

98. 发明授权

US06820331B2 Method of manufacturing a circuit board and its manufacturing apparatus 失效
标题翻译：制造电路板及其制造装置的方法
公开(公告)号：US06820331B2
公开(公告)日：2004-11-23
申请号：US09736499
申请日：2000-12-15
申请人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
发明人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
IPC分类号： H01K310
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.
摘要翻译：通过去除受影响的材料和形成孔时产生的异物，可以获得清洁的高质量电路板。电路基板的制造方法包括：（a）通过将作为掩模的膜材料粘合到基板材料上来制备薄膜基板材料，（b）通过向其施加激光而在薄膜基板材料上形成孔，（c）通过超声波清洗，不从膜材剥离薄膜材料，从薄膜基板材料上选择性除去粘附在薄膜基板材料上的不必要的材料。当形成孔时产生诸如异物等不必要的材料，并且不需要的材料粘附到基板材料上。在去除这种不必要的材料之后，使用膜材料作为掩模将导电材料设置在孔中，并且膜材料随后从基板材料中去除。

99. 发明申请

US20040152313A1 Low species buffered rinsing fluids and methods 审中-公开
标题翻译：低品质缓冲冲洗液和方法
公开(公告)号：US20040152313A1
公开(公告)日：2004-08-05
申请号：US10701046
申请日：2003-11-03
发明人： Glen Roeters , Raj Kumar
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： H01L21/02063 , C11D7/08 , C11D7/12 , C11D11/0047 , H01L21/6704 , H05K3/26 , H05K2203/0766 , H05K2203/0786 , Y10S134/902 , Y10S438/906
摘要： A method of rinsing an electronic substrate recognizes that adding a buffer to a rinsing fluid eliminates fluctuations in the amount of residues on an electronic substrate, and a buffered rinsing fluid is prepared by (a) providing water from a water source; (b) deionizing the water to produce deionized water; (c) adding a buffer to the deionized water at a concentration effective to eliminate fluctuations in the amount of residues on the electronic substrate. The electronic substrate is rinsed with the buffered rinsing fluid.
摘要翻译：冲洗电子基板的方法认识到，向冲洗流体添加缓冲液消除电子基板上的残留物的量的波动，并且缓冲的冲洗液通过（a）从水源提供水来制备; （b）去离子水以产生去离子水; （c）以有效地消除电子基板上的残留物量的波动的浓度向去离子水中加入缓冲剂。用缓冲的冲洗液漂洗电子基片。

100. 发明申请

US20040126516A1 Method of manufacturing a circuit board and its manufacturing apparatus 有权
公开(公告)号：US20040126516A1
公开(公告)日：2004-07-01
申请号：US10733283
申请日：2003-12-12
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Kunio Kishimoto , Toshihiro Nishii , Toshiaki Takenaka , Shinji Nakamura , Akihiro Miura
IPC分类号： F16L001/00
CPC分类号： H05K3/4069 , H05K3/0032 , H05K3/0055 , H05K3/0088 , H05K2201/0355 , H05K2203/0191 , H05K2203/0257 , H05K2203/0285 , H05K2203/0786 , H05K2203/081 , H05K2203/1461 , Y10S134/902 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , Y10T428/13
摘要： It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.

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