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91. 发明申请

US20160029478A1 Power Semiconductor Module System Having a High Isolation Strength and Method for Producing a Power Semiconductor Module Arrangement Having a High Isolation Strength 有权
标题翻译：具有高隔离强度的功率半导体模块系统和用于制造具有高隔离强度的功率半导体模块布置的方法
公开(公告)号：US20160029478A1
公开(公告)日：2016-01-28
申请号：US14809714
申请日：2015-07-27
申请人： Infineon Technologies AG
发明人： Reinhold Bayerer
IPC分类号： H05K1/02 , H05K3/30 , H05K5/00 , H05K1/18
CPC分类号： H05K1/0256 , H01L23/04 , H01L2924/0002 , H05K1/18 , H05K1/181 , H05K3/30 , H05K3/306 , H05K2201/0761 , H05K2201/09036 , H05K2201/10166 , H05K2201/10303 , H05K2201/2036 , H01L2924/00
摘要： A power semiconductor module includes a module housing having a top side, a first terminal group, and a second terminal group. A circuit board, which has a first electrode and a second electrode, is mountable on the power semiconductor module in such a way that in the mounted state each terminal of the first group is electrically conductively connected to the first electrode and each terminal of the second group is electrically conductively connected to the second electrode. A first isolation web and/or a second isolation web is provided. Each isolation web is fixed to the circuit board even in the unmounted state, and arranged between the first terminal group and the second terminal group in the mounted state.
摘要翻译：功率半导体模块包括具有顶侧，第一端子组和第二端子组的模块外壳。具有第一电极和第二电极的电路板可以安装在功率半导体模块上，使得在安装状态下，第一组的每个端子与第一电极和第二电极的每个端子导电连接组与第二电极导电连接。提供了第一隔离网和/或第二隔离网。即使处于未安装状态，每个隔离网固定到电路板，并且在安装状态下布置在第一端子组和第二端子组之间。

92. 发明申请

US20160014894A1 CIRCUIT BOARD 有权
标题翻译：电路板
公开(公告)号：US20160014894A1
公开(公告)日：2016-01-14
申请号：US14864895
申请日：2015-09-25
申请人： FUJIFILM CORPORATION
发明人： YASUSHI ENDO , NOBUYUKI TADA , KENJI NAOI , TOMOHITO ASAI , HIDEO IKEDA , MICHIHIRO SHIBATA
IPC分类号： H05K1/11 , H05K1/09
CPC分类号： H05K1/11 , C08F220/18 , C09J133/08 , C09J133/10 , C09J133/26 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/0289 , H05K1/092 , H05K3/285 , H05K3/4673 , H05K2201/0108 , H05K2201/0761 , H05K2201/0769 , C08F2220/1858 , C08F220/20
摘要： This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.
摘要翻译：该布线板设置有：设置在绝缘基板上的多个金属线; 以及设置在金属线上并与金属线直接接触的透明粘合剂层。金属线包括：具有供给脉冲信号的第一金属线; 以及施加有固定电位的第二金属线。脉冲信号具有与固定电位相同的参考电平，并且具有脉冲序列，其中布置脉冲宽度不超过3毫秒的多个脉冲，脉冲在600秒的周期内的积分时间小于60秒。

93. 发明申请

US20150305164A1 Backlight Module, Printed Circuit Board Used For Backlight Module, And Manufacturing Method For The Same 有权
标题翻译：背光模块，用于背光模块的印刷电路板及其制造方法
公开(公告)号：US20150305164A1
公开(公告)日：2015-10-22
申请号：US14647807
申请日：2015-01-11
申请人： SHENZHEN CHINA STAR OPTOELECTRONIC TECHNOLOGY CO., LTD.
发明人： Che-chang HU , Kuang-Yao CHANG , Qian CAO
IPC分类号： H05K3/02 , F21V29/70
CPC分类号： H05K3/02 , F21V29/70 , H05K1/056 , H05K2201/0761 , H05K2201/10106 , H05K2203/0228 , H05K2203/302
摘要： A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region.
摘要翻译：提供一种用于制造背光模块的印刷电路板的方法。印刷电路板包括光条区域和散热区域。用于安装背光模块的光棒并形成有用于为光棒供电的导电电路的光条区域。散热区域与光条区域连接。对光棒区域和散热区域的连接位置进行切割以形成位于印刷电路板侧的狭槽，以防止散热区域与光条的导电电路之间的短路地区。切割部分地穿透其上形成有导电电路的电介质层的厚度，以便将光条区域与散热区域完全分离。

94. 发明授权

US09084345B2 Backlight module, printed circuit board used for backlight module, and manufacturing method for the same 有权
标题翻译：背光模块，用于背光模块的印刷电路板及其制造方法
公开(公告)号：US09084345B2
公开(公告)日：2015-07-14
申请号：US13811279
申请日：2013-01-11
申请人： Shenzhen China Star Optoelectronics Technology Co., Ltd.
发明人： Che-chang Hu , Kuang-Yao Chang , Qian Cao
IPC分类号： H05K1/02 , G02F1/1335 , H05K1/05
CPC分类号： H05K1/0203 , G02B6/0001 , G02F1/1336 , G02F2001/133612 , G02F2001/133628 , H05K1/056 , H05K2201/0761 , H05K2201/10106 , H05K2203/0228 , H05K2203/302
摘要： The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.
摘要翻译：本发明公开了一种背光模块，背光模块用的印刷电路板及其制造方法。印刷电路板包括光条区域和散热区域。所述灯条区域用于安装所述背光模块的灯条并形成有用于为所述灯条供电的导电电路; 以及与轻棒区域连接的散热区域，其中，光条区域和散热区域的连接位置与切割槽配合，并且切割槽位于印刷电路板的侧面，用于安装光条以防止散热区域和通过切割槽的光条区域的导电电路之间的短路连接。本发明可以避免由于印刷电路板的散热区上的导电层的未完成蚀刻引起的短路问题。

95. 发明申请

US20150041859A1 Redistribution Board, Electronic Component and Module 有权
标题翻译：再分配板，电子元件和模块
公开(公告)号：US20150041859A1
公开(公告)日：2015-02-12
申请号：US13962622
申请日：2013-08-08
申请人： Infineon Technologies AG
发明人： Ralf Otremba , Josef Höglauer
IPC分类号： H01L23/522 , H01L29/778
CPC分类号： H01L23/5226 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49827 , H01L23/49838 , H01L29/2003 , H01L29/778 , H01L2224/48091 , H05K1/0262 , H05K1/181 , H05K2201/0761 , H05K2201/093 , H05K2201/09309 , H05K2201/09336 , H05K2201/09972 , H01L2924/00014
摘要： A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer.
摘要翻译：再分配板包括：第一导电层，包括用于低电压信号的再分配结构;第二导电层，包括用于高电压信号的再分配结构;以及非导电层。第二导电层通过非导电层与第一导电层间隔开。再分配板还包括从再分布板的安装表面延伸到第二导电层的导电连接器。导电连接器被第一导电层的低电压迹线围绕。

96. 发明申请

US20140192514A1 Backlight Module, Printed Circuit Board Used for Backlight Module, and Manufacturing Method for The Same 有权
标题翻译：背光模块，用于背光模块的印刷电路板及其制造方法
公开(公告)号：US20140192514A1
公开(公告)日：2014-07-10
申请号：US13811279
申请日：2013-01-11
申请人： Che-chang Hu , Kuang-Yao Chang , Qian Cao
发明人： Che-chang Hu , Kuang-Yao Chang , Qian Cao
IPC分类号： F21V15/01 , H05K1/02
CPC分类号： H05K1/0203 , G02B6/0001 , G02F1/1336 , G02F2001/133612 , G02F2001/133628 , H05K1/056 , H05K2201/0761 , H05K2201/10106 , H05K2203/0228 , H05K2203/302
摘要： The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.
摘要翻译：本发明公开了一种背光模块，背光模块用的印刷电路板及其制造方法。印刷电路板包括光条区域和散热区域。所述灯条区域用于安装所述背光模块的灯条并形成有用于为所述灯条供电的导电电路; 以及与轻棒区域连接的散热区域，其中，光条区域和散热区域的连接位置与切割槽配合，切割槽位于印刷电路板的侧面，用于安装光条以防止散热区域和通过切割槽的光条区域的导电电路之间的短路连接。本发明可以避免由于印刷电路板的散热区上的导电层的未完成蚀刻引起的短路问题。

97. 发明申请

US20130136887A1 CCL AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： CCL及其制造方法
公开(公告)号：US20130136887A1
公开(公告)日：2013-05-30
申请号：US13681872
申请日：2012-11-20
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Young Kyung Kim
IPC分类号： H05K1/05
CPC分类号： H05K1/056 , H05K3/0061 , H05K3/022 , H05K2201/0154 , H05K2201/0761 , H05K2201/0909 , H05K2201/09145 , H05K2201/09154 , H05K2201/09827 , H05K2201/09845 , H05K2203/0228 , Y10T156/10
摘要： There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer.
摘要翻译：提供了一种覆铜层压板（CCL），包括：金属板; 绝缘层，其平面面积大于金属板的面积，并且层压在金属板上; 以及层叠在所述绝缘层上的铜层，其中所述绝缘层的边缘向外延伸超过所述金属板的边缘，使得形成将所述金属板的边缘与所述铜层的边缘绝缘的绝缘距离。绝缘层可以包括聚酰亚胺层和聚酰亚胺接合层。

98. 发明授权

US08426746B2 Electronic device and power converter 有权
标题翻译：电子设备和电源转换器
公开(公告)号：US08426746B2
公开(公告)日：2013-04-23
申请号：US13048904
申请日：2011-03-16
申请人： Yasunori Yamanaka
发明人： Yasunori Yamanaka
IPC分类号： H05K1/16
CPC分类号： H05K3/306 , H05K1/0256 , H05K3/3447 , H05K2201/0761 , H05K2201/09063 , H05K2203/1572
摘要： An electronic device includes an electronic component provided with leads. A printed circuit board has a front surface and a back surface and is provided with through holes and a groove hole. The through holes are capable of receiving the leads, respectively. The groove hole is formed so as to cross straight lines that connect the through holes. A first insulating spacer is provided on the groove hole between the leads so as to isolate the leads from each other and is positioned between the electronic component and the front surface of the printed circuit board. A second insulating spacer is inserted through the groove hole from the back surface of the printed circuit board and engages with the first insulating spacer so as to isolate end portions of the leads from each other.
摘要翻译：电子设备包括具有引线的电子部件。印刷电路板具有前表面和后表面，并且设置有通孔和凹槽。通孔能够分别接收引线。凹槽形成为穿过连接通孔的直线。在引线之间的槽孔中设置第一绝缘隔离物，以将引线彼此隔离并且位于电子部件和印刷电路板的前表面之间。第二绝缘隔离物从印刷电路板的后表面穿过槽孔插入，并与第一绝缘垫片接合，以使导线的端部彼此隔离。

99. 发明授权

US08378227B2 Method of forming wiring board and wiring board obtained 有权
标题翻译：形成接线板和接线板的方法
公开(公告)号：US08378227B2
公开(公告)日：2013-02-19
申请号：US12585754
申请日：2009-09-24
申请人： Seiichi Inoue
发明人： Seiichi Inoue
IPC分类号： H05K1/11
CPC分类号： H05K3/246 , H05K1/0256 , H05K1/036 , H05K3/0032 , H05K3/1208 , H05K3/125 , H05K3/28 , H05K2201/0116 , H05K2201/015 , H05K2201/0195 , H05K2201/0347 , H05K2201/0761 , H05K2201/0769 , H05K2201/09036 , H05K2201/09881 , H05K2203/013 , H05K2203/1147 , H05K2203/1173 , Y10T29/49155
摘要： A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an ink-jet system based on image date of the conductive pattern; and a step of performing a migration-proof treatment on at least part of the receptive layer exposed between mutually adjacent wiring portions.
摘要翻译：形成布线板的方法包括：在基板上形成具有多孔结构的接收层的步骤; 基于导电图案的图像日期，通过喷射通过喷墨系统进行拉伸的胶体金属溶液，在接收层的表面上形成所需导电图案中的布线部分的步骤; 以及对相互相邻的布线部之间露出的接受层的至少一部分进行防迁移处理的步骤。

100. 发明授权

US08110434B2 Semiconductor device and memory card using the same 有权
标题翻译：半导体器件和存储卡使用相同
公开(公告)号：US08110434B2
公开(公告)日：2012-02-07
申请号：US12693096
申请日：2010-01-25
申请人： Takashi Okada , Kiyokazu Okada , Akinori Ono , Taku Nishiyama
发明人： Takashi Okada , Kiyokazu Okada , Akinori Ono , Taku Nishiyama
IPC分类号： H01L21/44 , H01L21/50 , H01L21/48 , H01L21/82
CPC分类号： H05K1/0256 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K2201/0761 , H05K2201/09145 , H05K2201/09227 , H05K2203/0228 , H01L2924/00012 , H01L2924/00014
摘要： A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.
摘要翻译：电路板具有设置在其外部形状的至少一侧的弯曲部分。外部连接端子设置在电路板的第一主表面上。半导体元件安装在电路板的第二主表面上。第一布线网络设置在除了第一主表面上的端子区域之外的区域中。第二配线网络设置在第二主表面上。从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离至少一个对方到第二布线网络。

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