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91. 发明申请

US20100284112A1 HEAD SUSPENSION UNIT, HEAD SUSPENSION ASSEMBLY, AND STORAGE DEVICE 审中-公开
标题翻译：头部悬挂单元，头枕悬挂组件和存储装置
公开(公告)号：US20100284112A1
公开(公告)日：2010-11-11
申请号：US12841899
申请日：2010-07-22
申请人： Takeshi OHWE
发明人： Takeshi OHWE
IPC分类号： G11B5/48
CPC分类号： H05K1/0221 , G11B5/486 , H05K1/024 , H05K1/0242 , H05K1/056 , H05K2201/037 , H05K2201/09809
摘要： According to one embodiment, a head suspension unit includes: a head suspension; a thin plate body of a flexure attached to a surface of the head suspension and holding an insulating layer on the surface thereof; a wiring pattern formed on a surface of the insulating layer and forming a hollow conductor defining a hollow space extending along the surface of the insulating layer; and an insulating material filling the hollow space.
摘要翻译：根据一个实施例，头悬挂单元包括：头悬挂; 挠曲件的薄板体，附接到头部悬挂件的表面并在其表面上保持绝缘层; 形成在所述绝缘层的表面上并形成限定沿所述绝缘层的表面延伸的中空空间的中空导体的布线图案; 以及填充中空空间的绝缘材料。

92. 发明申请

US20100259337A1 High speed transmission lines with enhanced coupling 有权
标题翻译：具有增强耦合的高速传输线
公开(公告)号：US20100259337A1
公开(公告)日：2010-10-14
申请号：US12384943
申请日：2009-04-10
申请人： Mohammad Tabatabai
发明人： Mohammad Tabatabai
IPC分类号： H01P3/08
CPC分类号： H01P3/026 , H05K1/024 , H05K1/0245 , H05K2201/0191 , H05K2201/0715 , H05K2201/09236 , H05K2201/09318
摘要： According to one exemplary embodiment, a circuit board for reducing dielectric loss, conductor loss, and insertion loss includes a pair of transmission lines. The pair of transmission lines has sufficient thickness to cause substantial broadside electromagnetic coupling between the pair of transmission lines, where the pair of transmission lines is sufficiently separated from a ground plane of the circuit board so as to cause negligible electromagnetic coupling to the ground plane relative to the substantial broadside electromagnetic coupling. The pair of transmission lines thereby reduce dielectric loss, conductor loss, and insertion loss for signals traversing through the transmission line pair. The pair of transmission lines can be separated from the ground plane by, for example, at least 50.0 mils.
摘要翻译：根据一个示例性实施例，用于降低介质损耗，导体损耗和插入损耗的电路板包括一对传输线。这对传输线具有足够的厚度，以在一对传输线之间产生实质的宽边电磁耦合，其中一对传输线与电路板的接地平面充分分离，从而使接地平面的电磁耦合可以忽略不计到实质的宽边电磁耦合。这对传输线因此减少了穿过传输线对的信号的介质损耗，导体损耗和插入损耗。这对传输线可以通过例如至少50.0密耳从地平面分离。

93. 发明申请

US20100201579A1 USING DIELECTRIC SUBSTRATES, EMBEDDED WITH VERTICAL WIRE STRUCTURES, WITH SLOTLINE AND MICROSTRIP ELEMENTS TO ELIMINATE PARALLEL-PLATE OR SURFACE-WAVE RADIATION IN PRINTED-CIRCUITS, CHIP PACKAGES AND ANTENNAS 有权
标题翻译：使用介质基板，嵌入垂直线结构，具有平面和微阵列元素，以消除印刷电路，芯片包和天线中的平行板或表面波辐射
公开(公告)号：US20100201579A1
公开(公告)日：2010-08-12
申请号：US12651539
申请日：2010-01-04
申请人： Nirod K. Das
发明人： Nirod K. Das
IPC分类号： H01Q1/38
CPC分类号： H01Q1/38 , H05K1/024 , H05K1/0251 , H05K1/0366 , H05K2201/0191 , H05K2201/0195 , H05K2201/0281 , H05K2201/10068
摘要： Substrate arrangements useful for high-performance radio-frequency planar circuits and antennas eliminate excitation of parallel-plate or surface-wave radiations. By eliminating such radiation which escapes sideways through the substrates, the loss of valuable power carried away by these radiations can be avoided, and/or complications resulting from these radiations (e.g., in the form or electromagnetic interference, cross-talk between circuit components or poor signal integrity) can be avoided. A new type of substrate layer is embedded with thin conducting wires that are closely packed and oriented normal to the substrate layering. These conducting wires change the substrate behavior in a unique way. Such new substrate layers may be used in slotline/coplanar waveguide circuits and microstrip antennas to achieve high-performance radio-frequency operations.
摘要翻译：用于高性能射频平面电路和天线的衬底布置消除了平行板或表面波辐射的激发。通过消除通过基板横向逸出的这种辐射，可以避免由这些辐射带走的有价值功率的损失，和/或由这些辐射引起的并发症（例如，形式或电磁干扰，电路部件之间的串扰或信号完整性差）。一种新型的基底层被埋入细密的导线，其紧密堆积并且垂直于基底分层。这些导线以独特的方式改变基板行为。这种新的衬底层可以用于槽线/共面波导电路和微带天线中，以实现高性能的射频操作。

94. 发明授权

US07754970B2 High frequency electronic part 有权
标题翻译：高频电子部件
公开(公告)号：US07754970B2
公开(公告)日：2010-07-13
申请号：US11922330
申请日：2006-05-31
申请人： Yasushi Sasaki , Seiichiro Yokoyama
发明人： Yasushi Sasaki , Seiichiro Yokoyama
IPC分类号： H01B3/44
CPC分类号： H01P3/00 , C08J5/18 , C08J2367/02 , H01Q1/38 , H05K1/024 , H05K1/0373 , H05K1/0393 , H05K3/0011 , H05K2201/0116 , H05K2201/0129 , H05K2201/0212 , H05K2203/0271
摘要： A high frequency electronic part comprising a conductor wiring for transmitting an electric signal of 100 MHz to 100 GHz, and an insulation layer composed of a void containing thermoplastic resin film orientated in at least one direction by stretching. The void containing thermoplastic resin film contains voids in the range between 3% and 45% by volume, the number of voids in a thickness direction of the film is 5 or more, and a ratio of the number of voids to film thickness defined by the following equation is in the range between 0.1 and 10 voids/μm:ratio of the number of voids to film thickness (voids/μm)=the number of voids (voids) in film thickness direction/film thickness (μm).
摘要翻译：一种高频电子部件，包括用于传输100MHz至100GHz的电信号的导体布线，以及由包含通过拉伸至少一个方向取向的热塑性树脂膜的空隙构成的绝缘层。含有热塑性树脂薄膜的空隙含有3〜45体积％的空隙，薄膜的厚度方向的空隙数为5个以上，空隙数与膜厚的比率以下等式为0.1〜10个空隙/μm的范围：空隙数与膜厚的比（空隙/μm）=膜厚方向的空隙数（空隙）/膜厚（μm）。

95. 发明授权

US07667981B1 Multifunctional composite sandwich element with embedded electronics 有权
标题翻译：多功能复合夹层元件与嵌入式电子元件
公开(公告)号：US07667981B1
公开(公告)日：2010-02-23
申请号：US12052805
申请日：2008-03-21
申请人： Barton E. Bennett
发明人： Barton E. Bennett
IPC分类号： H01R12/16
CPC分类号： H05K1/144 , H05K1/0203 , H05K1/0206 , H05K1/024 , H05K1/0366 , H05K3/284 , H05K3/4626 , H05K3/4688 , H05K2201/042 , H05K2201/2036
摘要： A composite sandwich structure carrying an externally applied structural load and having embedded electronics, that in one embodiment includes two multilayered composite facesheet laminates, a central core, embedded electronic components within the central core region, embedded electrical conductors within the central core region, and two multilayer printed circuit laminates that are secondarily bonded or cured to the inner surface of the sandwich facesheet laminates. The electronic components and electrical conductors, which are located in the central core region of the sandwich element, are attached to one or both of the two circuit laminates.
摘要翻译：一种承载外部施加的结构载荷并具有嵌入式电子装置的复合夹层结构，在一个实施例中包括两层多层复合面板层压板，中心芯，中心芯区域内的嵌入式电子元件，中心芯区域内的嵌入式电导体，以及两层多层印刷电路层压体二次结合或固化到夹层板层压板的内表面。位于夹心元件的中心芯区域中的电子元件和电导体连接到两个电路层压板中的一个或两个。

96. 发明授权

US07663064B2 High-speed flex printed circuit and method of manufacturing 有权
标题翻译：高速柔性印刷电路及其制造方法
公开(公告)号：US07663064B2
公开(公告)日：2010-02-16
申请号：US11162720
申请日：2005-09-20
申请人： Achyut Kumar Dutta , Robert Olah
发明人： Achyut Kumar Dutta , Robert Olah
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/024 , H05K1/0393 , H05K3/386 , H05K3/4611 , H05K3/4635 , H05K3/4697 , H05K2201/09536 , H05K2201/09727 , Y10T29/49126
摘要： Multilayer high speed flex printed circuit boards (FLEX-PCBs) are disclosed including a dielectrics systems with the back-side trenches, adhesives, signal lines and ground planes, wherein the signal line and ground plane lane are located on the dielectrics. Using of the open trenches in the substrate help to reduce the microwave loss and dielectric constant and thus increasing the signal carrying speed of the interconnects. Thus, according to the present invention, it is possible to provide a simply constructed multiplayer high speed FLEX-PCB using the conventional material and conventional FLEX-PCB manufacturing which facilitates the design of circuits with controlled bandwidth based on the trench opening in the dielectrics, and affords excellent connection reliability. As the effective dielectric constant is reduced, the signal width is required to make wider or the dielectric thickness is required to make thinner keeping fixed characteristics impedance. The fundamental techniques disclosed here can also be used for high-speed packaging.
摘要翻译：公开了多层高速柔性印刷电路板（FLEX-PCB），其包括具有背面沟槽，粘合剂，信号线和接地平面的电介质系统，其中信号线和接地平面通道位于电介质上。使用衬底中的开放沟槽有助于减少微波损耗和介电常数，从而增加互连的信号承载速度。因此，根据本发明，可以使用常规材料和传统的FLEX-PCB制造提供简单构造的多人高速FLEX-PCB，其有助于基于电介质中的沟槽开口的具有受控带宽的电路的设计，并提供良好的连接可靠性。随着有效介电常数的降低，需要使信号宽度变宽或需要电介质厚度来形成较薄的保持固定特性阻抗。这里公开的基本技术也可用于高速包装。

97. 发明申请

US20100032198A1 CIRCUIT MODULE 审中-公开
标题翻译：电路模块
公开(公告)号：US20100032198A1
公开(公告)日：2010-02-11
申请号：US12528401
申请日：2008-02-20
申请人： Hirobumi Inoue
发明人： Hirobumi Inoue
IPC分类号： H05K1/02
CPC分类号： H05K1/025 , H05K1/0218 , H05K1/024 , H05K1/183 , H05K3/403 , H05K2201/0715 , H05K2201/091 , H05K2201/09154 , H05K2201/09827 , H05K2201/10446 , H05K2201/10484
摘要： An inclined peripheral portion 103 having a tapered shape in a cross-sectional view, in which the thickness thereof is reduced toward the edge of an interconnection substrate 102, is provided at the edge of the interconnection substrate 102. In addition, inner layers 112 are provided such that the distance therebetween is reduced toward the edge of the interconnection substrate in the inclined peripheral portion 103. A first interconnection conductor 104 and a second interconnection conductor 105 are provided on both inclined planes of the inclined peripheral portion 103 so as to be electrically connected to each other at the leading end of the inclined peripheral portion 103.
摘要翻译：在互连基板102的边缘处设置有在横截面视图中具有锥形形状的倾斜周边部分103，其中其厚度朝向互连基板102的边缘减小。另外，内层112 被设置为使得它们之间的距离朝向倾斜周边部分103中的互连基板的边缘减小。第一互连导体104和第二互连导体105设置在倾斜周边部分103的两个倾斜平面上，以便电在倾斜周边部103的前端彼此连接。

98. 发明授权

US07649745B2 Circuit board including stubless signal paths and method of making same 失效
标题翻译：电路板包括无铅信号路径及其制作方法
公开(公告)号：US07649745B2
公开(公告)日：2010-01-19
申请号：US11557709
申请日：2006-11-08
申请人： Pascal Meier , Sanjay Dabral
发明人： Pascal Meier , Sanjay Dabral
IPC分类号： H05K7/00
CPC分类号： H05K3/4611 , H01L2224/16225 , H01L2924/15311 , H05K1/024 , H05K1/112 , H05K1/147 , H05K3/0064 , H05K3/4084 , H05K2201/091 , H05K2201/09318 , H05K2201/10734 , Y10T29/49126
摘要： A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
摘要翻译：电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

99. 发明授权

US07631422B2 Method of manufacturing wiring substrate having terminated buses 有权
标题翻译：具有端接总线的布线基板的制造方法
公开(公告)号：US07631422B2
公开(公告)日：2009-12-15
申请号：US11440113
申请日：2006-05-25
申请人： Kanji Otsuka , Tamotsu Usami
发明人： Kanji Otsuka , Tamotsu Usami
IPC分类号： H05K3/28 , H05K3/30 , H05K3/32
CPC分类号： H04L25/0298 , G06F13/4086 , H01L2224/32225 , H04L25/0266 , H05K1/024 , H05K1/0246 , H05K1/0306 , H05K1/167 , H05K3/284 , H05K2201/09672 , H05K2201/10022 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49146
摘要： A terminal resistor is provided at the end of a bus formed on a wiring substrate. An insulator having a large dielectric loss angle is provided in the vicinity of the terminal resistor to absorb high frequency electromagnetic waves in the vicinity. This arrangement permits successful transmission of digital signals in the GHz region using a conventional terminal resistor.
摘要翻译：端子电阻器设置在形成在布线基板上的总线的端部。在端子电阻附近设置具有大的介电损耗角的绝缘体，以吸收附近的高频电磁波。这种布置允许使用传统的终端电阻器在GHz区域成功传输数字信号。

100. 发明申请

US20090302977A1 METHOD OF MANUFACTURING A TRANSVERSE ELECTRIC MAGNETIC (TEM) MODE TRANSMISSION LINE AND SUCH TRANSMISSION LINE 有权
标题翻译：制造横向电磁（TEM）模式传输线和这种传输线的方法
公开(公告)号：US20090302977A1
公开(公告)日：2009-12-10
申请号：US12442376
申请日：2007-09-24
申请人： Björn Lindmark
发明人： Björn Lindmark
IPC分类号： H01P3/08 , H01P11/00
CPC分类号： H01P3/02 , H01P3/084 , H01P11/001 , H05K1/024 , H05K3/107 , H05K3/202 , H05K2201/09236 , Y10T29/49016
摘要： Method of manufacturing a transmission line including the steps: forming an element with at least one longitudinal groove on a surface of said element, said longitudinal groove being defined by two opposite wall portions in the element and having a longitudinal opening adjacent to said surface, and locating a conductor line in said at least one longitudinal groove. The method is distinguished by the steps: forming the conductor line from a metal strip upon punching the same from a sheet of metal, attaching the metal strip to at least one holding device, and mounting said at least one holding device, with the attached metal strip, on said element, so as to locate said metal strip in said longitudinal groove at a distance from said opposite wall portions of said element. The invention also concerns a transmission line manufactured in accordance with said method.
摘要翻译：一种传输线的制造方法，包括以下步骤：在所述元件的表面上形成具有至少一个纵向凹槽的元件，所述纵向凹槽由元件中两个相对的壁部分限定，并且具有与所述表面相邻的纵向开口，以及将导线定位在所述至少一个纵向凹槽中。该方法的特征在于以下步骤：从金属板冲压金属带形成导体线，将金属带附接到至少一个保持装置，并且将所述至少一个保持装置与所附接的金属在所述元件上的条带，以便将所述金属带定位在所述纵向槽中与所述元件的所述相对壁部分相距一定距离处。本发明还涉及根据所述方法制造的传输线。

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