专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明申请

US20150323739A1 METHOD FOR MAKING A PHOTONIC INTEGRATED CIRCUIT HAVING A PLURALITY OF LENSES 审中-公开
标题翻译：制造具有多孔透镜的光电集成电路的方法
公开(公告)号：US20150323739A1
公开(公告)日：2015-11-12
申请号：US14802504
申请日：2015-07-17
申请人： STMicroelectronics, Inc.
发明人： John Hongguang Zhang
IPC分类号： G02B6/132 , G02B6/136
CPC分类号： G02B6/43 , G02B6/122 , G02B6/124 , G02B6/132 , G02B6/136 , G02B6/42 , G02B6/4214 , G02B2006/12102
摘要： A photonic integrated circuit includes optical circuitry fabricated over an underlying circuitry layer. The optical circuitry includes a dielectric material having recesses disposed within, layers of a light waveguide material deposited within the recesses, and lenses disposed over each layer of waveguide material. The underlying circuitry layer may include, for example, a semiconductor wafer as well as circuitry fabricated during front end of line (FEOL) semiconductor manufacturing such as, for example, sources, gates, drains, interconnects, contacts, resistors, and other circuitry that may be manufactured during FEOL processes. The underlying circuitry layer may also include circuitry manufactured during back end of line semiconductor manufacturing processes such as, for example, interconnect structures, metallization layers, and contacts.
摘要翻译：光子集成电路包括在底层电路层上制造的光电路。光学电路包括具有设置在沉积在凹部内的光波导材料的层内的凹槽的介电材料和设置在每层波导材料上的透镜。底层电路层可以包括例如半导体晶片以及在前端（FEOL）半导体制造期间制造的电路，例如源，栅极，漏极，互连，触点，电阻器和其他电路，其中可以在FEOL过程中制造。底层电路层还可以包括在线半导体制造工艺的后端制造的电路，例如互连结构，金属化层和触点。

92. 发明申请

US20150309261A1 GRATING-COUPLER ASSEMBLY WITH SMALL MODE-FIELD DIAMETER FOR PHOTONIC-INTEGRATED-CIRCUIT SYSTEMS 有权
标题翻译：用于光电集成电路系统的小型模场直径的光栅耦合器组件
公开(公告)号：US20150309261A1
公开(公告)日：2015-10-29
申请号：US14264341
申请日：2014-04-29
申请人： CORNING OPTICAL COMMUNICATIONS LLC
发明人： Andrey Kobyakov , Sergey Anatol'evich Kuchinsky , Xue Liu , Aramais Zakharian
IPC分类号： G02B6/30 , G02B6/122 , G02B6/42 , G02B6/02 , G02B6/124
CPC分类号： G02B6/305 , G02B6/04 , G02B6/1228 , G02B6/124 , G02B6/262 , G02B6/34 , G02B2006/12061 , G02B2006/12107 , G02B2006/12147
摘要： A grating-coupler assembly with a small mode-field diameter for photonic-integrated-circuit systems is disclosed. The assembly includes a silicon waveguide supported by a silicon-on-insulator substrate, and a grating coupler supported by the substrate and optically coupled to the silicon waveguide. The assembly has an optical fiber with a mode-field diameter in the range from 5 μm to 6 μm. One end of the optical fiber is disposed adjacent the grating coupler to define a coupling efficiency of 0.7 or greater.
摘要翻译：公开了一种用于光子集成电路系统的具有小模场直径的光栅耦合器组件。组件包括由绝缘体上硅衬底支撑的硅波导和由衬底支撑并光耦合到硅波导的光栅耦合器。组件具有模场直径在5μm至6μm范围内的光纤。光纤的一端设置在光栅耦合器附近，以确定0.7或更大的耦合效率。

93. 发明申请

US20150309252A1 SILICON PHOTONICS DEVICE AND COMMUNICATION SYSTEM THEREFOR 有权
标题翻译：硅光电设备及其通信系统
公开(公告)号：US20150309252A1
公开(公告)日：2015-10-29
申请号：US14262621
申请日：2014-04-25
申请人： INPHI CORPORATION
发明人： Masaki KATO , Radha NAGARAJAN
IPC分类号： G02B6/12 , G02B6/10
CPC分类号： G02B6/126 , G02B6/105 , G02B6/12 , G02B6/12009 , G02B6/12014 , G02B6/12023 , G02B6/122 , G02B6/124 , G02B6/2773 , G02B6/2861 , G02B6/29325 , G02B6/2938 , G02B2006/12061 , G02B2006/12107 , G02B2006/12123 , G02B2006/1215
摘要： A silicon photonics device and system therefor. The silicon photonics device can include a 300 nm SOI (silicon-on-insulator with 300 nm top Si) overlying a substrate member. A waveguide structure can be configured from a portion of the SOI layer and disposed overlying the substrate member. This waveguide structure can include an AWG (Arrayed Waveguide Gratings) structure with 300 nm×300 nm symmetric grating waveguides or an Echelle grating structure characterized by a top silicon thickness of 300 nm. The waveguide structure can also include an index compensator material configured to provide at least two material index ratings in the waveguide structure.
摘要翻译：一种硅光子器件及其系统。硅光子器件可以包括覆盖在衬底构件上的300nm SOI（具有300nm顶部Si的绝缘体上硅）。波导结构可以由SOI层的一部分配置并且设置在衬底构件上。该波导结构可以包括具有300nm×300nm对称光栅波导的AWG（阵列波导光栅）结构或以300nm的顶部硅厚度为特征的Echelle光栅结构。波导结构还可以包括配置为在波导结构中提供至少两个材料折射率等级的折射率补偿器材料。

94. 发明授权

US09170201B2 Waveguide grating structure and optical measurement arrangement 有权
公开(公告)号：US09170201B2
公开(公告)日：2015-10-27
申请号：US13932278
申请日：2013-07-01
申请人： Artificial Sensing Instruments ASI AG
发明人： Kurt Tiefenthaler
IPC分类号： G02B6/00 , G01N21/64 , G01N21/77 , G01N33/543 , G02B6/12
CPC分类号： G01N21/648 , G01N21/6486 , G01N21/7743 , G01N33/54373 , G01N2021/6463 , G01N2201/08 , G02B6/124 , G02B6/32 , G02B2006/12107 , Y10S385/901
摘要： The present invention describes (bio)chemo-functional waveguide grating structures consisting of at least one (bio)chemo-functional waveguide grating structure unit or at least one (bio)chemo-functional sensor location with beam guidance permitting light beam separation, as well as detection methods for parallel analysis which are marking-free or based on marking.

95. 发明授权

US09164026B2 Packaged chip for multiplexing photonic crystal microcavity coupled waveguide and photonic crystal slot waveguide devices for chip-integrated label-free detection and absorption spectroscopy with high throughput, sensitivity, specificity, and wide dynamic range 有权
标题翻译：用于复用光子晶体微腔耦合波导和光子晶体槽波导器件的封装芯片，用于芯片集成无标签检测和吸收光谱，具有高吞吐量，灵敏度，特异性和宽动态范围
公开(公告)号：US09164026B2
公开(公告)日：2015-10-20
申请号：US14165554
申请日：2014-01-27
申请人： Swapnajit Chakravarty , Amir Hosseini , Ray T. Chen
发明人： Swapnajit Chakravarty , Amir Hosseini , Ray T. Chen
IPC分类号： G01N21/00 , G01N21/25 , G01N21/77 , G01N33/543 , G02B6/122 , B82Y20/00 , G02B6/30 , G02B6/34 , G02B6/124 , G02B6/28 , G02B6/12
CPC分类号： G01N21/253 , B82Y20/00 , G01N21/7746 , G01N33/54373 , G01N2021/7789 , G02B6/1225 , G02B6/124 , G02B6/2813 , G02B6/30 , G02B6/34 , G02B2006/12154
摘要： Systems and methods for chip-integrated label-free detection and absorption spectroscopy with high throughput, sensitivity, and specificity are disclosed. The invention comprises packaged chips for multiplexing photonic crystal microcavity waveguide and photonic crystal slot waveguide devices. The packaged chips comprise crossing waveguides to prevent leakage of fluids from the microfluidic channels from the trenches or voids around the light guiding waveguides. Other embodiments are described and claimed.
摘要翻译：公开了具有高通量，灵敏度和特异性的芯片集成的无标签检测和吸收光谱的系统和方法。本发明包括用于复用光子晶体微腔波导和光子晶体槽波导器件的封装芯片。封装的芯片包括交叉波导，以防止流体从微流体通道从导光波导周围的沟槽或空隙泄漏。描述和要求保护其他实施例。

96. 发明授权

US09162404B2 Radial optical coupler 有权
标题翻译：径向光耦合器
公开(公告)号：US09162404B2
公开(公告)日：2015-10-20
申请号：US13041366
申请日：2011-03-05
申请人： Christopher Doerr
发明人： Christopher Doerr
IPC分类号： G02B6/28 , B23P13/00 , B29D11/00 , G02B6/124 , G02B6/30 , G02B27/09 , G02B27/28 , G11B7/1353 , G11B7/1374 , G02B6/12
CPC分类号： B29D11/00663 , G02B6/124 , G02B6/30 , G02B27/0905 , G02B27/0944 , G02B27/286 , G02B2006/12147 , G11B7/1353 , G11B7/1374
摘要： An optical device includes an optical grating coupler and a plurality of optical waveguides coupled thereto. The optical grating coupler is formed along a planar surface of a substrate, and includes a pattern formed by ridges concentrically located on the surface about a center thereon. Each adjacent pair of ridges is separated by a groove. Each waveguide of the plurality of waveguides is oriented about radially with respect to the center, and has a first end that terminates near an outermost one of the ridges. The first ends are about uniformly spaced along the outermost one of the ridges.
摘要翻译：光学装置包括光栅耦合器和耦合到其上的多个光波导。光栅耦合器沿着衬底的平面形成，并且包括由其周围同心地位于表面上的脊形成的图案。每个相邻的一对脊由凹槽分开。多个波导的每个波导相对于中心径向定向，并且具有在脊的最外面的一个附近终止的第一端。第一端围绕脊的最外面一个均匀间隔开。

97. 发明申请

US20150296610A1 ALUMINUM NITRIDE SUBSTRATE 有权
标题翻译：氮化铝衬底
公开(公告)号：US20150296610A1
公开(公告)日：2015-10-15
申请号：US14680719
申请日：2015-04-07
申请人： Finisar Corporation
发明人： Henry Meyer Daghighian , Steven C. Bird
IPC分类号： H05K1/02 , H05K1/11 , G02B6/12 , G02B6/124 , G02B6/122 , H05K1/03 , G02B6/132
CPC分类号： H05K1/0274 , G02B6/12007 , G02B6/122 , G02B6/1221 , G02B6/124 , G02B6/132 , G02B6/136 , G02B6/42 , G02B6/4214 , G02B6/4269 , G02B2006/12035 , G02B2006/121 , G02B2006/12104 , G02B2006/12107 , G02B2006/12164 , H01P3/081 , H05K1/0201 , H05K1/0207 , H05K1/0209 , H05K1/024 , H05K1/028 , H05K1/032 , H05K1/09 , H05K1/115 , H05K3/323 , H05K3/4605 , H05K3/4611 , H05K3/4614 , H05K3/4638 , H05K3/4688 , H05K2201/0154 , H05K2201/09918
摘要： A printed circuit board may include an aluminum nitride (AlN) substrate that includes an AlN thin film and a layer of high-frequency polymer as a carrier substrate of the AlN thin film. The AlN substrate forms a first layer of the printed circuit board. The AlN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AlN substrate. The main substrate may include one or more additional layers of the printed circuit board.
摘要翻译：印刷电路板可以包括包含AlN薄膜和作为AlN薄膜的载体衬底的高频聚合物层的氮化铝（AlN）衬底。 AlN衬底形成印刷电路板的第一层。 AlN衬底包括散热器，该散热器横向散布来自印刷电路板上的散热器的热量，以形成与印刷电路板上的信号路径平行的散热路径。印刷电路板可以包括与AlN衬底对准并与AlN衬底结合的主衬底。主衬底可以包括印刷电路板的一个或多个附加层。

98. 发明授权

US09143235B2 Multicore chip with holographic optical interconnects 有权
标题翻译：具有全息光学互连的多核芯片
公开(公告)号：US09143235B2
公开(公告)日：2015-09-22
申请号：US13651442
申请日：2012-10-14
申请人： NANO-OPTIC DEVICES, LLC
发明人： Vladimir Yankov , Konstantin Kravtsov , Leonid Velikov
IPC分类号： H04B10/40 , H04B10/80 , G02B6/43 , G02B6/124
CPC分类号： H04B10/40 , G02B6/124 , G02B6/43 , H04B10/801
摘要： The invention provides optical interconnects of data-processing cores of multicore chips by means of digital planar holographic microchips on a host chip. The device comprises “N” laser light sources that generate lights of “N” different wavelength and “N” data-processing cores that produce data. Each data-processing core contains optical signal receivers and modulators/transceivers that receive lights from the laser light sources and have a function of modulating the light obtained from the laser light sources with the data produced by the cores thus producing modulated light signals which are further processed by the holographic microchip and then decoded by the receivers. The device is efficient in that it replaces electrical interconnects between the cores with optical interconnects and can be matched to current semiconductor production technology.
摘要翻译：本发明通过主机芯片上的数字平面全息微芯片提供了多核芯片的数据处理核心的光学互连。该装置包括产生“N”个不同波长的光的“N”个激光光源和产生数据的“N”个数据处理核心。每个数据处理核心包含光信号接收器和调制器/收发器，其接收来自激光光源的光，并且具有通过由核产生的数据调制从激光光源获得的光的功能，从而产生进一步的调制光信号由全息微芯片处理，然后由接收机解码。该器件是有效的，因为它用光学互连替代核心之间的电互连，并且可以与当前的半导体生产技术相匹配。

99. 发明申请

US20150260913A1 GRATING COUPLER FOR INTER-CHIP OPTICAL COUPLING 有权
标题翻译：用于芯片间光耦合的光栅耦合器
公开(公告)号：US20150260913A1
公开(公告)日：2015-09-17
申请号：US13588242
申请日：2012-08-17
申请人： Guoliang Li , Ying L. Luo , Xuezhe Zheng , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Guoliang Li , Ying L. Luo , Xuezhe Zheng , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02B6/124 , G02B6/134 , G02B6/34 , G02B6/122
CPC分类号： G02B6/4296 , G02B6/12004 , G02B6/1228 , G02B6/124 , G02B6/1347 , G02B6/34 , G02B2006/12188 , H01S5/02252 , H01S5/026 , H01S5/1014 , H01S5/1032 , H01S5/14 , H01S5/187
摘要： A photonic integrated circuit (PIC) that includes an optical source that provides an optical signal having a wavelength is described. This optical source includes a reflecting layer, a bottom cladding layer, an active layer (such as a III-V semiconductor) having a bandgap wavelength that exceeds that of silicon, and a top cladding layer. Moreover, an optical coupler (such as a grating coupler) that couples the optical signal out of a plane of the active layer is included in a region of the active layer. In this region, the top cladding layer is absent. Furthermore, in an adjacent region, the top cladding layer includes an inverse taper so that the top cladding layer is tapered down from a width distal from the region. In conjunction with the optical coupler, the inverse taper may facilitate low-loss optical coupling of the optical signal between the PIC and another PIC.
摘要翻译：描述了包括提供具有波长的光信号的光源的光子集成电路（PIC）。该光源包括反射层，底部包层，具有超过硅的带隙波长的有源层（例如III-V半导体）和顶部覆层。此外，将有源层的平面耦合光信号的光耦合器（诸如光栅耦合器）包括在有源层的区域中。在该区域中，顶层包层不存在。此外，在相邻区域中，顶部包层具有倒锥形，使得顶部包层从远离该区域的宽度向下锥形。结合光耦合器，逆锥度可以促进PIC和另一个PIC之间的光信号的低损耗光耦合。

100. 发明申请

US20150247974A1 SPOT-SIZE CONVERTER FOR OPTICAL MODE CONVERSION AND COUPLING BETWEEN TWO WAVEGUIDES 有权
标题翻译：用于光学模式转换和两波形耦合之间的尺寸转换器
公开(公告)号：US20150247974A1
公开(公告)日：2015-09-03
申请号：US14635602
申请日：2015-03-02
申请人： TERAXION INC.
发明人： Yves PAINCHAUD , Marie-Josée PICARD , Christine LATRASSE , Michel POULIN
IPC分类号： G02B6/30
CPC分类号： G02B6/305 , G02B6/12 , G02B6/12002 , G02B6/12004 , G02B6/1223 , G02B6/1228 , G02B6/124 , G02B6/14 , G02B6/30 , G02B2006/12038 , G02B2006/12061 , G02B2006/12147 , G02B2006/12152 , G02B2006/12195
摘要： A spot-size converter for coupling light between first and second waveguides respectively supporting first and second propagation modes having substantially different dimensions is provided. The spot-size converter includes a lower and an upper waveguiding structure each characterized by an effective refractive index. The lower waveguiding structure is coupled to the first waveguide to receive light therefrom or transmit light thereto in the first propagation mode. The upper waveguiding structure is coupled to the second waveguide to transmit light thereto or receive light therefrom in the second propagation mode. The upper waveguiding structure includes a plurality of longitudinally extending high-index elements arranged in multiple vertically spaced rows. At least part of the upper waveguiding structure extends at least partially over the lower waveguiding structure so as to define a coupling region wherein an effective refractive index crossing occurs, thereby enabling evanescent coupling of light between the lower and upper waveguiding structures.
摘要翻译：提供了用于在分别支撑具有基本上不同的尺寸的第一和第二传播模式的第一和第二波导之间耦合光的点尺寸转换器。点尺寸转换器包括每个以有效折射率为特征的下波导结构和上波导结构。较低波导结构耦合到第一波导以从其接收光或在第一传播模式中将光透射到其上。上波导结构耦合到第二波导以在第二传播模式中向其透射光或从其接收光。上部波导结构包括布置在多个垂直间隔的行中的多个纵向延伸的高折射率元件。上部波导结构的至少一部分至少部分地延伸到下部波导结构上方，以便限定发生有效折射率交叉的耦合区域，由此使得能够在下部和上部波导结构之间消逝光耦合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式