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91. 发明申请

US20120152458A1 METHOD FOR PREPARING MULTILAYER ARTICLE BY CURING A CURABLE COMPOSITION COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT 审中-公开
标题翻译：通过固化包含咪唑烷单羧酸盐的可固化组合物制备多层织物的方法
公开(公告)号：US20120152458A1
公开(公告)日：2012-06-21
申请号：US12972648
申请日：2010-12-20
申请人： GOVINDASAMY PARAMASIVAM RAJENDRAN
发明人： GOVINDASAMY PARAMASIVAM RAJENDRAN
IPC分类号： B32B37/12
CPC分类号： C08G59/686 , B32B37/12 , B32B2037/243 , B32B2363/00 , C08G59/621 , C08J5/128 , C08J2379/08 , C08J2463/02 , C08K5/3445 , C08L63/00 , C09J5/06 , C09J2203/326 , C09J2205/102 , C09J2400/163 , C09J2463/00 , C09J2479/086 , H05K3/4635
摘要： A method for preparing a laminated multilayer article is disclosed. In one embodiment, the multilayer article is a conformally sealed printed wiring board. The method comprises contacting a first substrate having a coating to a second substrate such that said coating is disposed between said first and second substrate, forming an uncured multilayer article, applying heat and pressure to said multilayer article thereby forming a cured multilayer article, said coating comprising an uncured epoxy composition comprising a combination of an epoxy, a phenolic curing agent, and an imidazolium monocarboxylate salt, In one embodiment the second substrate is a printed wiring board. Of particular utility are compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.
摘要翻译：公开了一种制备层压多层制品的方法。在一个实施例中，多层制品是共形密封的印刷线路板。该方法包括使具有涂层的第一基底与第二基底接触，使得所述涂层设置在所述第一和第二基底之间，形成未固化的多层制品，对所述多层制品施加热和压力，从而形成固化的多层制品，所述涂层包括未固化的环氧组合物，其包含环氧树脂，酚类固化剂和咪唑单羧酸盐的组合。在一个实施方案中，第二基材是印刷线路板。特别有用的是包含2-乙基-4-甲基咪唑单羧酸盐的组合物。

92. 发明申请

US20120135242A1 THERMOSETTING DIE-BONDING FILM 失效
标题翻译：热成型贴膜
公开(公告)号：US20120135242A1
公开(公告)日：2012-05-31
申请号：US13365071
申请日：2012-02-02
申请人： Yuki SUGO , Sadahito MISUMI , Takeshi MATSUMURA
发明人： Yuki SUGO , Sadahito MISUMI , Takeshi MATSUMURA
IPC分类号： B32B27/38 , C08L63/00
CPC分类号： H01L21/6836 , C08G59/621 , C08L33/06 , C08L2666/04 , C09J163/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/29 , H01L2224/29084 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85001 , H01L2224/85205 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01051 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15788 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/3025 , Y10T428/31511 , H01L2924/0635 , H01L2924/066 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/05442 , H01L2924/0532 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The thermosetting die-bonding film of the present invention is used in manufacturing a semiconductor device, has at least an epoxy resin, a phenol resin, and an acrylic copolymer, and the ratio X/Y is 0.7 to 5 when X represents a total weight of the epoxy resin and the phenol resin and Y represents a weight of the acrylic copolymer.
摘要翻译：本发明的热固性芯片接合薄膜用于制造半导体器件，至少具有环氧树脂，酚醛树脂和丙烯酸共聚物，当X表示总重量时，X / Y的比率为0.7〜5 的环氧树脂和酚醛树脂，Y表示丙烯酸共聚物的重量。

93. 发明申请

US20120121812A1 PROCESS FOR CONTINUOUS PREPARATION OF A PREPOLYMER BASED ON PHENOLIC RESINS, OXAZOLINES AND EPOXIDES 有权
标题翻译：用于连续制备基于酚醛树脂，氧化腈和环氧化物的预聚物的方法
公开(公告)号：US20120121812A1
公开(公告)日：2012-05-17
申请号：US13297906
申请日：2011-11-16
申请人： Marianne OMEIS , Franz-Albert von Itter , Thomas Weihrauch
发明人： Marianne OMEIS , Franz-Albert von Itter , Thomas Weihrauch
IPC分类号： C08G65/38 , C08K5/13 , B05D3/00 , C03C17/32 , B05D7/00 , C08K5/17 , C08L63/00
CPC分类号： C08L61/04 , B29C47/38 , B29C47/92 , C08G59/022 , C08G59/504 , C08G59/621 , C08G59/687 , C08G73/0233 , C08K7/14 , C08L61/06 , C08L63/00 , C09J161/06 , Y10T428/24994
摘要： Process for the continuous preparation of prepolymers based on phenolic resin, an oxazoline component and an epoxide in the presence of a catalyst, including supplying the phenolic resin and the oxazoline component to an extruder in a stream A; a Lewis adduct of boron trifluoride or of aluminium trichloride, or arylsulphonic acids or alkylsulphonic acids, or latent arylsulphonic acids or latent alkylsulphonic acids, in a stream B, and the epoxide in a stream C, the infeed of stream A being situated, as seen in extrusion direction, before the infeed of stream C, these reactants are mixed at a reaction temperature of 120 to 200° C. with a residence time in the extruder of 3 seconds to 15 minutes, and then the product discharge of the extruder is cooled to a temperature of less than 45° C. within from 30 to 60 seconds.
摘要翻译：在催化剂存在下连续制备基于酚醛树脂，恶唑啉组分和环氧化物的预聚物的方法，包括将酚醛树脂和恶唑啉组分供给流A中的挤出机; 流B中的三氟化硼或三氯化铝或芳基磺酸或烷基磺酸或潜在芳基磺酸或潜在烷基磺酸的路易斯加合物和流C中的环氧化物，流A所在的进料如所见在挤出方向上，在流C进料之前，将这些反应物在120〜200℃的反应温度下在挤出机中的停留时间混合3秒至15分钟，然后将挤出机的产物排出物冷却在30至60秒内温度低于45℃。

94. 发明申请

US20120077904A1 Epoxy Resin Composition 失效
标题翻译：环氧树脂组合物
公开(公告)号：US20120077904A1
公开(公告)日：2012-03-29
申请号：US13249416
申请日：2011-09-30
申请人： Guangchao XIE , Xingming CHENG
发明人： Guangchao XIE , Xingming CHENG
IPC分类号： C08L63/02 , C08K3/22 , C08L61/06 , C08K3/36
CPC分类号： C09K21/14 , C08G59/226 , C08G59/302 , C08G59/621 , C08L63/00 , H01L23/293 , H01L2924/0002 , C08L2666/22 , H01L2924/00
摘要： The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R1 and R2 are independently hydrogen or alkyl of C1-C6; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture.
摘要翻译：本发明提供一种包含环氧树脂，酚醛树脂，固化促进剂和无机填料的环氧树脂组合物; 所述环氧树脂包括：（1）20-50％的式I; （2）式Ⅱ的10-40％和（3）0-30％的式III和/或0-40％的式IV，其中式III和式IV不同时为0％; 并且其中，R 1和R 2独立地是氢或C 1 -C 6的烷基; n是式I中0至50的整数; 所述酚醛树脂中的酚羟基数与环氧树脂混合物中的环氧基数之比为0.8-1.3; 所有百分比都是相对于环氧树脂混合物总质量的百分数。

95. 发明授权

US08129495B2 Coating compositions for containers and methods of coating 有权
标题翻译：容器用涂料组合物和涂料方法
公开(公告)号：US08129495B2
公开(公告)日：2012-03-06
申请号：US13026862
申请日：2011-02-14
申请人： Richard H. Evans , Robert M. O'Brien , Rachael A. Spynda
发明人： Richard H. Evans , Robert M. O'Brien , Rachael A. Spynda
IPC分类号： C08G63/54
CPC分类号： C08G59/182 , C08G59/621 , C09D5/02 , C09D163/00 , C09D167/00 , Y10T428/13 , Y10T428/1317 , Y10T428/1321 , Y10T428/1324 , Y10T428/1352 , Y10T428/139
摘要： This invention provides a coating composition for use on a food-contact surface of a container (e.g., a food or beverage can) that includes a polymer having one or more segments of Formula I: —O—Ar—Rn—C(O)—O—R1—O—C(O)—Rn—Ar—O— wherein each Ar is independently a divalent aryl group (i.e., an arylene group) or heteroarylene group; R1 is a divalent organic group; each R is independently a divalent organic group; and n is 0 or 1. Containers comprising the polymer and methods of making such containers are also provided.
摘要翻译：本发明提供一种用于食品接触表面的涂料组合物，其包括具有一个或多个式I的链段的聚合物：-O-Ar-Rn-C（O）的容器（例如食品或饮料罐） -O-R1-O-C（O）-Rn-Ar-O-，其中每个Ar独立地是二价芳基（即亚芳基）或杂亚芳基; R1是二价有机基团; 每个R独立地是二价有机基团; 并且n为0或1.还提供了包含聚合物的容器和制备这种容器的方法。

96. 发明申请

US20110288259A1 PROCESS FOR PRODUCTION OF THERMOPLASTIC CURED EPOXY RESIN WITH TRANSPARENCY TO VISIBLE LIGHT, AND THERMOPLASTIC EPOXY RESIN COMPOSITION 审中-公开
标题翻译：用于生产具有透明度的可见光的热塑性固化环氧树脂的方法和热塑性环氧树脂组合物
公开(公告)号：US20110288259A1
公开(公告)日：2011-11-24
申请号：US13143856
申请日：2010-01-08
申请人： Yutaka Tsujimura
发明人： Yutaka Tsujimura
IPC分类号： C08G59/64 , C08G59/50
CPC分类号： C08G59/686 , C08G59/504 , C08G59/621 , C08G59/64 , C08L63/00
摘要： A process for the production of a thermoplastic cured epoxy resin which is transparent to visible light, characterized by curing (A) an epoxy compound having two epoxy groups in one molecule with (B) a compound having two phenolic hydroxyl groups in one molecule by means of (C) a cure accelerator consisting of at least one compound represented by general formula (1): Rn-NHm (1) [wherein R is a monovalent C2-10 hydrocarbon group which may have a hydroxyl group at the β position to the nitrogen atom (with the proviso that when R has three or more carbon atoms, R includes both straight-chain and branched-chain hydrocarbon groups); when R has no hydroxyl group, R has a number of carbon atoms of 3 to 10; n is an integer of 1 to 3, and m is an integer of 2 to 0, with the sum of n and m being 3; and when multiple Rs are present, the Rs may be the same or different].
摘要翻译：一种对可见光透明的热塑性固化环氧树脂的生产方法，其特征在于：（A）在一分子中具有两个环氧基的环氧化合物，（B）一分子中具有两个酚羟基的化合物（C）由至少一种由通式（1）表示的化合物组成的固化促进剂：Rn-NHm（1）[其中R是可以具有羟基的一价C 2-10烃基; 位置为氮原子（条件是当R具有三个或更多个碳原子时，R包括直链和支链烃基）; 当R不含羟基时，R的碳原子数为3〜10; n为1〜3的整数，m为2〜0的整数，n和m的和为3; 并且当存在多个Rs时，Rs可以相同或不同]。

97. 发明授权

US08058363B2 Varnish and prepreg, and substrates thereof 有权
标题翻译：清漆和预浸料，及其底材
公开(公告)号：US08058363B2
公开(公告)日：2011-11-15
申请号：US12385465
申请日：2009-04-09
申请人： Bin Jian , Li-Chun Chen
发明人： Bin Jian , Li-Chun Chen
IPC分类号： C08L63/00
CPC分类号： H05K1/0326 , B32B5/02 , B32B5/24 , B32B17/04 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/3065 , B32B2307/308 , B32B2307/7246 , B32B2307/7265 , B32B2457/08 , C08G59/4071 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/013 , C08K5/357 , C08K5/5317 , C09D163/00 , C09D163/04 , H05K2201/012 , Y10T442/20
摘要： A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low absorbent ability. Furthermore, the composite curing agent can be provided for higher curing rate.
摘要翻译：清漆包括树脂和复合固化剂。复合固化剂包括聚苯撑甲基膦酸酯树脂的固化剂和酚醛树脂的固化剂。将玻璃织物浸渍在清漆中，形成具有更好的热稳定性，抗燃性和低吸收能力的预浸料。此外，可以提供复合固化剂以提高固化速度。

98. 发明授权

US08022140B2 Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent 有权
标题翻译：环氧树脂，苯乙烯 - 马来酸酐共聚物和交联剂
公开(公告)号：US08022140B2
公开(公告)日：2011-09-20
申请号：US11637222
申请日：2006-12-11
申请人： Franz Tikart , Karl-Heinz Leis , Karl Walter Kopp
发明人： Franz Tikart , Karl-Heinz Leis , Karl Walter Kopp
IPC分类号： B32B27/04 , B32B27/38 , C08K7/14 , C08L25/08 , C08L63/02
CPC分类号： C08L35/06 , B32B15/14 , C08G59/4246 , C08G59/621 , C08K5/3445 , C08L63/00 , H05K1/0326 , Y10T428/249951 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , C08L2666/14 , C08L2666/04
摘要： A composition useful as an impregnant for the making of laminates for printed wiring boards including an epoxy resin, a first cross-linking agent of a strene-maleic anhydride copolymer and a second co-cross-linking agent.
摘要翻译：可用作制造用于印刷线路板的层压材料的浸渍剂的组合物，其包括环氧树脂，第一共聚马来酸酐共聚物的第一交联剂和第二共交联剂。

99. 发明申请

US20110223383A1 SEMI-CURED BODY, CURED BODY, MULTILAYER BODY, METHOD FOR PRODUCING SEMI-CURED BODY, AND METHOD FOR PRODUCING CURED BODY 审中-公开
标题翻译：半固化体，固化体，多层体，生产半固体的方法以及生产固化体的方法
公开(公告)号：US20110223383A1
公开(公告)日：2011-09-15
申请号：US13119017
申请日：2009-09-18
申请人： Nobuhiro Goto , Masaru Heishi , Junnosuke Murakami
发明人： Nobuhiro Goto , Masaru Heishi , Junnosuke Murakami
IPC分类号： B32B15/092 , B32B3/00 , C08J3/20 , C08K3/36 , C08L63/00
CPC分类号： C08L63/00 , C08G59/621 , C08G59/686 , C08J7/047 , C08K3/36 , C08K9/06 , C23C18/1653 , C23C18/22 , Y10T428/24355 , Y10T428/31529
摘要： Provided is: a semi-cured body capable of reducing the surface roughness of a roughening-treated surface, and, when a metal layer is formed on the surface of a cured body after curing, increasing the adhesive strength between the cured body and the metal layer; and a laminated body obtained by using the semi-cured body.A semi-cured body 1 is formed by performing a roughening treatment on a reactant obtained by reacting a resin composition which includes an epoxy resin, a curing agent, and a silica component in which silica particles with a mean particle diameter equal to or less than 1 μm are surface treated with a sane coupling agent, such that the reactant has a gel fraction equal to or higher than 90% after being immersed in methyl ethyl ketone for 24 hours at 23° C. A laminated body comprises a cured body obtained by curing the semi-cured body 1, and a metal layer formed by having a plate processing performed on the surface of the cured body. The adhesive strength between the cured body and the metal layer is equal to or larger than 4.9/cm.
摘要翻译：提供：能够降低粗糙化处理面的表面粗糙度的半固化体，并且当固化后在固化体的表面上形成金属层时，增加固化体与金属之间的粘合强度层; 以及使用半固化体而得到的层叠体。通过对包含环氧树脂的树脂组合物，固化剂和二氧化硅组分反应而得到的反应物进行粗糙化处理，其中二氧化硅颗粒的平均粒径等于或小于 1μm用合适的偶联剂进行表面处理，使得反应物在23℃下浸入甲基乙基酮24小时后具有等于或高于90％的凝胶分数。层压体包含由固化半固化体1和通过在固化体的表面上进行板加工而形成的金属层。固化体与金属层之间的粘合强度等于或大于4.9 / cm。

100. 发明申请

US20110120614A1 THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM 审中-公开
标题翻译：热固性胶膜，带薄膜的粘合膜，以及使用热固性胶膜制造半导体器件的方法或带有薄膜的粘合膜
公开(公告)号：US20110120614A1
公开(公告)日：2011-05-26
申请号：US12948992
申请日：2010-11-18
申请人： Yuki Sugo , Kouichi Inoue , Kenji Oonishi
发明人： Yuki Sugo , Kouichi Inoue , Kenji Oonishi
IPC分类号： H01L21/50 , B32B5/00 , B32B3/00 , C09J7/00 , C09J7/02
CPC分类号： C08G59/621 , C08L33/00 , C08L33/08 , C08L61/04 , C08L63/00 , C08L63/08 , C08L71/00 , C08L2205/03 , C08L2666/02 , C09J7/10 , C09J133/08 , C09J161/06 , C09J163/00 , C09J2201/61 , C09J2203/326 , C09J2433/00 , C09J2461/00 , C09J2463/00 , H01L21/561 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/29023 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83097 , H01L2224/83191 , H01L2224/83855 , H01L2224/85097 , H01L2224/85205 , H01L2224/9205 , H01L2224/92165 , H01L2224/92247 , H01L2224/94 , H01L2924/00013 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01047 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/3025 , Y10T156/10 , Y10T428/24355 , Y10T428/265 , H01L2224/27 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/3512 , H01L2924/00012 , H01L2224/85399
摘要： The present invention provides a thermosetting adhesive film that is capable of improving the package reliability by preventing damage of a semiconductor chip due to pressure during die bonding of the film having a configuration where a filler is not substantially added, preventing a decrease of tensile storage modulus and preventing generation of warping due to heat shrinkage during thermosetting. It is a thermosetting adhesive film used at the time of manufacturing a semiconductor device, the film having a tensile storage modulus at 260° C. after thermosetting of 2×105 to 5×107 Pa, a content of a filler of 0.1% by weight or less based on the entire thermosetting adhesive film, and a thickness of 1 to 10 μm.
摘要翻译：本发明提供一种热固性粘合剂膜，其能够通过防止由于在具有未充分填充填料的构造的膜的芯片接合期间的压力导致的半导体芯片的损坏而提高封装可靠性，防止了拉伸储能模量的降低并且防止由于热固化期间的热收缩而产生翘曲。作为制造半导体装置时使用的热固性粘合膜，该膜在2×105〜5×107Pa的热固化后的拉伸储能模量为260℃，填料的含量为0.1重量％或更低，基于整个热固性粘合剂膜，厚度为1至10μm。

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