专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

91. 发明申请

US20110034107A1 METHOD AND APPARATUS FOR RECIPROCAL POLISHING 审中-公开
标题翻译：回归抛光方法与装置
公开(公告)号：US20110034107A1
公开(公告)日：2011-02-10
申请号：US12792459
申请日：2010-06-02
申请人： Zine-Eddine Boutaghou
发明人： Zine-Eddine Boutaghou
IPC分类号： B24B49/00
CPC分类号： B24B1/04 , B24B37/048 , B24B37/26
摘要： A polishing pad is located on a reciprocal motion generator. The polishing pad includes a plurality of discrete fluid channels. An abrasive article is located on the polishing pad. The abrasive article is reciprocally energized relative to the work piece. A fluid pressure in one or more of the discrete fluid channels is altered to selectively deform the abrasive article to preferentially remove material from the work piece.
摘要翻译：抛光垫位于往复运动发生器上。抛光垫包括多个分立的流体通道。磨料制品位于抛光垫上。研磨制品相对于工件相互通电。一个或多个离散流体通道中的流体压力被改变以选择性地使磨料制品变形以优先地从工件移除材料。

92. 发明申请

US20110021114A1 ABRASIVE ARTICLE WITH PRECONDITIONING AND PERSISTENT INDICATORS 审中-公开
标题翻译：具有预处理和随机指示的磨料文章
公开(公告)号：US20110021114A1
公开(公告)日：2011-01-27
申请号：US12509707
申请日：2009-07-27
申请人： James L. McArdle , Ann M. Hawkins , William C. Quade , Martin Kubik
发明人： James L. McArdle , Ann M. Hawkins , William C. Quade , Martin Kubik
IPC分类号： B24B49/00 , B24D7/14
CPC分类号： B24D11/00 , B24B37/245 , B24B37/26
摘要： An abrasive article with a backing having a first major surface and a second major surface opposed to the first major surface. A three-dimensional abrasive layer attached to the first major surface, the three-dimensional abrasive layer comprising a plurality of shaped abrasive composites spaced apart by a plurality of land areas between the shaped abrasive composites, each of the shaped abrasive composites comprising a top surface and a sidewall, and the plurality of shaped abrasive composites and the plurality of land areas both formed from abrasive particles dispersed within an organic binder. A preconditioning indicator located on the top surface of at least some of the plurality of shaped abrasive composites and a persistent indicator located on at least some of the plurality of land areas.
摘要翻译：具有背衬的磨料制品，其具有与第一主表面相对的第一主表面和第二主表面。连接到第一主表面的三维研磨层，三维研磨层包括多个成形的研磨复合材料，所述多个成形的磨料复合物由成形的磨料复合材料之间的多个区域间隔开，每个成形磨料复合材料包括顶表面和侧壁，并且所述多个成形磨料复合物和所述多个磨土区域均由分散在有机粘合剂中的磨料颗粒形成。位于多个成形磨料复合物中的至少一些的顶表面上的预处理指示器和位于多个区域中的至少一些区域上的持久指示器。

93. 发明申请

US20110014858A1 GROOVED CMP POLISHING PAD 审中-公开
标题翻译：抛光CMP抛光垫
公开(公告)号：US20110014858A1
公开(公告)日：2011-01-20
申请号：US12837705
申请日：2010-07-16
申请人： Ching-Ming TSAI , Fred Sun , Sheng-Huan Liu , Jia-Cheng Hsu , Ananth Naman , Hao-Kuang Chiu , Dinesh Khanna
发明人： Ching-Ming TSAI , Fred Sun , Sheng-Huan Liu , Jia-Cheng Hsu , Ananth Naman , Hao-Kuang Chiu , Dinesh Khanna
IPC分类号： B24D11/00
CPC分类号： B24B37/26
摘要： The present invention provides polishing pads for use in CMP processes. In one embodiment, a pad comprises a surface defining a plurality of grooves with landing surfaces separating the grooves, the landing surfaces together defining a substantially coplanar polishing surface, each groove having a depth of at least about 10 mil and a width, WG, with any two adjacent grooves being separated from each other a landing surface having a width, WL, wherein the quotient WL/WG is less than or equal to 3. In a preferred embodiment, the surface of the pad defines a series of concentric substantially circular grooves. In an alternative embodiment, the surface of the pad defines a spiral groove having a depth of at least about 10 mil and a width WG, and a spiral landing surface outlining spiral groove the having a width, WL, wherein the spiral landing surface defines a substantially coplanar polishing surface and the quotient WL/WG is less than or equal to 3.
摘要翻译：本发明提供了用于CMP工艺的抛光垫。在一个实施例中，垫包括限定具有分离凹槽的着陆表面的多个凹槽的表面，所述着陆表面一起限定基本上共面的抛光表面，每个凹槽具有至少约10密耳的深度和宽度WG，任何两个相邻的凹槽彼此分开具有宽度WL的着陆表面，其中商WL / WG小于或等于3.在优选实施例中，垫的表面限定了一系列同心的大致圆形的凹槽。在替代实施例中，垫的表面限定具有至少约10密耳深度和宽度WG的螺旋槽，以及螺旋着陆表面，其具有宽度为WL的螺旋槽，其中螺旋着陆表面限定了基本上共面的抛光表面和商WL / WG小于或等于3。

94. 发明授权

US07635290B2 Interpenetrating network for chemical mechanical polishing 有权
公开(公告)号：US07635290B2
公开(公告)日：2009-12-22
申请号：US11839376
申请日：2007-08-15
申请人： Gregory P. Muldowney
发明人： Gregory P. Muldowney
IPC分类号： B24B49/00
CPC分类号： B24B37/26 , B24B37/22 , B24B37/24 , Y10T428/24355
摘要： Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.

95. 发明授权

US07632170B2 CMP apparatuses with polishing assemblies that provide for the passive removal of slurry 有权
标题翻译：具有抛光组件的CMP设备，其提供浆料的被动去除
公开(公告)号：US07632170B2
公开(公告)日：2009-12-15
申请号：US11768045
申请日：2007-06-25
申请人： Fergal O'Moore , Steve Schultz , Brian Severson
发明人： Fergal O'Moore , Steve Schultz , Brian Severson
IPC分类号： B24B7/04 , B24B11/00
CPC分类号： B24B37/26
摘要： Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a polishing surface and an exhaust aperture that extends through the polishing pad from the polishing surface and is configured to receive a slurry from the polishing surface. An underlying member is disposed underlying the polishing pad and comprises a peripheral surface. The underlying member comprises a channel that is in fluid communication with the aperture and that opens at the peripheral surface of the underlying member.
摘要翻译：提供了具有抛光组件的化学机械平面化设备，其提供被动去除浆料。根据实施例，工件抛光组件包括抛光垫，抛光垫包括抛光表面和排出孔，其从抛光表面延伸穿过抛光垫并被构造成从抛光表面接收浆料。下部构件设置在抛光垫下方并且包括外围表面。底部构件包括与孔隙流体连通并且在底部构件的外围表面处开口的通道。

96. 发明申请

US20090298395A1 APPARATUS AND METHOD FOR REDUCING REMOVAL FORCES FOR CMP PADS 失效
标题翻译：用于减少CMP PADS的去除力的装置和方法
公开(公告)号：US20090298395A1
公开(公告)日：2009-12-03
申请号：US12535445
申请日：2009-08-04
申请人： Trent T. Ward
发明人： Trent T. Ward
IPC分类号： B24B7/20 , B24D11/00 , B24B1/00 , B24D3/00
CPC分类号： B24B37/11 , B24B37/14 , B24B37/16 , B24B37/24 , B24B37/26 , B24B45/00 , B24D3/34 , B24D11/02
摘要： An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.
摘要翻译：用于平坦化基板的抛光装置的改进包括对压板表面的低粘附材料的坚固涂层。消耗性抛光垫粘附到低粘附材料上，并且可以以大大减少的力消耗来去除周期性更换。通过常规粘合剂连接到诸如聚四氟乙烯（PTFE）的低附着材料的抛光垫在抛光过程中可以抵抗变形，但是容易取出来进行更换。

97. 发明授权

US07604529B2 Three-dimensional network for chemical mechanical polishing 有权
标题翻译：三维网络化学机械抛光
公开(公告)号：US07604529B2
公开(公告)日：2009-10-20
申请号：US11449358
申请日：2006-06-08
申请人： Gregory P. Muldowney
发明人： Gregory P. Muldowney
IPC分类号： B24B7/22
CPC分类号： B24B37/26
摘要： The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (208) form the three-dimensional network of interconnected unit cells (225). The polishing elements (208) have a mean height (214) to a mean width (222) ratio of at least 3. The polishing surface (200) formed from the plurality of polishing elements (208) remains consistent for multiple polishing operations.
摘要翻译：抛光垫（104）可用于在抛光介质（120）的存在下抛光磁性，光学和半导体衬底（112）中的至少一种。抛光垫（104）包括互连单元电池（225）的三维网络。互连的单元电池（225）被网状以允许流体流动和去除抛光碎片。多个抛光元件（208）形成互连单元电池（225）的三维网络。抛光元件（208）的平均高度（214）至平均宽度（222）比至少为3.由多个抛光元件（208）形成的抛光表面（200）对于多次抛光操作保持一致。

98. 发明申请

US20090258587A1 POLISHING PAD HAVING GROOVE STRUCTURE FOR AVOIDING THE POLISHING SURFACE STRIPPING 有权
标题翻译：用于避免抛光表面剥落的抛光结构的抛光垫
公开(公告)号：US20090258587A1
公开(公告)日：2009-10-15
申请号：US12139525
申请日：2008-06-16
申请人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
发明人： Chung-Chih Feng , Wei-Te Liu , Yung-Chang Hung , Chun-Ta Wang , I-Peng Yao
IPC分类号： B24D11/00
CPC分类号： B24B37/26
摘要： The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. Whereby, the polishing pad of present invention is capable to contain more grinding liquid, and is contributive to clean the small grinded pieces. Furthermore, the grinding layer does not have acute structure and is not easy to peel to form the small grinded pieces. Therefore, the grinding quality and grinding effect can be improved.
摘要翻译：本发明涉及一种具有用于避免抛光表面剥离的凹槽结构的抛光垫。本发明的抛光垫包括基材和研磨层。基材具有表面。磨削层设置在表面上，并且暴露基体材料边缘周围的一部分表面。研磨层具有多个第一凹槽和第二凹槽，并且第一凹槽与第二凹槽交叉以限定多个研磨区域。围绕基材边缘的表面的暴露部分位于第一凹槽，第二凹槽和抛光垫的边缘之间。因此，本发明的抛光垫能够容纳更多的研磨液，并且有助于清洁小的研磨件。此外，研磨层不具有尖锐的结构，并且不容易剥离以形成小的研磨件。因此，可以提高研磨质量和研磨效果。

99. 发明授权

US07585425B2 Apparatus and method for reducing removal forces for CMP pads 失效
公开(公告)号：US07585425B2
公开(公告)日：2009-09-08
申请号：US11339784
申请日：2006-01-25
申请人： Trent T. Ward
发明人： Trent T. Ward
IPC分类号： C03C15/00 , C03C25/68
CPC分类号： B24B37/11 , B24B37/14 , B24B37/16 , B24B37/24 , B24B37/26 , B24B45/00 , B24D3/34 , B24D11/02
摘要： An improvement in a polishing apparatus for planarizing substrates comprises a tenacious coating of a low-adhesion material to the platen surface. An expendable polishing pad is adhesively attached to the low-adhesion material, and may be removed for periodic replacement at much reduced expenditure of force. Polishing pads joined to low-adhesion materials such as polytetrafluoroethylene (PTFE) by conventional adhesives resist distortion during polishing but are readily removed for replacement.

100. 发明授权

US07553214B2 Polishing article with integrated window stripe 失效
标题翻译：具有集成窗口条纹的抛光物品
公开(公告)号：US07553214B2
公开(公告)日：2009-06-30
申请号：US11707548
申请日：2007-02-15
申请人： Gregory E. Menk , Peter McReynolds , Erik S. Rondum , Anand N. Iyer , Gopalakrishna B. Prabhu , Garlen C. Leung
发明人： Gregory E. Menk , Peter McReynolds , Erik S. Rondum , Anand N. Iyer , Gopalakrishna B. Prabhu , Garlen C. Leung
IPC分类号： B24B49/12 , B24D11/00
CPC分类号： B24B21/06 , B24B21/04 , B24B21/12 , B24B37/12 , B24B37/205 , B24B37/26 , B24D11/001
摘要： A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.
摘要翻译：描述了一种方法。该方法包括使非固体材料与抛光材料片的非线性边缘接触，并使非固体材料固化以形成接触抛光材料的非线性边缘的窗口。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式