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    • 93. 发明授权
    • Output slew rate control in low voltage differential signal (LVDS) driver
    • 低电压差分信号(LVDS)驱动器中的输出转换速率控制
    • US07843235B2
    • 2010-11-30
    • US11948993
    • 2007-11-30
    • Wang YanboTao Li
    • Wang YanboTao Li
    • H03B1/00
    • H03K19/018521H03K19/00361H03K19/018528H04L25/0272H04L25/028
    • A differential signal driver includes a pre-driver configured to generate a constant charging current and a constant discharging current. A first capacitor of the pre-driver is charged with the charging current when a differential input signal has a first state, and discharged with the discharging current when the differential input signal has a second state, thereby developing a first output control voltage on the first capacitor. A second capacitor of the pre-driver is discharged with the discharging charging current when the differential input signal has the first state, and charged with the charging current when the differential input signal has the second state, thereby developing a second output control voltage on the second capacitor. An output driver circuit generates a differential output signal in response to the first and second output control voltages. The slew rate of the differential output signal is controlled by the charging and discharging currents.
    • 差分信号驱动器包括配置成产生恒定充电电流和恒定放电电流的预驱动器。 当差分输入信号具有第一状态时,预驱动器的第一电容器充电充电电流,并且当差分输入信号具有第二状态时以放电电流放电,从而在第一电容器上产生第一输出控制电压 电容器。 当差分输入信号具有第一状态时,预驱动器的第二电容器以放电充电电流放电,并且当差分输入信号具有第二状态时充满充电电流,从而在第二电容器上产生第二输出控制电压 第二电容器。 输出驱动器电路响应于第一和第二输出控制电压产生差分输出信号。 差分输出信号的转换速率由充放电电流控制。
    • 95. 发明授权
    • Heat sink assembly with a locking device
    • 带有锁定装置的散热器组件
    • US07746643B2
    • 2010-06-29
    • US11831930
    • 2007-07-31
    • Hao LiJun LongTao Li
    • Hao LiJun LongTao Li
    • H05K7/20H01L23/34H01L23/26A44B21/00
    • H01L23/4093H01L2924/0002Y10T24/44026Y10T24/44034H01L2924/00
    • A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.
    • 散热器组件包括具有第一肩部和第二肩部的散热器,以及具有保持模块,第一夹子和第二夹子的锁定装置。 第一夹子具有与保持模块接合的两个延伸部分和两个延伸部分之间的按压部分。 所述第二夹具包括位于所述第二肩部上的按压部,与所述按压部分连接并与所述保持模块可枢转地接合的轴和与所述按压部连接的锁定部。 当散热器组件处于解锁位置时,第二夹子可绕其轴线旋转; 当散热器组件处于锁定位置时,锁定部分与保持模块接合并且按压部分将散热器的第二肩部朝向保持模块按压。
    • 98. 发明授权
    • Method for burning chips
    • 烧芯片的方法
    • US07613916B2
    • 2009-11-03
    • US11306524
    • 2005-12-30
    • Tao LiChun-Yang Wu
    • Tao LiChun-Yang Wu
    • G06F15/177
    • G06F9/4401
    • A method for burning a BIOS chip (108) and a network card chip (107) that are attached on a motherboard (106), includes the steps of: storing a plurality of MAC addresses in a burning device (102); loading a BIOS file and a network card file into the burning device; sending the BIOS file from the burning device to a burning card (104), and burning the BIOS file into the BIOS chip via the burning card; the burning device sending the network card file which includes a MAC address from the burning device to the burning card, and burning the network card file into the network card chip via the burning card; and verifying whether the BIOS chip and the network card chip have been burned correctly.
    • 一种用于刻录安装在主板(106)上的BIOS芯片(108)和网卡芯片(107)的方法,包括以下步骤:将多个MAC地址存储在刻录设备(102)中; 将BIOS文件和网卡文件加载到刻录设备中; 将所述BIOS文件从所述刻录设备发送到刻录卡(104),并且经由所述刻录卡将所述BIOS文件烧录到所述BIOS芯片中; 所述燃烧装置将包括从所述刻录装置的MAC地址的所述网卡文件发送到所述刻录卡,以及经由所述刻录卡将所述网卡文件刻录到所述网卡芯片中; 并验证BIOS芯片和网卡芯片是否正确烧录。
    • 100. 发明授权
    • Heat sink with heat pipes
    • 带热管的散热器
    • US07520316B2
    • 2009-04-21
    • US11244912
    • 2005-10-05
    • Wan-Lin XiaTao LiMin-Qi Xiao
    • Wan-Lin XiaTao LiMin-Qi Xiao
    • F28D15/00H05K7/20
    • H01L23/467F28D15/0275H01L23/427H01L2924/0002H01L2924/00
    • A heat sink with heat pipes includes a base (10). The base includes a bottom surface contacting a heat-generating component (40), an upper surface opposite to the bottom surface, and a plurality of grooves (14) defined on the upper surface of the base. The heat sink further includes two heat pipes (32, 36) received in the grooves, each heat pipe comprising an evaporating section (322, 362) and a condensing section (324, 364) respectively, wherein the evaporating sections of the heat pipes are closely arranged on a portion of the base, and wherein the condensing sections of the heat pipes spread out from said portion of the base by extending in the grooves to other parts of the base so that heat absorbed by the base from the heat-generating component can be evenly spread to the whole base.
    • 具有热管的散热器包括基座(10)。 基部包括与发热部件(40)接触的底面,与底面相对的上表面,以及限定在基部的上表面上的多个凹槽(14)。 散热片还包括容纳在槽中的两个热管(32,36),每个热管分别包括蒸发部分(322,362)和冷凝部分(324,364),其中热管的蒸发部分 紧密地布置在所述基部的一部分上,并且其中所述热管的所述冷凝部分从所述基部的所述部分扩展到所述凹槽中延伸到所述基部的其它部分,使得所述基部从所述发热部件吸收的热量 可以均匀地传播到整个基地。