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    • 91. 发明授权
    • Process for producing hard roll
    • 硬辊生产工艺
    • US5091027A
    • 1992-02-25
    • US567529
    • 1990-08-15
    • Atsuo Watanabe
    • Atsuo Watanabe
    • B29C63/18B29D99/00D21F3/08D21G1/02F16C13/00
    • D21G1/0246B29C63/18B29D99/0035D21F3/08D21G1/0233F16C13/00B29L2031/324Y10T156/103Y10T29/49551
    • A hard roll is produced by a process utilizing the steps of winding a fiber material impregnated with a thermosetting resin around the outer peripheral surface of a metal roll core to form a fiber-reinforced lower winding layer, then injecting a thermosetting synthetic resin material into a mold of predetermined size and curing the material at a specified temperature to form an outer layer hollow cylinder separately from the first step. The next stepsave fitting the outer layer cylinder around the roll core covered with the winding layer, and injecting an adhesive of low viscosity into an annular clearance between the winding layer and the cylinder and then curing the adhesive at a specified temperature to bond the winding layer to the cylinder with the layer of adhesive.
    • 通过以下步骤生产硬卷,该方法采用以下步骤:将浸渍有热固性树脂的纤维材料缠绕在金属辊芯的外周表面上,以形成纤维增强的下卷绕层,然后将热固性合成树脂材料注入 预定尺寸的模具,并在特定温度下固化材料以形成与第一步骤分离的外层中空筒体。 下一个步骤将外层圆筒围绕卷绕在卷芯上的辊芯安装,并将低粘度的粘合剂注入到卷绕层和圆筒之间的环形间隙中,然后在特定温度下固化粘合剂以将卷绕层 到气瓶与粘合剂层。
    • 99. 发明申请
    • Switching semiconductor devices and fabrication process
    • 开关半导体器件和制造工艺
    • US20070096145A1
    • 2007-05-03
    • US11590789
    • 2006-11-01
    • Atsuo Watanabe
    • Atsuo Watanabe
    • H01L31/111
    • H01L29/8083H01L29/0692H01L29/1608H01L29/2003H01L29/66909
    • A switching semiconductor device is provided, in which a negative gate voltage can be applied to the semiconductor device in an OFF state so as to increase a breakdown voltage of the gate junction without impairing a normally-off function of the semiconductor device and the ON-resistance. The switching semiconductor device is fabricated by using a semiconductor substrate with a band gap of 2.0 eV or more. In a JFET structure where a p+ type gate region and an n type source region are in contact so that a negative gate voltage can be applied, the p+ type gate region and an n+ type source region with a high impurity concentration are disposed with interposing an n type source region with an impurity concentration lower than that of the p+ type gate region and higher than that of a drift region of the JFET therebetween.
    • 提供了一种切换半导体器件,其中可以在OFF状态下对半导体器件施加负栅极电压,以便增加栅极结的击穿电压而不损害半导体器件的常关功能, 抵抗性。 通过使用带隙​​为2.0eV以上的半导体衬底来制造开关半导体器件。 在其中ap + +型栅极区和n型源区接触的JFET结构中,使得可以施加负栅极电压,p + +型栅极区和 以杂质浓度低于p + +型栅极区域的杂质浓度的n型源极区域设置具有高杂质浓度的n + 比它们之间的JFET的漂移区域的漂移区域更高。
    • 100. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20050218424A1
    • 2005-10-06
    • US11135417
    • 2005-05-24
    • Hidekatsu OnoseHideo HommaAtsuo Watanabe
    • Hidekatsu OnoseHideo HommaAtsuo Watanabe
    • H01L29/80H01L21/337H01L29/10H01L29/772H01L29/808H01L29/32
    • H01L29/1066H01L29/1608H01L29/7722
    • A semiconductor switching device for an inverter includes a first conductivity type, low impurity concentration, semiconductor substrate having a band gap equal to or greater than 2.0 eV, a first conductivity type first region formed in a first plane of the substrate having a resistance lower than the substrate, a first electrode formed in another plane of the first region, a first conductivity type second region formed in a second plane of the substrate, and a second electrode formed on the second region. A trench is formed in the second plane, a control region is formed from a bottom of the trench into the substrate and a control electrode of a different conductivity type is formed on the control region. The second electrode is formed over the control electrode through an insulator film, and the control electrode is formed on the trench sidewalls so the control region contacts the second region.
    • 用于逆变器的半导体开关器件包括第一导电类型,低杂质浓度,具有等于或大于2.0eV的带隙的半导体衬底,形成在衬底的第一平面中的电阻低于 所述基板,形成在所述第一区域的另一平面中的第一电极,形成在所述基板的第二平面中的第一导电类型的第二区域和形成在所述第二区域上的第二电极。 在第二平面中形成沟槽,控制区域从沟槽的底部形成到衬底中,并且在控制区域上形成不同导电类型的控制电极。 第二电极通过绝缘膜形成在控制电极上,并且控制电极形成在沟槽侧壁上,使得控制区域接触第二区域。