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    • 92. 发明授权
    • Insulated-gate FET on an SOI-structure
    • 绝缘栅FET在SOI结构上
    • US5264721A
    • 1993-11-23
    • US824913
    • 1992-01-23
    • Hiroshi Gotou
    • Hiroshi Gotou
    • H01L21/336H01L29/786H01L29/78
    • H01L29/66772H01L29/78654
    • An SOI-type insulated-gate FET is formed such that an electrical resistance across a pn-junction of the source region is less than that across a pn-junction of the drain region. This is accomplished by providing the FET with a metal dopant, such as aluminum or tungsten; by excessively doping the source region; by providing an amorphous source region; or by providing a layer formed of a material having a different thermal expansion coefficient from the thermal expansion coefficient of the material forming the source region, upon the source region. In the thus fabricated transistor, there is generated a carrier generation center or a precipitation of the impurities at a pn-junction formed between the source region and the semiconductor substrate. Thus, a current path is formed across the pn-junction of the source region in both the forward and reverse directions of a diode of the pn-junction, so as to substantially eliminate the potential difference between the source region and the semiconductor substrate. Accordingly, a kink phenomenon in the drain voltage-current characteristics is eliminated.
    • 形成SOI型绝缘栅FET,使得源极区的pn结上的电阻小于漏极区的pn结上的电阻。 这通过为FET提供诸如铝或钨的金属掺杂剂来实现; 过度掺杂源区; 通过提供非晶质源区; 或者通过在源区域上提供由具有不同热膨胀系数的材料形成的层与形成源极区域的材料的热膨胀系数。 在这样制造的晶体管中,在源极区域和半导体衬底之间形成的pn结处产生载流子生成中心或杂质析出。 因此,在pn结的二极管的正向和反向两端的源极区的pn结上形成电流通路,从而基本上消除了源区和半导体衬底之间的电位差。 因此,消除了漏极电压 - 电流特性中的扭结现象。
    • 93. 发明授权
    • Method of making semiconductor memory device having stacked capacitor
    • 制造具有堆叠电容器的半导体存储器件的方法
    • US5196365A
    • 1993-03-23
    • US779548
    • 1991-10-18
    • Hiroshi Gotou
    • Hiroshi Gotou
    • H01L21/8242H01L27/108
    • H01L27/10844H01L27/10817
    • A semiconductor memory device includes a substrate, a transfer transistor formed on the substrate and including drain and source regions, and a charge storage capacitor electrically coupled to one of the drain and source regions of the transfer transistor. The charge storage capacitor has a conductive base layer which is electrically coupled to the one of the drain and source regions of the transfer transistor, at least one conductive side wall connected to one end of the base layer, a plurality of fin-shaped parts which extend from the side wall in a plurality of levels generally parallel to the base layer, a dielectric layer which covers exposed surfaces of the base layer, the side wall and the fin-shaped parts, and a conductor layer which is formed on the dielectric layer to form an opposed electrode of the charge storage capacitor. The fin-shaped parts and the side wall form a storage electrode of the charge storage capacitor.
    • 半导体存储器件包括衬底,形成在衬底上并包括漏极和源极区的转移晶体管,以及电耦合到转移晶体管的漏极和源极区之一的电荷存储电容器。 电荷存储电容器具有与传输晶体管的漏极和源极区域中的一个电耦合的导电基极层,连接到基底层的一端的至少一个导电侧壁,多个鳍状部分, 从大致平行于基底层的多个级别的侧壁延伸,覆盖基底层,侧壁和鳍状部分的暴露表面的电介质层和形成在电介质层上的导体层 以形成电荷存储电容器的相对电极。 鳍形部分和侧壁形成电荷存储电容器的存储电极。
    • 94. 发明授权
    • Semiconductor memory device having stacked capacitor
    • 具有堆叠电容器的半导体存储器件
    • US5126810A
    • 1992-06-30
    • US742261
    • 1991-08-07
    • Hiroshi Gotou
    • Hiroshi Gotou
    • H01L27/04H01L21/822H01L21/8242H01L27/10H01L27/108
    • H01L27/10844H01L27/10817
    • A semiconductor memory device includes a substrate, a transfer transistor formed on the substrate and including drain and source regions, and a charge storage capacitor electrically coupled to one of the drain and source regions of the transfer transistor. The charge storage capacitor has a conductive base layer which is electrically coupled to the one of the drain and source regions of the transfer transistor, at least one conductive side wall connected to one end of the base layer, a plurality of fin-shaped parts which extend from the side wall in a plurality of levels generally parallel to the base layer, a dielectric layer which covers exposed surfaces of the base layer, the side wall and the fin-shaped parts, and a conductor layer which is formed on the dielectric layer to form an opposed electrode of the charge storage capacitor. The fin-shaped parts and the side wall form a storage electrode of the charge storage capacitor.
    • 半导体存储器件包括衬底,形成在衬底上并包括漏极和源极区的转移晶体管,以及电耦合到转移晶体管的漏极和源极区之一的电荷存储电容器。 电荷存储电容器具有与传输晶体管的漏极和源极区域中的一个电耦合的导电基极层,连接到基底层的一端的至少一个导电侧壁,多个鳍状部分, 从大致平行于基底层的多个级别的侧壁延伸,覆盖基底层,侧壁和鳍状部分的暴露表面的电介质层和形成在电介质层上的导体层 以形成电荷存储电容器的相对电极。 鳍形部分和侧壁形成电荷存储电容器的存储电极。