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    • 95. 发明申请
    • Efficient method to predict integrated circuit temperature and power maps
    • 高效地预测集成电路温度和功率图的方法
    • US20080026493A1
    • 2008-01-31
    • US11787108
    • 2007-04-12
    • Ali ShakouriTravis KemperYan ZhangPeyman MilanfarVirginia Martin HerizXi Wang
    • Ali ShakouriTravis KemperYan ZhangPeyman MilanfarVirginia Martin HerizXi Wang
    • H01L21/66
    • G06Q10/04G06F17/5068G06F2217/78G06F2217/84
    • The temperature distribution associated with a design of an integrated circuit is calculated by convoluting a surface power usage represented by a power matrix with a heat spreading function. The heat spreading function may be calculated from a simulation of a point source on the integrated circuit using a finite element analysis model of the integrated circuit or other techniques. To account for spatial variations on the chip, the heat spreading function may be made dependent on position using a position scaling function. Steady-state or transient temperature distributions may be computed by using a steady-state or transient heat spreading function. A single heat spreading function may be convolved with various alternative power maps to efficiently calculate temperature distributions for different designs. In an inverse problem, one can calculate the power map from an empirically measured temperature distribution and a heat spreading function using various de-convolution techniques. While the forward problem is analogous to image blurring, the inverse problem is analogous to image restoration.
    • 与集成电路的设计相关的温度分布通过对具有热扩散功能的功率矩阵表示的表面功率消耗进行卷积来计算。 可以使用集成电路的有限元分析模型或其他技术从集成电路上的点源的模拟来计算散热功能。 为了考虑芯片上的空间变化,可以使用位置缩放功能使散热功能取决于位置。 可以通过使用稳态或瞬态热扩散功能来计算稳态或瞬态温度分布。 单个散热功能可以与各种替代功率图进行卷积,以有效地计算不同设计的温度分布。 在逆问题中,可以使用各种去卷积技术从经验测量的温度分布和热扩散函数中计算功率图。 虽然前向问题类似于图像模糊,但是逆问题类似于图像恢复。