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91. 发明授权

US07981345B2 Fabrication method of products with closed micro-channels by injection molding 有权
标题翻译：通过注塑成型封闭微通道产品的制造方法
公开(公告)号：US07981345B2
公开(公告)日：2011-07-19
申请号：US12379069
申请日：2009-02-12
申请人： Yeong-Eun Yoo , Doo-Sun Choi , Young-Ho Seo , Tae-Hoon Kim
发明人： Yeong-Eun Yoo , Doo-Sun Choi , Young-Ho Seo , Tae-Hoon Kim
IPC分类号： B29C45/14
CPC分类号： B29C45/14336 , B29C45/0046 , B29C2045/0094
摘要： Disclosed is a fabrication method of products with closed channels by injection molding, which includes: a channel substrate mounting step of mounting a channel substrate comprising a plurality of opened micro-channels thereon to a mold; and a substrate cover molding step of molding a substrate cover by the injection molding on an upper surface of the channel substrate mounted to the mold, the substrate cover being coupled to the channel substrate while being molded. With this, the products with the closed channels can be fabricated without any additional coupling process between the channel substrate having the opened channels and the substrate cover, thereby simplifying a fabrication process and enhancing work efficiency.
摘要翻译：公开了一种通过注塑成型的具有闭合通道的产品的制造方法，其包括：通道基板安装步骤，其将包括多个打开的微通道的通道基板安装到模具上; 以及基板覆盖成型步骤，其通过注射成型在安装到模具的通道基板的上表面上模制基板盖，基板盖在模制时联接到通道基板。由此，具有闭合通道的产品可以在具有开放通道的通道基板和基板盖之间没有任何额外的耦合过程的情况下制造，从而简化制造工艺并提高工作效率。

92. 发明申请

US20110079751A1 THERMOELECTRIC CONVERSION MATERIAL AND PRODUCING METHOD THEREOF, AND THERMOELECTRIC CONVERSION ELEMENT USING THE SAME 有权
标题翻译：热电转换材料及其制造方法以及使用其的热电转换元件
公开(公告)号：US20110079751A1
公开(公告)日：2011-04-07
申请号：US12906917
申请日：2010-10-18
申请人： Cheol-Hee PARK , Se-Hui Sohn , Seung-Tae Hong , Won-Jong Kwon , Tae-Hoon Kim
发明人： Cheol-Hee PARK , Se-Hui Sohn , Seung-Tae Hong , Won-Jong Kwon , Tae-Hoon Kim
IPC分类号： C09K5/00 , C01B19/00
CPC分类号： H01L35/16 , C09K11/881 , C09K11/885 , H01B1/08 , H01B1/10 , H01L31/0272 , H01L31/032 , H01L31/072 , H01L31/0725 , H01L35/18 , H01L35/22 , Y02E10/50
摘要： Thermoelectric conversion materials, expressed by the following formula: Bi1-xMxCuwOa-yQ1yTeb-zQ2z. Here, M is at least one element selected from the group consisting of Ba, Sr, Ca, Mg, Cs, K, Na, Cd, Hg, Sn, Pb, Eu, Sm, Mn, Ga, In, Ti, As and Sb; Q1 and Q2 are at least one element selected from the group consisting of S, Se, As and Sb; x, y, z, w, a, and b are 0≦x
摘要翻译：热电转换材料，由下式表示：Bi1-xMxCuwOa-yQ1yTeb-zQ2z。这里，M是选自Ba，Sr，Ca，Mg，Cs，K，Na，Cd，Hg，Sn，Pb，Eu，Sm，Mn，Ga，In，Ti，As和锑 Q1和Q2是选自S，Se，As和Sb中的至少一种元素; x，y，z，w，a和b分别为0＆nlE; x <1,0,0

93. 发明申请

US20110079750A1 COMPOUND SEMICONDUCTOR AND ITS MANUFACTURING METHOD, AND THERMOELECTRIC CONVERSION DEVICE USING THE SAME 有权
标题翻译：化合物半导体及其制造方法和使用其的热电转换装置
公开(公告)号：US20110079750A1
公开(公告)日：2011-04-07
申请号：US12902927
申请日：2010-10-12
申请人： Cheol-Hee Park , Se-Hui Sohn , Won-Jong Kwon , Tae-Hoon Kim , Seung-Tae Hong
发明人： Cheol-Hee Park , Se-Hui Sohn , Won-Jong Kwon , Tae-Hoon Kim , Seung-Tae Hong
IPC分类号： C09K5/00 , H01B1/02
CPC分类号： H01L35/16 , C09K11/881 , C09K11/885 , H01B1/08 , H01B1/10 , H01L31/0272 , H01L31/032 , H01L31/072 , H01L31/0725 , H01L35/18 , H01L35/22 , Y02E10/50
摘要： Disclosed is a new compound semiconductor represented by the chemical formula: Bi1-x-yLnxMyCuOTe where Ln belongs to the lanthanoid series and is any one or more elements selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, M is any one or more elements selected from the group consisting of Ba, Sr, Ca, Mg, Cd, Hg, Sn, Pb, Mn, Ga, In, Tl, As and Sb, and 0
摘要翻译：公开了由化学式Bi1-x-yLnxMyCuOTe表示的新的化合物半导体，其中Ln属于镧系元素，并且是选自La，Ce，Pr，Nd，Pm，Sm，Eu中的任何一种或多种元素，Gd，Tb，Dy，Ho，Er，Tm，Yb和Lu中的任一种，M是选自Ba，Sr，Ca，Mg，Cd，Hg，Sn，Pb，Mn，Ga， In，Tl，As和Sb，0

94. 发明授权

US07612385B2 High power light-emitting diode package comprising substrate having beacon 失效
标题翻译：包括具有信标的基板的大功率发光二极管封装
公开(公告)号：US07612385B2
公开(公告)日：2009-11-03
申请号：US11323487
申请日：2005-12-30
申请人： Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
发明人： Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
IPC分类号： H01L29/22 , H01L33/00 , H01L27/15 , H01L29/267 , H01L31/12 , H01L29/16 , H01L23/02
CPC分类号： H01L33/642 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00012 , H01L2924/00014
摘要： Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.
摘要翻译：本文公开了包括至少一个高功率发光二极管以显示出优异的散热特性的封装结构。在封装结构中，产生热量的发光二极管芯片直接附着在处理成从具有高导热性的散热器的一部分突出的信标处，由此将电线路部分与放热部分分开，从而使热量最大化释放性能，实现高亮度和可靠性。封装结构由形成在具有高导热性的金属或非金属基板上的信标构成，以安装大功率发光二极管芯片，以增加散热性能; 设置在与二极管相同的线路上的布线部分，用于输入和输出功率和信号; 以及具有空腔的反射杯，其可以插入或附着到散热器或布线基板，包括低温共烧陶瓷基板，高温共烧陶瓷基板或印刷电路板。

95. 发明申请

US20080019133A1 High power light-emitting diode package comprising substrate having beacon 失效
标题翻译：包括具有信标的基板的大功率发光二极管封装
公开(公告)号：US20080019133A1
公开(公告)日：2008-01-24
申请号：US11323487
申请日：2005-12-30
申请人： Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
发明人： Young-Woo Kim , Tae-Hoon Kim , Young-Moon Yu
IPC分类号： F21V29/00
CPC分类号： H01L33/642 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00012 , H01L2924/00014
摘要： Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.
摘要翻译：本文公开了包括至少一个高功率发光二极管以显示出优异的散热特性的封装结构。在封装结构中，产生热量的发光二极管芯片直接附着在处理成从具有高导热性的散热器的一部分突出的信标处，由此将电线路部分与放热部分分开，从而使热量最大化释放性能，实现高亮度和可靠性。封装结构由形成在具有高导热性的金属或非金属基板上的信标构成，以安装大功率发光二极管芯片，以增加散热性能; 设置在与二极管相同的线路上的布线部分，用于输入和输出功率和信号; 以及具有空腔的反射杯，其可以插入或附着到散热器或布线基板，包括低温共烧陶瓷基板，高温共烧陶瓷基板或印刷电路板。

96. 发明申请

US20070289483A1 Conductive ink composition for inkjet printing 失效
标题翻译：用于喷墨印刷的导电油墨组合物
公开(公告)号：US20070289483A1
公开(公告)日：2007-12-20
申请号：US11655832
申请日：2007-01-22
申请人： Hye-Jin Cho , Jae-Woo Joung , Sung-Il OH , Tae-Hoon Kim
发明人： Hye-Jin Cho , Jae-Woo Joung , Sung-Il OH , Tae-Hoon Kim
IPC分类号： C09D11/00
CPC分类号： C09D11/322 , H05K1/097 , H05K3/125 , H05K2203/013 , H05K2203/122
摘要： A conductive ink composition for inkjet printing, more particularly to a conductive ink composition for inkjet printing, which includes 30 to 85 parts by weight of metal nanoparticles, 10 to 60 parts by weight of an organic solvent, 10 to 30 parts by weight of a humectant, the humectant made of a diol or glycol base compound, and 0.1 to 10 parts by weight of an ethylene glycol-based ether compound additive for adjusting viscosity. The ink composition may be optimized, such that the viscosity of the ink may be adjusted while maintaining a high concentration of metal, when forming wiring using an inkjet device, for improved flow and ejection properties of the ink.
摘要翻译：一种用于喷墨印刷的导电油墨组合物，更具体地涉及一种用于喷墨印刷的导电油墨组合物，其包含30至85重量份的金属纳米颗粒，10至60重量份的有机溶剂，10至30重量份的保湿剂，由二醇或二醇基础化合物制成的保湿剂和0.1至10重量份用于调节粘度的乙二醇基醚化合物添加剂。可以优化墨水组合物，使得当使用喷墨装置形成布线时，可以在保持高浓度金属的同时调节墨水的粘度，以改善墨水的流动和喷射性能。

97. 发明授权

US06710886B2 Semiconductor wafer position detecting system, semiconductor device fabricating facility of using the same, and wafer position detecting method thereof 有权
标题翻译：半导体晶片位置检测系统，使用其的半导体器件制造设备及其晶片位置检测方法
公开(公告)号：US06710886B2
公开(公告)日：2004-03-23
申请号：US10027641
申请日：2001-12-19
申请人： In-Hak Park , Chul Park , Sang-Hee Han , Tae-Hoon Kim
发明人： In-Hak Park , Chul Park , Sang-Hee Han , Tae-Hoon Kim
IPC分类号： G01B1114
CPC分类号： H01L21/67259 , G01B11/028 , H01L21/681
摘要： It is disclosed a semiconductor wafer position detecting system, a semiconductor device fabricating facility of using the same, and a semiconductor wafer position detecting method to prevent process failure in advance prior to proceeding various processes. The structure includes a chuck plate formed with at least one or more holes at a portion thereof on which a wafer is normally and closely placed; a fluid line connected between a lower portion of each of the holes and a fluid flow device; at least one or more valves provided on the fluid line to control fluid flow in response to an opening/closing control signal; a sensor provided on the fluid line to detect a state of fluid; an output device for outputting signals in response to an output control signal; and a controller for selectively applying an opening/closing control signal and an output control signal to the valve and output device, and detecting the position state of wafer by a measurement signal applied from the sensor.
摘要翻译：公开了一种半导体晶片位置检测系统，使用该半导体器件的半导体器件制造设备，以及在进行各种处理之前预先防止处理故障的半导体晶片位置检测方法。该结构包括形成有至少一个在其上正常且紧密放置晶片的部分处具有多个孔; 连接在每个孔的下部和流体流动装置之间的流体管线; 至少一个或多个阀，设置在流体管线上以响应于打开/关闭控制信号来控制流体流动; 设置在流体管线上以检测流体状态的传感器; 输出装置，用于响应于输出控制信号输出信号; 以及用于选择性地向阀和输出装置施加打开/关闭控制信号和输出控制信号的控制器，以及通过从传感器施加的测量信号来检测晶片的位置状态。

98. 发明授权

US06287981B1 Electrode for generating a plasma and a plasma processing apparatus using the same 有权
标题翻译：用于产生等离子体的电极和使用其的等离子体处理装置
公开(公告)号：US06287981B1
公开(公告)日：2001-09-11
申请号：US09389027
申请日：1999-09-02
申请人： Tae-Hoon Kim , Kwon Son
发明人： Tae-Hoon Kim , Kwon Son
IPC分类号： H01L2100
CPC分类号： H01L21/67069 , C23C16/509 , H01J37/32009 , H01J37/32082 , H01J37/32541
摘要： A plasma processing apparatus includes a plasma generating electrode containing at least one protrusion for improving the plasma density and uniformity. The apparatus may be a plasma dry etching apparatus, a plasma enhanced CVD deposition apparatus or a sputtering apparatus.
摘要翻译：等离子体处理装置包括等离子体产生电极，其包含至少一个用于提高等离子体密度和均匀性的突起。该装置可以是等离子体干蚀刻装置，等离子体增强CVD沉积装置或溅射装置。

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