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    • 95. 发明申请
    • DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE
    • 显示装置的显示装置和制造方法
    • US20110031501A1
    • 2011-02-10
    • US12904536
    • 2010-10-14
    • Hideomi SUZAWAShunpei YAMAZAKI
    • Hideomi SUZAWAShunpei YAMAZAKI
    • H01L33/16
    • H01L51/56H01L27/3246H01L27/3248H01L27/3258H01L27/3262H01L51/5206H01L51/5234H01L51/5246H01L51/5259H01L2251/5315H01L2251/5323
    • According to one feature of the present invention, a display device is manufactured according to the steps of forming a semiconductor layer; forming a gate insulating layer over the semiconductor layer; forming a gate electrode layer over the gate insulating layer; forming source and drain electrode layers in contact with the semiconductor layer; forming a first electrode layer electrically connected to the source or drain electrode layer; forming an inorganic insulating layer over part of the first electrode layer, the gate electrode layer, the source electrode layer, and the drain electrode layer; subjecting the inorganic insulating layer and the first electrode layer to plasma treatment; forming an electroluminescent layer over the inorganic insulating layer and the first electrode layer which are subjected to plasma treatment; and forming a second electrode layer over the electroluminescent layer.
    • 根据本发明的一个特征,根据形成半导体层的步骤制造显示装置; 在所述半导体层上形成栅极绝缘层; 在所述栅绝缘层上形成栅电极层; 形成与半导体层接触的源极和漏极电极层; 形成电连接到所述源极或漏极电极层的第一电极层; 在所述第一电极层,所述栅极电极层,所述源极电极层和所述漏极电极层的一部分上形成无机绝缘层; 对无机绝缘层和第一电极层进行等离子体处理; 在经过等离子体处理的无机绝缘层和第一电极层上形成电致发光层; 以及在所述电致发光层上形成第二电极层。
    • 98. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体基板的方法和制造半导体器件的方法
    • US20110003461A1
    • 2011-01-06
    • US12882301
    • 2010-09-15
    • Shunpei YAMAZAKI
    • Shunpei YAMAZAKI
    • H01L21/762
    • H01L27/1266H01L21/268H01L21/76254H01L27/1214H01L27/1218H01L27/1274H01L29/78621
    • An SOI substrate having a single crystal semiconductor layer with high surface planarity is manufactured. A semiconductor substrate is doped with hydrogen, whereby a damaged region which contains large quantity of hydrogen is formed. After a single crystal semiconductor substrate and a supporting substrate are bonded together, the semiconductor substrate is heated, whereby the single crystal semiconductor substrate is separated in the damaged region. While a heated high-purity nitrogen gas is sprayed on a separation plane of the single crystal semiconductor layer separated from the single crystal semiconductor substrate, laser beam irradiation is performed. By irradiation with a laser beam, the single crystal semiconductor layer is melted, whereby planarity of the surface of the single crystal semiconductor layer is improved and re-single-crystallization is performed.
    • 制造具有高表面平面度的单晶半导体层的SOI衬底。 半导体衬底被掺杂氢,由此形成含有大量氢的损伤区域。 在单晶半导体衬底和支撑衬底接合在一起之后,半导体衬底被加热,从而在受损区域中分离出单晶半导体衬底。 将加热的高纯度氮气喷射到与单晶半导体衬底分离的单晶半导体层的分离面上,进行激光束照射。 通过用激光束照射,单晶半导体层被熔化,从而提高了单晶半导体层的表面的平坦度,并进行了再结晶。
    • 100. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20100327352A1
    • 2010-12-30
    • US12821481
    • 2010-06-23
    • Shunpei YAMAZAKI
    • Shunpei YAMAZAKI
    • H01L29/786H01L21/336
    • H01L27/1203H01L21/28052H01L21/76895H01L21/84H01L29/41766H01L29/41775H01L29/665H01L29/6653H01L29/6656H01L29/66636
    • An object is to reduce the resistance of each member included in a transistor, to improve ON current of the transistor, and to improve performance of an integrated circuit. A semiconductor device including an n-channel FET and a p-channel FET which are provided over a single crystal semiconductor substrate with an insulating layer interposed therebetween and are isolated by an element isolation insulating layer. In the semiconductor device, each FET includes a channel formation region including a semiconductor material, a conductive region which is in contact with the channel formation region and includes the semiconductor material, a metal region in contact with the conductive region, a gate insulating layer in contact with the channel formation region, a gate electrode in contact with the gate insulating layer, and a source or drain electrode partly including the metal region.
    • 目的是降低晶体管中包括的每个元件的电阻,以提高晶体管的导通电流,并提高集成电路的性能。 一种包括n沟道FET和p沟道FET的半导体器件,其设置在单晶半导体衬底上,绝缘层插入其间并被元件隔离绝缘层隔离。 在半导体装置中,每个FET包括:包含半导体材料的沟道形成区域,与沟道形成区域接触并包括半导体材料的导电区域,与导电区域接触的金属区域,栅极绝缘层 与沟道形成区域接触,与栅极绝缘层接触的栅极电极和部分地包括金属区域的源极或漏极电极。