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91. 发明申请

US20080099429A1 METHODS FOR REPAIRING PATTERNED STRUCTURES OF ELECTRONIC DEVICES 审中-公开
标题翻译：修复电子设备图案结构的方法
公开(公告)号：US20080099429A1
公开(公告)日：2008-05-01
申请号：US11828321
申请日：2007-07-25
申请人： Chao-Kai Cheng , Chieh-Yi Huang , Wan-Wen Chiu , Chun-Hung Lin , Chia-Chang Chang
发明人： Chao-Kai Cheng , Chieh-Yi Huang , Wan-Wen Chiu , Chun-Hung Lin , Chia-Chang Chang
IPC分类号： H01B13/00
CPC分类号： G02B5/201 , G03F7/0007 , G03F7/405
摘要： Methods for repairing patterned structure of electronic devices. A first substrate with a patterned structure thereon is provided, wherein the patterned structure includes at least one defect. The defect corresponds to a defect region while the patterned structure corresponds to a main region. A first surface treatment is performed on the defect region such that the surface characteristics on the defect region are different from those on the main region. The defect region is repaired by inkjet printing. A second surface treatment is performed on the defect region such that the surface characteristics on the defect region are the same as those on the main region.
摘要翻译：修复电子设备图案化结构的方法。提供其上具有图案化结构的第一衬底，其中所述图案化结构包括至少一个缺陷。缺陷对应于缺陷区域，而图案化结构对应于主要区域。对缺陷区域进行第一表面处理，使得缺陷区域上的表面特性与主区域上的表面特性不同。缺陷区域通过喷墨印刷修复。对缺陷区域进行第二表面处理，使得缺陷区域上的表面特性与主区域上的表面特性相同。

92. 发明申请

US20080079749A1 WHITE BALANCE METHOD FOR IMAGE PROCESSING 审中-公开
标题翻译：用于图像处理的白平衡方法
公开(公告)号：US20080079749A1
公开(公告)日：2008-04-03
申请号：US11536078
申请日：2006-09-28
申请人： Chun-Hung Lin , Tzu-Lan Shen
发明人： Chun-Hung Lin , Tzu-Lan Shen
IPC分类号： G09G5/02
CPC分类号： H04N9/73
摘要： A white balance method is disclosed for image processing. Characteristic information of a portion of pixels in a first frame is detected. First pixels are selected when the characteristic information of the first pixels in the first frame meets an optical requirement. An average hue of the selected first pixels is obtained. A hue range the average hue belongs to is determined. Characteristic information of a portion of the pixels in a second frame is detected. Second pixels are selected when the characteristic information of the second pixels in the second frame meets the optical requirement and a pixel hue of the second pixels is within the hue range. A first average red-channel value, a first average green-channel value, and a first average blue-channel value of the selected second pixels are obtained for acquiring a gain of each color component of an image. The gain of each color component of the image is adjusted according to the hue range.
摘要翻译：公开了用于图像处理的白平衡方法。检测第一帧中的一部分像素的特征信息。当第一帧中的第一像素的特征信息满足光学要求时，选择第一像素。获得所选择的第一像素的平均色调。色调范围所属的平均色调是确定的。检测第二帧中的像素的一部分的特征信息。当第二帧中的第二像素的特征信息满足光学要求并且第二像素的像素色调在色相范围内时，选择第二像素。获得所选择的第二像素的第一平均红色通道值，第一平均绿色通道值和第一平均蓝色通道值，用于获取图像的每个颜色分量的增益。图像的每个颜色分量的增益根据色调范围进行调整。

93. 发明申请

US20080066679A1 PROCESSING SYSTEM AND PLASMA GENERATION DEVICE 审中-公开
标题翻译：处理系统和等离子体生成装置
公开(公告)号：US20080066679A1
公开(公告)日：2008-03-20
申请号：US11564826
申请日：2006-11-29
申请人： Chi-Hung Liu , Wen-Tzong Hsieh , Chen-Der Tsai , Chun-Hsien Su , Chih Wei Chen , Chun-Hung Lin
发明人： Chi-Hung Liu , Wen-Tzong Hsieh , Chen-Der Tsai , Chun-Hsien Su , Chih Wei Chen , Chun-Hung Lin
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01J37/32366 , C23C16/513 , C23C16/54 , H01J37/32357 , H01J2237/032 , H05H1/2406 , H05H2001/2462
摘要： A processing system is used for processing an object by a first fluid. The processing system includes a base and a plasma generation device. The base supports the object and the plasma generation device ionizes the first fluid. The plasma generation device includes at least one guiding element comprising a path guiding the first fluid to sequentially flow through a first position and a second position and at least one electrode element including a first electrode corresponding to the first position and a second electrode corresponding to the second position. The first and second electrodes energize the first fluid located between the first and second electrodes to form a second fluid, to thereby utilize the second fluid to perform surfacing, activating, cleaning, photoresist ashing or etching process on the object supported by the base.
摘要翻译：处理系统用于通过第一流体处理物体。处理系统包括基座和等离子体产生装置。基座支撑物体，等离子体发生装置离子化第一流体。等离子体产生装置包括至少一个引导元件，该引导元件包括引导第一流体顺序地流过第一位置和第二位置的路径，以及包括对应于第一位置的第一电极和对应于第一位置的第二电极的至少一个电极元件第二名第一和第二电极激励位于第一和第二电极之间的第一流体以形成第二流体，从而利用第二流体对由基座支撑的物体进行表面，活化，清洁，光致抗蚀剂灰化或蚀刻过程。

94. 发明申请

US20080063290A1 Coding method and system with an adaptive bitplane coding mode 有权
标题翻译：具有自适应位平面编码模式的编码方法和系统
公开(公告)号：US20080063290A1
公开(公告)日：2008-03-13
申请号：US11896962
申请日：2007-09-07
申请人： Chun-Hung Lin , Tung-Hai Wu
发明人： Chun-Hung Lin , Tung-Hai Wu
IPC分类号： G06K9/36
CPC分类号： H04N19/184 , H04N19/109 , H04N19/11 , H04N19/12 , H04N19/152 , H04N19/16 , H04N19/196 , H04N19/463 , H04N19/91
摘要： A coding method and system with an adaptive bitplane coding mode is provided to code multiple bitplanes of a frame consisting of multiple macroblocks. Each bitplane consists of macroblock modes used by the macroblocks of the frame. The method includes the steps of: (A) initializing a bitplane coding mode of the frame as a compress mode; (B) coding the frame and the bitplanes to thereby obtain coded bitplanes, and calculating the bit number of coded bitplanes; (C) calculating the bit number of uncoded bitplanes; (D) executing step (A) when the bit number of coded bitplanes is smaller than the bit number of uncoded bitplanes; (E) initializing the bitplane coding mode of the frame as a raw mode when the bit number of coded bitplanes is not smaller than the bit number of uncoded bitplanes.
摘要翻译：提供具有自适应位平面编码模式的编码方法和系统来对由多个宏块组成的帧的多个位平面进行编码。每个位平面由帧的宏块使用的宏块模式组成。该方法包括以下步骤：（A）将帧的位平面编码模式初始化为压缩模式; （B）对帧和位平面进行编码，从而获得编码位平面，并计算编码位面的比特数; （C）计算未编码位面的位数; （D）执行步骤（A），当编码位平面的位数小于未编码位板的位数时; （E）当编码位平面的位数不小于未编码位板的位数时，初始化帧的位平面编码模式为原始模式。

95. 发明申请

US20080048410A1 Bicycle tube connector 审中-公开
标题翻译：自行车管接头
公开(公告)号：US20080048410A1
公开(公告)日：2008-02-28
申请号：US11507251
申请日：2006-08-22
申请人： Chun-Hung Lin
发明人： Chun-Hung Lin
IPC分类号： B62K13/06
CPC分类号： B62K19/28 , B62K19/34
摘要： A bicycle tube connector is a hollow body formed by the coupling of a left shell and a right shell. The tube connector further comprises a transverse rotational shaft connected with two branches of a chain stay, a down tube hole for retaining an obliquely downward down tube. When the bicycle tubes are connected within the tube connector, the left and the right shells are soldered together along the engaged border therebetween. Therefore, the various tubes of the bicycle are more firmly secured and the outlook of the bicycle frame is slick.
摘要翻译：自行车管连接器是通过左壳和右壳的联接形成的中空体。管连接器还包括与链条的两个分支连接的横向旋转轴，用于保持斜下方的管的下管孔。当自行管连接在管连接器内时，左壳和右壳沿它们之间的接合边界被焊接在一起。因此，自行车的各种管子更牢固地固定，并且自行车车架的外观是光滑的。

96. 发明申请

US20070290781A1 COIL FRAME CAPABLE OF CONNECTING WITH ANOTHER COIL FRAME 失效
标题翻译：与其他线圈框架连接的线圈框架
公开(公告)号：US20070290781A1
公开(公告)日：2007-12-20
申请号：US11695060
申请日：2007-04-02
申请人： Wen-Sheng Chen , Chun-Hung Lin
发明人： Wen-Sheng Chen , Chun-Hung Lin
IPC分类号： H01F27/30
CPC分类号： H01F27/326 , H01F3/10 , H01F27/303 , H01F27/325 , H01F30/10 , H01F2005/022
摘要： Coil frames and transformers are provided. A coil frame includes a sub-coil-frame and an extended frame. The sub-coil-frame is utilized for winding a metal coil thereon. The extended frame is attached to the sub-coil-frame. The extended frame has a hole and a protrusion. The hole of the coil frame can be connected with the protrusion of another coil frame.
摘要翻译：提供线圈框架和变压器。线圈框架包括子线圈框架和延伸框架。子线圈框架用于在其上缠绕金属线圈。延伸框架连接到子线圈框架。延伸框架具有孔和突起。线圈框架的孔可以与另一个线圈架的突起连接。

97. 发明申请

US20070235871A1 High frequency IC package and method for fabricating the same 有权
标题翻译：高频IC封装及其制造方法
公开(公告)号：US20070235871A1
公开(公告)日：2007-10-11
申请号：US11400182
申请日：2006-04-10
申请人： Hsiang-Ming Huang , An-Hong Liu , Yeong-Jyh Lin , Yi-Chang Lee , Wu-Chang Tu , Chun-Hung Lin , Shih Chiu
发明人： Hsiang-Ming Huang , An-Hong Liu , Yeong-Jyh Lin , Yi-Chang Lee , Wu-Chang Tu , Chun-Hung Lin , Shih Chiu
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L23/13 , H01L23/3114 , H01L23/49816 , H01L24/06 , H01L24/13 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13 , H01L2224/13099 , H01L2224/13144 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/8121 , H01L2224/81815 , H01L2224/83194 , H01L2224/838 , H01L2224/9202 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.
摘要翻译：高频IC封装主要包括衬底，凸起芯片和多个导电填料，其中衬底具有从顶表面到底表面穿透的多个凸起孔。芯片的有源表面以分别插入到凸块孔中的方式附接到基板的顶表面。导电填料形成在凸起孔中，以将凸块电连接到基板的电路层。高频IC封装具有更短的电路径和更薄的封装厚度。

98. 发明申请

US20070215992A1 Chip package and wafer treating method for making adhesive chips 审中-公开
标题翻译：用于制造粘合片的芯片封装和晶片处理方法
公开(公告)号：US20070215992A1
公开(公告)日：2007-09-20
申请号：US11481719
申请日：2006-07-05
申请人： Geng-Shin Shen , Chun-Hung Lin
发明人： Geng-Shin Shen , Chun-Hung Lin
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L21/563 , H01L21/6836 , H01L23/3107 , H01L23/4951 , H01L23/49513 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/29007 , H01L2224/29101 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/4826 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2224/81192 , H01L2224/81801 , H01L2224/83191 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2224/85 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer treating method for making adhesive chips is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform an adhesive film having B-stage property which has a glass transition temperature between −40 and 175 degree C. for example. After positioning the wafer, the wafer is singulated to form a plurality of chips with adhesive for chip-to-chip stacking, chip-to-substrate or chip-to-lead frame attaching.
摘要翻译：提供了制造粘合剂芯片的晶片处理方法。具有两级特性的液体粘合剂涂覆在晶片的表面上。然后，将晶片预固化，以使液体粘合剂例如具有玻璃化转变温度在-40至175℃之间的具有B阶特性的粘合剂膜。在晶片定位之后，晶片被单片化以形成具有用于芯片到芯片堆叠，芯片到衬底或芯片到引线框架连接的粘合剂的多个芯片。

99. 发明申请

US20070128377A1 Method for producing alignment layer for liquid crystal panel 有权
标题翻译：液晶面板制作方法
公开(公告)号：US20070128377A1
公开(公告)日：2007-06-07
申请号：US11503191
申请日：2006-08-14
申请人： Huang-Chin Tang , Chun-Hung Lin , Chih-Wei Chen , Chin-Jyi Wu , Chen-Der Tsai , Chin-Yang Lee
发明人： Huang-Chin Tang , Chun-Hung Lin , Chih-Wei Chen , Chin-Jyi Wu , Chen-Der Tsai , Chin-Yang Lee
IPC分类号： C09K19/00 , G02F1/1337
CPC分类号： G02F1/13378 , Y10T428/1005
摘要： A method for producing an alignment layer for a liquid crystal panel, which is produced by modifying an alignment film in a fixed direction and at a fixed angle by using an atmospheric pressure plasma source to form a uniform and isotropic alignment layer on the surface of the substrate. The resultant alignment layer has good uniformity and high anchoring energy, and the pre-tilt angle can be selected as desired. In addition, there are no problems with static charge generation, dust pollution and the like as in the prior arts. The method of the present invention is not restricted by vacuum apparatuses that need ion alignment or vacuum plasma alignment and the like and is not restricted by the size of the equipment. Therefore, the method of the present invention is suitable for treating the surface of an alignment layer of a large size liquid crystal panel.
摘要翻译：一种用于制造液晶面板取向层的方法，其通过使用大气压等离子体源在固定方向和固定角度下修正取向膜而在其表面上形成均匀且各向同性的取向层基质。所得到的取向层具有良好的均匀性和较高的锚固能，并且可以根据需要选择预倾角。此外，与现有技术相同，静电荷产生，粉尘污染等没有问题。本发明的方法不受需要离子对准或真空等离子体对准等的真空装置的限制，并且不受设备尺寸的限制。因此，本发明的方法适用于处理大尺寸液晶面板的取向层的表面。

100. 发明申请

US20070063325A1 Chip package structure and bumping process 审中-公开
标题翻译：芯片封装结构和焊接工艺
公开(公告)号：US20070063325A1
公开(公告)日：2007-03-22
申请号：US11361646
申请日：2006-02-24
申请人： Chun-Hung Lin , Geng-Shin Shen
发明人： Chun-Hung Lin , Geng-Shin Shen
IPC分类号： H01L21/00
CPC分类号： H01L25/0657 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/90 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/731 , H01L2224/73265 , H01L2224/83192 , H01L2224/83856 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A chip package structure including a first substrate, a second substrate, bumps and adhesive blocks is provided. The first substrate has first bonding pads. The second substrate is disposed above the first substrate and has second bonding pads. The bumps are respectively arranged on the first bonding pads or the second bonding pads, and the second substrate is electrically connected to the first substrate through the bumps. The adhesive material with B-stage property are respectively arranged between the first bonding pads and the second bonding pads and enclose each bump. The bumps can be stud bumps or plating bumps.
摘要翻译：提供了包括第一基板，第二基板，凸块和粘合块的芯片封装结构。第一衬底具有第一接合焊盘。第二基板设置在第一基板上方并具有第二接合焊盘。凸块分别布置在第一接合焊盘或第二接合焊盘上，并且第二衬底通过凸块电连接到第一衬底。具有B阶特性的粘合剂材料分别布置在第一接合焊盘和第二接合焊盘之间并且包围每个凸块。凸块可以是凸块或电镀凸块。

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