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    • 91. 发明授权
    • Joint fault detection
    • 联合故障检测
    • US07512216B2
    • 2009-03-31
    • US10593307
    • 2005-03-09
    • Ping ZhouAndrew D Chattell
    • Ping ZhouAndrew D Chattell
    • H04M1/24H04M3/08H04M3/22
    • H04M3/305H04M3/08
    • A method and apparatus for detecting a fault in a joint connecting sections of an electrical transmission line together are disclosed. Previously known methods for detecting joint faults require a visual inspection of the joint or testing the transmission line using sophisticated, expensive equipment. This manual testing is expensive and inefficient. In the proposed method, a fault in a joint (301) connecting sections of an electrical transmission line (107) together is detected by measuring the resistance to current flowing through the joint (301) in one and the other directions along said electrical transmission line (107) and detecting a fault in the joint (301) if the measured resistance differs substantially in said one and the other directions. The method has particular utility in relation to low power transmission lines such as telephone lines.
    • 公开了一种用于检测电传输线的接头连接部分中的故障的方法和装置。 用于检测关节缺损的以前已知的方法需要使用复杂且昂贵的设备来目视检查关节或测试传输线。 这种手动测试是昂贵且效率低下的。 在所提出的方法中,通过沿沿着所述传输线的一个方向和另一个方向测量流过接头(301)的电流的电阻来检测电传输线(107)的连接部分(301)的接头(301)中的故障 (107),并且如果所测量的电阻在所述一个和其它方向上显着不同,则检测接头(301)中的故障。 该方法对于诸如电话线路的低功率传输线路具有特别的用途。
    • 100. 发明授权
    • Method and apparatus for hermetically sealing photonic devices
    • 用于密封光子器件的方法和装置
    • US06932522B2
    • 2005-08-23
    • US10444796
    • 2003-05-22
    • Ping Zhou
    • Ping Zhou
    • H01L23/28H01L31/02H01S5/022H01S5/183G02B6/36
    • H01S5/02288H01S5/0222H01S5/183
    • A hermetically sealed photonic device submount includes a photonic device mounted on a substrate material and sealed in a flexible hermetic seal. In one configuration, the photonic device is configured to emit or to receive light through the substrate material. In this configuration, the photonic device is covered with an adhesive layer and a metal layer depositd onto the adhesive layer. In another configuration, the photonic device is configured to emit or to receive light in a direction substantially vertically upward from the substrate material. In this configuration, a cover is placed over the photonic device, then the cover is hermetically sealed to the substrate material with an adhesive layer and a metal layer depositd onto the adhesive layer. In both configurations, the photonic device submounts are hermetically sealed according to various aspects of the present invention on the substrate material without using a separate package. Accordingly, any number of hermetically sealed photonic device submounts can be mass produced on wafers using the present invention.
    • 密封的光子器件底座包括安装在基底材料上并密封在柔性密封件中的光子器件。 在一种配置中,光子器件被配置为发射或接收穿过衬底材料的光。 在该配置中,光子器件被粘合剂层覆盖,金属层沉积到粘合剂层上。 在另一种配置中,光子器件被配置为发射或接收来自基底材料的基本垂直向上的方向的光。 在该配置中,将盖放置在光子器件上方,然后将盖密封到基底材料上,粘合剂层和金属层沉积在粘合剂层上。 在两种配置中,光子器件底座根据本发明的各个方面在衬底材料上气密密封,而不使用单独的封装。 因此,可以使用本发明在晶片上大量生产任何数量的密封的光子器件底座。