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91. 发明授权

US06763881B1 Thermally matched gradient heat sink 失效
标题翻译：热匹配梯度散热器
公开(公告)号：US06763881B1
公开(公告)日：2004-07-20
申请号：US09507507
申请日：2000-02-18
申请人： Guy R Wagner , Chandrakant Patel
发明人： Guy R Wagner , Chandrakant Patel
IPC分类号： F24H302
CPC分类号： H01L23/467 , H01L23/3736 , H01L2924/0002 , H01L2924/09701 , Y10S165/905 , H01L2924/00
摘要： An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of the heat generating electronic device, and a thermal conductivity greater than the thermal conductivity of the electronic device but less than the thermal conductivity of the heat sink. Provision of this intermediate layer substantially reduces stress on the electronic device caused by thermal cycling.
摘要翻译：包括发热电子装置和散热器的组件在它们之间设置有中间梯度区域。该中间区域包括基本上与发热电子器件的热膨胀系数匹配的热膨胀系数和大于电子器件的热导率但小于散热片的热导率的热导率的材料。提供这种中间层大大减少了由热循环引起的电子设备的应力。

92. 发明授权

US06115251A Cooling apparatus for computer subsystem 有权
标题翻译：计算机子系统冷却装置
公开(公告)号：US06115251A
公开(公告)日：2000-09-05
申请号：US294305
申请日：1999-04-15
申请人： Chandrakant Patel , Edward M. Aoki , Cullen Bash
发明人： Chandrakant Patel , Edward M. Aoki , Cullen Bash
IPC分类号： G06F1/18 , G06F1/20 , G11B33/14 , H05K7/20
CPC分类号： G06F1/184 , G06F1/182 , G06F1/187 , G06F1/20 , G11B33/1413 , H05K7/20545 , H05K7/20736 , H05K7/20818 , G06F2200/201
摘要： An improved apparatus is disclosed for cooling the power dissipating components of a computer subsystem, including microprocessors and hard disk drive assemblies. The apparatus utilizes the computer subsystem's chassis or enclosure, by configuring it as a roll bond panel formed from two sheets bonded together to define a fluid channel therebetween. Various concentrated sources of power dissipation are mounted within the enclosure on special component panels that themselves define a fluid channel. A working fluid is disposed within the channels of the component panels and the enclosure panel. During operation, heat generated by the sources of power dissipation is transferred to the working liquid within the fluid channels of the component panels and, in turn, to the working fluid disposed within the fluid channel of the enclosure panel, for dissipation by convection. In one disclosed embodiment, the working fluid undergoes a reversible phase change, to facilitate an efficient transfer of heat throughout the enclosure panel and thereby to heat the panel to a substantially uniform temperature.
摘要翻译：公开了一种用于冷却包括微处理器和硬盘驱动器组件的计算机子系统的功率耗散部件的改进的装置。该装置利用计算机子系统的底盘或外壳，将其构成为由两片粘结在一起形成的流体通道形成的辊接合面板。各种集中的功率消耗源在外壳内安装在其自身限定流体通道的特殊部件面板上。工作流体设置在部件面板和外壳面板的通道内。在操作期间，由功率耗散源产生的热量传递到组件面板的流体通道内的工作液体，并且转移到设置在外壳面板的流体通道内的工作流体，以便通过对流消散。在一个公开的实施例中，工作流体经历可逆的相变，以便有效地将热量传递到整个外壳面板，从而将面板加热到基本均匀的温度。

93. 发明授权

US5147501A Electronic devices 失效
公开(公告)号：US5147501A
公开(公告)日：1992-09-15
申请号：US464431
申请日：1990-01-12
申请人： Neil A. Cade , Rosemary A. Lee , Chandrakant Patel , Helen A. Williams
发明人： Neil A. Cade , Rosemary A. Lee , Chandrakant Patel , Helen A. Williams
IPC分类号： H01J1/304 , H01J9/02 , H01T4/10
CPC分类号： H01J9/025 , H01J1/3042
摘要： In the production of micron-size pyramid emitters for field emission devices, a first layer of electrically-conductive material, such as single crystal silicon or metal, is etched to form column-like structures each of which tapers from each end of the column towards an intermediate portion along its length. A second conductive layer is formed in contact with the free ends of the columns, and etching of the columns is then resumed until the intermediate portion of each column is etched through, leaving a pair of pyramid emitters pointing towards one another and supported by the respective conductive layer.

94. 发明授权

US08560141B2 Management of a 3D package and cooling system 有权
标题翻译：管理3D封装和冷却系统
公开(公告)号：US08560141B2
公开(公告)日：2013-10-15
申请号：US12936000
申请日：2008-04-01
申请人： Amip Shah , Chandrakant Patel
发明人： Amip Shah , Chandrakant Patel
IPC分类号： G06F19/00
CPC分类号： G06F1/20 , G06F1/206 , Y02D10/16
摘要： In a method for managing at least one three-dimensional package and a cooling system having at least one active cooling mechanism configured to cool the at least one three-dimensional package, at least one of workload on and an environmental condition on or around the at least one three-dimensional package is identified. In addition, at least one of an active cooling mechanism and a three-dimensional package is controlled based upon at least one of the identified workload and environmental condition.
摘要翻译：在一种用于管理至少一个三维包装和冷却系统的方法中，所述冷却系统具有被配置为冷却所述至少一个三维包装件的至少一个主动冷却机构，确定至少一个三维包装。此外，基于所识别的工作量和环境条件中的至少一个来控制主动冷却机构和三维包装中的至少一个。

95. 发明授权

US08457806B2 Managing an infrastructure having a 3D package and cooling resource actuators 有权
标题翻译：管理具有3D封装和冷却资源执行器的基础架构
公开(公告)号：US08457806B2
公开(公告)日：2013-06-04
申请号：US12790436
申请日：2010-05-28
申请人： Amip J. Shah , Chandrakant Patel , Ratnesh Kumar Sharma
发明人： Amip J. Shah , Chandrakant Patel , Ratnesh Kumar Sharma
IPC分类号： G05D23/00 , H05K7/20
CPC分类号： H05K7/20836 , G05D23/1932 , G06F9/5094 , Y02D10/22
摘要： An apparatus for managing an infrastructure having one or more three-dimensional (3D) packages and a plurality of cooling resource actuators, each of the 3D packages including a plurality of heat sources, includes a heat source manager configured to determine heat load profiles of the heat sources. The apparatus also includes a cooling resource manager configured to determine capabilities of the plurality of cooling resource actuators to meet heat load demands of the plurality of heat sources based on the heat load profiles of the plurality of heat sources and an integrated thermal manager configured to match the capabilities of the plurality of cooling resource actuators to the heat load profiles of the plurality of heat sources.
摘要翻译：一种用于管理具有一个或多个三维（3D）包装和多个冷却资源致动器的基础设施的装置，每个3D包装包括多个热源，包括热源管理器，其配置成确定热源该装置还包括冷却资源管理器，该冷却资源管理器被配置为基于多个热源的热负荷分布来确定多个冷却资源致动器的能力以满足多个热源的热负荷需求;以及集成热管理器，其被配置为匹配多个冷却资源致动器对多个热源的热负荷曲线的能力。

96. 发明申请

US20120278272A1 SYSTEM AND METHOD FOR DISAGGREGATING POWER LOAD 有权
标题翻译：用于分散功率负载的系统和方法
公开(公告)号：US20120278272A1
公开(公告)日：2012-11-01
申请号：US13095518
申请日：2011-04-27
申请人： Hyungsul Kim , Manish Marwah , Martin Arlitt , Geoff Lyon , Martha Lyons , Chandrakant Patel , Cullen Bash
发明人： Hyungsul Kim , Manish Marwah , Martin Arlitt , Geoff Lyon , Martha Lyons , Chandrakant Patel , Cullen Bash
IPC分类号： G06N5/04
CPC分类号： G06K9/6277 , G06F11/3006 , G06F11/3013 , G06F11/3062 , G06F11/3096 , G06K9/6297
摘要： Systems and methods of disaggregating power load are provided. An example of a method is carried out by program code stored on non-transient computer-readable medium and executed by a processor. The method includes receiving time series data representing total energy consumption. The method also includes identifying distinguishing features in the time series data. The method also includes identifying energy consumption constituents of the total energy consumption based on the features.
摘要翻译：提供了分解功率负载的系统和方法。方法的示例由存储在非瞬态计算机可读介质上并由处理器执行的程序代码执行。该方法包括接收表示总能量消耗的时间序列数据。该方法还包括识别时间序列数据中的区别特征。该方法还包括基于特征来识别总能量消耗的能量消耗成分。

97. 发明申请

US20120006038A1 COOLING SYSTEMS AND METHODS 有权
标题翻译：冷却系统和方法
公开(公告)号：US20120006038A1
公开(公告)日：2012-01-12
申请号：US12833080
申请日：2010-07-09
申请人： Ratnesh Kumar Sharma , Thomas W. Christian , Chandrakant Patel
发明人： Ratnesh Kumar Sharma , Thomas W. Christian , Chandrakant Patel
IPC分类号： F25D17/06 , F28D5/00 , F24F3/14
CPC分类号： H05K7/20745 , F24F2221/40
摘要： According to one example of the present invention, a cooling system is provided. The cooling system comprises a water-cooled air conditioning module for cooling air from a chamber. The chamber is arranged for receiving air to be cooled and hot humid air. The cooling system also comprises a control system for controlling the flow of hot humid air to the chamber such that the air input to the air conditioning module has a predetermined relative humidity level within a predetermined range.
摘要翻译：根据本发明的一个实例，提供一种冷却系统。该冷却系统包括用于冷却来自腔室的空气的水冷式空调模块。该室被设置为接收要冷却的空气和热湿空气。该冷却系统还包括控制系统，用于控制向室内的热湿空气的流动，使得输入空调模块的空气具有预定范围内的预定相对湿度水平。

98. 发明申请

US20110175498A1 Data Center 审中-公开
标题翻译：数据中心
公开(公告)号：US20110175498A1
公开(公告)日：2011-07-21
申请号：US13121775
申请日：2008-09-30
申请人： Cullen Bash , Chandrakant Patel
发明人： Cullen Bash , Chandrakant Patel
IPC分类号： H05K5/02 , B23P11/00
CPC分类号： F24F11/0001 , F24F12/002 , H05K7/20745 , Y02B30/563 , Y10T29/49616
摘要： A data center includes a mobile enclosure having an interior space. The interior space includes a first section and a second section, where the first section is separated from the second section by a first divider. The first section houses a rack having a first side and a second side, where the rack is positioned to separate the first section into a first aisle and a second aisle such that fluid flow between the first aisle and the second aisle is substantially prevented other than through the rack. The first aisle includes a fluid delivery device and the second aisle includes a fluid removal device, where the second section facilitates fluid communication between the fluid removal device and the fluid delivery device.
摘要翻译：数据中心包括具有内部空间的移动外壳。内部空间包括第一部分和第二部分，其中第一部分通过第一分隔部与第二部分分离。第一部分容纳具有第一侧和第二侧的齿条，其中齿条被定位成将第一部分分离成第一通道和第二通道，使得在第一通道和第二通道之间的流体流动基本上被阻止除了通过机架。第一通道包括流体输送装置，第二通道包括流体去除装置，其中第二部分便于流体移除装置和流体输送装置之间的流体连通。

99. 发明授权

US07969727B2 Cooling 有权
标题翻译：冷却
公开(公告)号：US07969727B2
公开(公告)日：2011-06-28
申请号：US12432199
申请日：2009-04-29
申请人： Robert Tozer , Cullen Bash , Chandrakant Patel
发明人： Robert Tozer , Cullen Bash , Chandrakant Patel
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20818 , H05K7/20827
摘要： According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.
摘要翻译：根据一个实施例，设备外壳包括多个设备元件，每个元件具有一个或多个发热源。热交换器朝向设备外壳的顶部安装。热交换器热耦合到至少一些发热源。外壳包括排气口，通过该排气口，由热交换器加热的空气可被排出，以及入口通气口，来自设备外壳外部的空气可通过该排气口被抽入设备外壳中，以通过堆叠效应通风来冷却热交换器。

100. 发明申请

US20110029154A1 Management Of A 3D Package And Cooling System 有权
标题翻译： 3D封装和冷却系统的管理
公开(公告)号：US20110029154A1
公开(公告)日：2011-02-03
申请号：US12936000
申请日：2008-04-01
申请人： Amip Shah , Chandrakant Patel
发明人： Amip Shah , Chandrakant Patel
IPC分类号： G05D23/00
CPC分类号： G06F1/20 , G06F1/206 , Y02D10/16
摘要： In a method for managing at least one three-dimensional package and a cooling system having at least one active cooling mechanism configured to cool the at least one three-dimensional package, at least one of workload on and an environmental condition on or around the at least one three-dimensional package is identified. In addition, at least one of an active cooling mechanism and a three-dimensional package is controlled based upon at least one of the identified workload and environmental condition.
摘要翻译：在一种用于管理至少一个三维包装和冷却系统的方法中，所述冷却系统具有被配置为冷却所述至少一个三维包装件的至少一个主动冷却机构，确定至少一个三维包装。此外，基于所识别的工作量和环境条件中的至少一个来控制主动冷却机构和三维包装中的至少一个。

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