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91. 发明授权

US08906749B2 Method for fabricating a semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：US08906749B2
公开(公告)日：2014-12-09
申请号：US13432633
申请日：2012-03-28
申请人： Michael Bauer , Daniel Porwol , Ulrich Wachter
发明人： Michael Bauer , Daniel Porwol , Ulrich Wachter
IPC分类号： H01L21/00 , H01L23/22
CPC分类号： H01L23/29 , H01L21/565 , H01L23/24 , H01L23/291 , H01L23/293 , H01L23/3128 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor device and a method for making a semiconductor device are disclosed. In an embodiment a semiconductor device includes a semiconductor chip and a fiber reinforced encapsulation layer at least partly covering the semiconductor chip.
摘要翻译：公开了半导体器件和制造半导体器件的方法。在一个实施例中，半导体器件包括至少部分覆盖半导体芯片的半导体芯片和纤维增强封装层。

92. 发明申请

US20140035154A1 CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE 有权
标题翻译：芯片包装和制造芯片包装的方法
公开(公告)号：US20140035154A1
公开(公告)日：2014-02-06
申请号：US13564922
申请日：2012-08-02
申请人： Ottmar Geitner , Walter Hartner , Maciej Wojnowski , Ulrich Wachter , Michael Bauer , Andreas Stueckjuergen
发明人： Ottmar Geitner , Walter Hartner , Maciej Wojnowski , Ulrich Wachter , Michael Bauer , Andreas Stueckjuergen
IPC分类号： H01L23/31 , H01L21/56
CPC分类号： H01L24/96 , H01L23/3128 , H01L23/49855 , H01L23/5389 , H01L23/66 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16225 , H01L2224/2105 , H01L2224/211 , H01L2224/214 , H01L2224/24051 , H01L2224/32245 , H01L2224/73151 , H01L2224/73259 , H01L2224/73267 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1304 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/142 , H01L2924/15311 , H01L2924/18162 , H01L2924/014 , H01L2924/01029 , H01L2924/01013 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01046 , H01L2924/0103 , H01L2924/01028 , H01L2924/01026 , H01L2224/13 , H01L2224/21 , H01L2924/00 , H01L2924/00014
摘要： A chip package is provided, the chip package including: a chip including at least one contact pad formed on a chip front side; an encapsulation material at least partially surrounding the chip and covering the at least one contact pad; and at least one electrical interconnect formed through the encapsulation material, wherein the at least one electrical interconnect is configured to electrically redirect the at least one contact pad from a chip package first side at the chip front side to at least one solder structure formed over a chip package second side at a chip back side.
摘要翻译：提供了芯片封装，芯片封装包括：芯片，包括形成在芯片正面上的至少一个接触焊盘; 至少部分地围绕所述芯片并且覆盖所述至少一个接触垫的封装材料; 以及通过所述封装材料形成的至少一个电互连，其中所述至少一个电互连构造成将所述至少一个接触焊盘从所述芯片前侧的芯片封装第一侧电重定向到形成在所述芯片前侧上的至少一个焊料结构芯片封装第二面在芯片背面。

93. 发明授权

US08603378B2 Process for the production of thin layers of silicone, thin silicone and use 有权
标题翻译：生产薄层硅胶，薄硅胶和使用的工艺
公开(公告)号：US08603378B2
公开(公告)日：2013-12-10
申请号：US11287609
申请日：2005-11-28
申请人： Josef Müller , Walter Günter , Michael Bauer , Kurt Stark
发明人： Josef Müller , Walter Günter , Michael Bauer , Kurt Stark
IPC分类号： B32B25/12
CPC分类号： B32B27/32 , B29C47/0021 , B29C47/02 , B29C47/065 , B29C51/00 , B29K2023/06 , B29K2023/0625 , B29K2023/0633 , B29K2023/12 , B29K2083/00 , B32B7/06 , B32B7/12 , B32B25/20 , B32B27/08 , B32B27/283 , B32B27/306 , B32B27/308 , B32B2250/24 , B32B2250/40 , B32B2274/00 , B32B2307/412 , B32B2307/712 , B32B2439/80 , B32B2551/00 , B32B2553/00 , C09J7/401 , C09J2483/005
摘要： An process for producing thin silicone by extrusion of a layer of silicone. The silicone layer may be extruded onto a substrate layer. The silicone layer and the substrate layer may be extruded together out of an extrusion die.
摘要翻译：通过挤出一层硅树脂生产薄硅树脂的方法。有机硅层可以挤出到基底层上。硅氧烷层和基材层可以从挤出模头挤出在一起。

94. 发明授权

US08528941B2 Security element having a laser marking 有权
标题翻译：安全元件具有激光打标
公开(公告)号：US08528941B2
公开(公告)日：2013-09-10
申请号：US12299924
申请日：2007-04-26
申请人： Walter Dörfler , Michael Bauer
发明人： Walter Dörfler , Michael Bauer
IPC分类号： B42D15/00
CPC分类号： B42D25/435 , B42D25/00 , B42D25/23 , B42D25/29 , B42D25/351 , B42D25/405
摘要： The present invention relates to a security element for security papers, value documents and the like, having a laser-markable transparent or translucent marking layer into which, through the action of laser radiation, visually perceptible identifiers are introduced in the form of patterns, letters, numbers and/or images. The identifiers each comprise a lamellar structure composed of a plurality of substantially parallel lamella that extend into the depth of the marking layer and include the parameters color, width, height, lateral orientation, tilt angle and/or spacing.
摘要翻译：本发明涉及一种用于安全纸，价值凭证等的安全元件，具有可激光标记的透明或半透明标记层，通过激光辐射的作用，以图案形式引入视觉上可感知的标识符，数字和/或图像。标识符各自包括由延伸到标记层的深度并包括参数颜色，宽度，高度，横向，倾斜角和/或间隔的多个基本上平行的薄片组成的层状结构。

95. 发明申请

US20130228211A1 PHOTOVOLTAIC ELEMENT WITH OPTICALLY FUNCTIONAL CONVERSION LAYER FOR IMPROVING A CONVERSION OF INCIDENT LIGHT AND PRODUCTION METHOD FOR THE ELEMENT 审中-公开
标题翻译：具有光功能转换层的光伏元件，用于改善元件转换和元件的生产方法
公开(公告)号：US20130228211A1
公开(公告)日：2013-09-05
申请号：US13600679
申请日：2012-08-31
申请人： Jochen Fritsche , Michael Bauer
发明人： Jochen Fritsche , Michael Bauer
IPC分类号： H01L31/0232 , H01L31/0203
CPC分类号： H01L31/0481 , H01L31/046 , H01L31/048 , H01L31/0488 , H01L31/0504 , H01L31/055 , H01L31/1876 , Y02E10/52
摘要： The invention relates to a photovoltaic element including an optically functional surface layer for improving a conversion of the incident light. The functioning of the layer involves absorbing incident sunlight having a low wavelength and emitting it again as light radiation having a higher wavelength, so that this light spectrum becomes usable for solar cells. In order to solve the currently unsolved problem of embedding such a layer into a thin-film solar cell with a substrate arranged on the front side, while ensuring high weathering resistance, it is proposed to arrange the optical functional layer in an additional encapsulation element on the front side and thus to construct the photovoltaic element as a double- or multiple composite assembly.
摘要翻译：本发明涉及一种包括用于改善入射光转换的光学功能表面层的光电元件。该层的功能涉及吸收具有低波长的入射太阳光并再次发射作为具有较高波长的光辐射，使得该光谱可用于太阳能电池。为了解决目前尚未解决的问题，即将这种层嵌入具有布置在正面上的基板的薄膜太阳能电池中，同时确保高耐候性，提出将光功能层布置在另外的封装元件上从而将光电元件构造成双重或多重复合组件。

96. 发明申请

US20130169345A1 ELECTRONIC RELAY, ELECTRONIC SYSTEM AND METHOD FOR SWITCHING A POWER CURRENT 审中-公开
标题翻译：电子继电器，电子系统和切换电源电流的方法
公开(公告)号：US20130169345A1
公开(公告)日：2013-07-04
申请号：US13512559
申请日：2010-11-26
申请人： Michael Bauer
发明人： Michael Bauer
IPC分类号： H03K17/00
CPC分类号： H03K17/00 , G08C17/02 , G08C2201/51 , H04L12/12 , Y02D50/40
摘要： The invention relates to an electronic relay with an input plug-in contact (30) and at least one output plug-in contact (87, 87a) for a current to be switched, an electronic component (104) for processing data and for actuating a semiconductor switch (116) for switching the current, a wireless communications interface (106, 108) for connection to a wireless communications network (150), wherein the wireless communications interface is embodied for receiving a first switching signal (120), a control plug-in contact (15) for receiving a second switching signal (122), at least one signal input plug-in contact (W, X, Y, Z) for receiving at least a first data signal (152), wherein the electronic component is embodied such that the semiconductor switch is actuated for switching the current based upon the reception of the first or second switching signal, and such that the first data signal received via at least one signal input plug-in contact is processed and, based upon a result of the data processing of the first data signal, the semiconductor switch is actuated for switching the current.
摘要翻译：本发明涉及一种具有输入插入式触点（30）和用于切换电流的至少一个输出插入式触头（87,87a）的电子继电器，用于处理数据并致动的电子部件（104）用于切换电流的半导体开关（116），用于连接到无线通信网络（150）的无线通信接口（106,108），其中所述无线通信接口被实现为用于接收第一切换信号（120），控制用于接收第二切换信号（122）的插入式触点（15），用于接收至少第一数据信号（152）的至少一个信号输入插件式触头（W，X，Y，Z），其中电子元件被实现为使得半导体开关被致动以基于第一或第二开关信号的接收来切换电流，并且使得经由至少一个信号输入插件触点接收到的第一数据信号被处理，并且基于 dat的结果处理第一数据信号时，半导体开关被致动以切换电流。

97. 发明授权

US08440733B2 Semiconductor component and production method 有权
标题翻译：半导体元件及生产方法
公开(公告)号：US08440733B2
公开(公告)日：2013-05-14
申请号：US13461202
申请日：2012-05-01
申请人： Joachim Mahler , Alfred Haimerl , Michael Bauer , Angela Kessler , Wolfgang Schober
发明人： Joachim Mahler , Alfred Haimerl , Michael Bauer , Angela Kessler , Wolfgang Schober
IPC分类号： C08J9/00
CPC分类号： H01L23/49894 , H01L21/56 , H01L23/293 , H01L23/3142 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/19041 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam.
摘要翻译：半导体元件的制造方法及半导体元件的制造方法。本发明涉及一种具有半导体芯片的半导体元件，该半导体元件布置在基板上，在一个实施例中在芯片载体上，以及至少部分地围绕半导体芯片的封装材料。芯片载体至少部分地设置有聚合物泡沫层。

98. 发明授权

US08418615B2 Method for individualising security documents and corresponding security document 有权
标题翻译：个性化安全文件和相应安全文件的方法
公开(公告)号：US08418615B2
公开(公告)日：2013-04-16
申请号：US10490478
申请日：2002-09-19
申请人： Michael Bauer , Werner Bochmann
发明人： Michael Bauer , Werner Bochmann
IPC分类号： B41F31/00 , B41F33/00
CPC分类号： B42D25/29 , B41M1/10 , B41M3/00
摘要： A method for individualizing security documents provides that high security quality, application-neutral printed image 1 identical for a group of security documents is overprinted with second printed image 2 individualizing the security document, whereby the printing ink of second printed image 2 is repelled by the printing ink of first printed image 1. The printing ink of the second printed image is therefore deposited only in the areas of the first printed image where no printing ink of the first printed image is present. Preferably, the first printed image is produced by intaglio printing and the second printed image by means of liquid printing ink, in particular by the ink jet method.
摘要翻译：用于个性化安全文件的方法提供了对安全文件组相同的高安全性质量的与应用程序无关的打印图像1与第二打印图像2进行叠印，其中第二打印图像2对安全文件进行个性化，由此第二打印图像2的打印墨水被第一印刷图像的印刷油墨1.因此，第二印刷图像的印刷油墨仅沉积在第一印刷图像的不存在第一印刷图像的印刷油墨的区域中。优选地，第一印刷图像通过凹版印刷和第二印刷图像通过液体印刷油墨，特别是通过喷墨法产生。

99. 发明授权

US08062928B2 Semiconductor device having a semiconductor chip, and method for the production thereof 有权
标题翻译：具有半导体芯片的半导体装置及其制造方法
公开(公告)号：US08062928B2
公开(公告)日：2011-11-22
申请号：US12852653
申请日：2010-08-09
申请人： Michael Bauer , Edward Fuergut
发明人： Michael Bauer , Edward Fuergut
IPC分类号： H01L21/00
CPC分类号： H01L23/3157 , H01L21/563 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/73 , H01L2224/05571 , H01L2224/05573 , H01L2224/274 , H01L2224/27618 , H01L2224/27831 , H01L2224/29011 , H01L2224/73104 , H01L2224/81191 , H01L2224/83191 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2224/05599
摘要： A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer having a UV B-stageable material. The UV B-stageable material is applied on the active surface of the semiconductor wafer.
摘要翻译：公开了一种半导体器件，其具有具有倒装芯片触点和钝化表面的有源表面的半导体芯片。在一个实施例中，倒装芯片触点被作为底部填充材料的电绝缘层包围，该层具有UVB级材料。将UV B级材料施加在半导体晶片的有源表面上。

100. 发明授权

US07944061B2 Semiconductor device having through contacts through a plastic housing composition and method for the production thereof 有权
标题翻译：具有通过接触件的塑料外壳组合物的半导体器件及其制造方法
公开(公告)号：US07944061B2
公开(公告)日：2011-05-17
申请号：US11575851
申请日：2005-09-20
申请人： Michael Bauer , Thomas Bemmerl , Edward Fuergut , Simon Jerebic , Christian Stuempfl , Horst Theuss , Hermann Vilsmeier
发明人： Michael Bauer , Thomas Bemmerl , Edward Fuergut , Simon Jerebic , Christian Stuempfl , Horst Theuss , Hermann Vilsmeier
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H05K3/3442 , H01L21/4853 , H01L21/56 , H01L23/3128 , H01L23/49811 , H01L24/48 , H01L25/105 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/14 , H01L2924/15192 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3011 , H05K1/185 , H05K3/4046 , H05K2201/10492 , H05K2201/10515 , H05K2201/10636 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.
摘要翻译：本发明涉及一种半导体器件，其包括通过接触件通过塑料外壳组合物及其制造方法。为此，布线基板具有通过接触元件相对于布线基板垂直布置的焊料沉积物，并且延伸到半导体器件的顶侧。

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