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91. 发明授权

US08512861B2 Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers 有权
公开(公告)号：US08512861B2
公开(公告)日：2013-08-20
申请号：US13323995
申请日：2011-12-13
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B32B19/00 , B01D39/00
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

92. 发明授权

US08241228B1 Micro-scale and meso-scale hydraulic and pneumatic tools, methods for using, and methods for making 有权
标题翻译：微尺度和中尺度液压和气动工具，使用方法和制造方法
公开(公告)号：US08241228B1
公开(公告)日：2012-08-14
申请号：US12139445
申请日：2008-06-13
申请人： Adam L. Cohen , Chris R. Folk , Richard T. Chen , Dennis R. Smalley
发明人： Adam L. Cohen , Chris R. Folk , Richard T. Chen , Dennis R. Smalley
IPC分类号： A61B5/00
CPC分类号： A61B17/3201 , A61B2017/00345 , A61B2017/00526 , A61B2017/00539 , A61B2017/00544 , Y10T403/7011
摘要： Embodiments are directed to micro-scale or meso-scale hydraulically or pneumatically actuated devices, methods for forming such devices using multi-layer, multi-material electrochemical fabrication methods and particularly fabricating (i.e. building up) a plurality of components of devices that are moveable relative to one another in pre-assembled configurations wherein special features are designed into the devices (e.g. wide gaps in fabrication positions and narrowed gaps in working regions of component movement, mechanisms that inhibit the return of device components to fabrication positions after being moved into working regions, used of cylindrical interference and/or checkerboard bushings, etching holes in selected locations to allow removal of sacrificial material) to allow such fabrication to occur without violating intra-layer minimum feature size constraints while still obtaining effective gaps between components that are smaller than the minimum features size limits. Particular applications of such devices involve medical applications and in particular minimally invasive procedures where devices would be moved into a desired working area within a body of a patient via a lumen and then actuated while at the working location.
摘要翻译：实施例涉及微尺度或中尺度液压或气动致动装置，使用多层多材料电化学制造方法形成这种装置的方法，并且特别地制造（即，建立）可移动的装置的多个部件相对于彼此的预组装配置，其中将特殊特征设计到装置中（例如，制造位置中的宽间隙和部件移动的工作区域中的狭窄间隙，阻止装置部件移动到加工后的制造位置的机构区域，使用圆柱形干涉和/或棋盘衬套，在选定位置蚀刻孔以允许去除牺牲材料），以允许这种制造发生而不违反层内最小特征尺寸约束，同时仍获得小于最小特征尺寸限制。这种装置的具体应用涉及医疗应用，特别是微创手术，其中装置将通过内腔移动到患者身体内的期望工作区域中，然后在工作位置被致动。

93. 发明申请

US20120064227A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权
公开(公告)号：US20120064227A1
公开(公告)日：2012-03-15
申请号：US13273873
申请日：2011-10-14
申请人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J. J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： B05D5/00 , C25D1/00 , C23C14/34 , B05D1/02 , B05D1/18 , C23C16/44 , C25D5/02 , C25D7/00
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

94. 发明申请

US20110187397A1 Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 审中-公开
公开(公告)号：US20110187397A1
公开(公告)日：2011-08-04
申请号：US13025489
申请日：2011-02-11
申请人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
发明人： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC分类号： G01R1/067
CPC分类号： C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

95. 发明申请

US20110180410A1 Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures 审中-公开
标题翻译：具有电介质或活性碱的电化学结构和用于生产这种结构的方法和装置
公开(公告)号：US20110180410A1
公开(公告)日：2011-07-28
申请号：US13010324
申请日：2011-01-20
申请人： Jeffrey A. Thompson , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
发明人： Jeffrey A. Thompson , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D1/00
CPC分类号： C25D1/003 , B81C1/00373 , B81C2201/0181 , B81C2201/019
摘要： Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
摘要翻译：多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换发生。永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。

96. 发明授权

US07828952B2 Methods of and apparatus for electrochemically fabricating structures via interlaced layers or via selective etching and filling of voids 有权
标题翻译：通过隔行层电化学制造结构或通过选择性蚀刻和填充空隙的方法和装置
公开(公告)号：US07828952B2
公开(公告)日：2010-11-09
申请号：US11544899
申请日：2006-10-06
申请人： Dennis R. Smalley
发明人： Dennis R. Smalley
IPC分类号： C25D5/48
CPC分类号： C25D5/02 , B33Y10/00 , B33Y50/00 , B33Y50/02 , B81B2201/042 , B81C1/00126 , B81C1/0038 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01P15/0802 , G01P15/125 , G06F17/5072 , H01L21/2885 , H01L21/76885 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.
摘要翻译：通过沉积第一材料，选择性地蚀刻第一材料（例如经由掩模），沉积第二材料以填充由蚀刻产生的空隙，然后平坦化沉积物以便结合层，电化学地制造多层结构被创建并且之后向之前形成的层添加附加层。第一和第二沉积可以是毯子或选择类型。用于形成连续层的形成过程的重复可以在有或没有变化（例如：在图案上的变化;与沉积，蚀刻和/或平面化操作相关联的数量或存在或参数的变化）中重复，操作顺序或沉积的材料）。其他实施例使用使用与其它层相关联地沉积的材料与一些层相关联地沉积材料的操作形成多层结构。

97. 发明申请

US20100065431A1 Electrochemical Fabrication Process Including Process Monitoring, Making Corrective Action Decisions, and Taking Appropriate Actions 审中-公开
标题翻译：电化学制造过程包括过程监控，制定纠正措施决策，采取适当行动
公开(公告)号：US20100065431A1
公开(公告)日：2010-03-18
申请号：US12624189
申请日：2009-11-23
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Marvin M. Kilgo, III
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Marvin M. Kilgo, III
IPC分类号： C25D21/12
CPC分类号： C25D1/003 , B81B2201/042 , B81C99/004 , G01P15/0802 , G01P15/125 , H01L21/2885 , H01L21/4857 , H01L21/76879 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/241 , H05K3/243 , H05K3/4647
摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.
摘要翻译：用于生产多层结构的电化学制造工艺和设备包括用于提供构建操作的增强监控或构建操作的结果的检测，构建问题识别的操作或手段，用于评估校正动作选项的操作或手段的操作或装置或作出纠正行动决定的手段，以及基于这些决定执行行动的操作或手段。

98. 发明申请

US20090194425A1 Electrochemical Fabrication Methods Including Use of Surface Treatments to Reduce Overplating and/or Planarization During Formation of Multi-layer Three-Dimensional Structures 审中-公开
标题翻译：电化学制造方法包括在多层三维结构形成过程中使用表面处理减少过度平铺和/或平面化
公开(公告)号：US20090194425A1
公开(公告)日：2009-08-06
申请号：US12362175
申请日：2009-01-29
申请人： Adam L. Cohen , Dennis R. Smalley , Michael S. Lockard , Qui T. Le
发明人： Adam L. Cohen , Dennis R. Smalley , Michael S. Lockard , Qui T. Le
IPC分类号： H01L21/288
CPC分类号： H01L21/288 , B33Y10/00 , C23C18/1605 , C25D5/022 , C25D5/10 , H01L21/311 , H01L21/7682 , H01L21/76879
摘要： A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.
摘要翻译：从至少第一和第二材料的多个粘附层制造三维结构的方法，其中所述第一材料是导电材料，并且其中多个层中的每一个包括在沉积之前处理第一材料的表面的第二种材料。第一材料的表面的处理（1）降低了将第二材料沉积到第一材料的表面上的敏感性，或（2）减轻或加快了沉积在第一材料的处理表面上的任何第二材料的去除材料。在一些实施例中，第一表面的处理包括在表面上形成电介质涂层，并且第二材料被电沉积（例如使用电镀或电泳工艺）。在其它实施例中，第一材料涂覆有不容易接受电镀或无电沉积材料沉积物的导电材料。

99. 发明授权

US07524427B2 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 有权
公开(公告)号：US07524427B2
公开(公告)日：2009-04-28
申请号：US11029218
申请日：2005-01-03
申请人： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
发明人： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
IPC分类号： B81C1/00
CPC分类号： C25D1/003 , B33Y10/00 , C23C18/1605 , C23C18/1608 , C23C18/1653 , C25D5/022 , C25D5/10
摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

100. 发明授权

US07517462B2 Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 有权
标题翻译：电介质材料和/或使用电介质基片的电化学制造方法
公开(公告)号：US07517462B2
公开(公告)日：2009-04-14
申请号：US11029014
申请日：2005-01-03
申请人： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
发明人： Adam L. Cohen , Michael S. Lockard , Kieun Kim , Qui T. Le , Gang Zhang , Uri Frodis , Dale S. McPherson , Dennis R. Smalley
IPC分类号： B81C1/00
CPC分类号： B44C1/22 , B33Y10/00 , B81C1/00492 , C03C15/00 , C03C25/68 , C23C18/1605 , C23C18/161 , C23C18/1651 , C23C18/1653 , C23C18/405 , C23F1/00 , C25D1/003 , C25D5/02 , C25D5/10 , H01L21/2885 , H01L21/44 , H01L21/4763 , H01L21/76885
摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.
摘要翻译：本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。在一些实施方案中，电介质材料是可UV固化的光聚合物。

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