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91. 发明授权

US08748905B2 High efficacy semiconductor light emitting devices employing remote phosphor configurations 有权
标题翻译：采用远程荧光粉配置的高效半导体发光器件
公开(公告)号：US08748905B2
公开(公告)日：2014-06-10
申请号：US13278238
申请日：2011-10-21
申请人： Christopher P. Hussell , Florin Tudorica , David Todd Emerson
发明人： Christopher P. Hussell , Florin Tudorica , David Todd Emerson
IPC分类号： H01L27/15
CPC分类号： F21V3/00 , F21K9/61 , F21K9/64 , F21V3/02 , F21V3/049 , F21V3/12 , F21Y2115/10 , G02B5/0236 , G02B5/0278 , G02B6/0003 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0096
摘要： A semiconductor light emitting apparatus a semiconductor light emitting device configured to emit light inside a hollow shell including wavelength conversion material dispersed therein or thereon. A semiconductor light emitting apparatus according to some embodiments is capable of generating in excess of 230 lumens per watt.
摘要翻译：一种半导体发光装置，其被配置为在包含分散在其中的波长转换材料或其上的中空壳内发光。根据一些实施例的半导体发光装置能够产生超过每瓦230流明。

92. 外观设计

USD691100S1 Miniature surface mount device 有权
公开(公告)号：USD691100S1
公开(公告)日：2013-10-08
申请号：US29386583
申请日：2011-03-02
申请人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , Yue Kwong Lau , Jun Zhang , David Todd Emerson
设计人： Chi Keung Chan , Chak Hau Pang , Fei Hong Li , Yue Kwong Lau , Jun Zhang , David Todd Emerson

93. 外观设计

USD689210S1 Lamp packages 有权
标题翻译：灯包装
公开(公告)号：USD689210S1
公开(公告)日：2013-09-03
申请号：US29402573
申请日：2011-09-23
申请人： Matthew Donofrio , John Adam Edmond , Hua Shuang Kong , Peter S. Andrews , David Todd Emerson
设计人： Matthew Donofrio , John Adam Edmond , Hua Shuang Kong , Peter S. Andrews , David Todd Emerson

94. 外观设计

USD689209S1 Lamp packages 有权
公开(公告)号：USD689209S1
公开(公告)日：2013-09-03
申请号：US29402571
申请日：2011-09-23
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
设计人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson

95. 发明申请

US20130082291A1 Light Emitting Devices with Low Packaging Factor 有权
标题翻译：具有低封装因数的发光器件
公开(公告)号：US20130082291A1
公开(公告)日：2013-04-04
申请号：US13252448
申请日：2011-10-04
申请人： James Ibbetson , David Todd Emerson
发明人： James Ibbetson , David Todd Emerson
IPC分类号： H01L33/52
CPC分类号： H01L33/54 , H01L33/22 , H01L33/405 , H01L33/46 , H01L2224/48091 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A light emitting diode that when encapsulated within an overmolded hemispherical lens has a packaging factor less than 1.2.
摘要翻译：封装在包覆成型的半球形透镜中的发光二极管的封装因子小于1.2。

96. 发明申请

US20120305958A1 RED NITRIDE PHOSPHORS 有权
标题翻译：红色氮化磷
公开(公告)号：US20120305958A1
公开(公告)日：2012-12-06
申请号：US13152863
申请日：2011-06-03
申请人： Harry A. Seibel, II , Brian Thomas Collins , David Todd Emerson
发明人： Harry A. Seibel, II , Brian Thomas Collins , David Todd Emerson
IPC分类号： H01L33/50 , C09K11/79
CPC分类号： C09K11/7734 , C09K11/0883 , H01L2224/48465
摘要： Provided according to embodiments of the invention are phosphor compositions that include Ca1-x-ySrxEuyAlSiN3, wherein x is in a range of 0.50 to 0.99 and y is less than 0.013. Also provided according to embodiments of the invention are phosphor compositions that include Ca1-x-ySrxEuyAlSiN3, wherein x is in a range of 0.70 to 0.99 and y is in a range of 0.001 and 0.025. Also provided are methods of making phosphors and light emitting devices that include a phosphor composition according to an embodiment of the invention.
摘要翻译：根据本发明的实施方案提供的是包含Ca1-x-ySrxEuyAlSiN3的荧光体组合物，其中x在0.50至0.99的范围内，y小于0.013。根据本发明的实施方案还提供了包含Ca1-x-ySrxEuyAlSiN3的荧光体组合物，其中x在0.70至0.99的范围内，y在0.001和0.025的范围内。还提供了制造荧光体和发光器件的方法，其包括根据本发明的实施方案的荧光体组合物。

97. 外观设计

USD669040S1 Light emitting diode 有权
公开(公告)号：USD669040S1
公开(公告)日：2012-10-16
申请号：US29365193
申请日：2010-07-06
申请人： Christopher P. Hussell , David Todd Emerson
设计人： Christopher P. Hussell , David Todd Emerson

98. 发明申请

US20120193649A1 LIGHT EMITTING DIODE (LED) ARRAYS INCLUDING DIRECT DIE ATTACH AND RELATED ASSEMBLIES 有权
标题翻译：发光二极管（LED）阵列包括直接连接和相关组件
公开(公告)号：US20120193649A1
公开(公告)日：2012-08-02
申请号：US13027006
申请日：2011-02-14
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
发明人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
IPC分类号： H01L27/15 , H01L21/82
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/62 , H01L2224/16
摘要： An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die.
摘要翻译：电子设备可以包括具有包装基板面的封装基板，在封装基板面上具有多个导电焊盘。第一发光二极管管芯可以桥接第一和第二导电焊盘。更具体地，第一发光二极管管芯可以包括使用金属接合分别耦合到第一和第二导电焊盘的第一阳极和阴极触点。此外，第一阳极接触件和第一焊盘之间以及第一阴极接触件和第二焊盘之间的金属接合的宽度可以是第一发光二极管管芯的宽度的至少60％。第二发光二极管管芯可以桥接第三和第四导电焊盘。第二发光二极管管芯可以包括使用金属接合分别耦合到第三和第四导电焊盘的第二阳极和阴极触点。第二阳极接触件和第二焊盘之间以及第二阴极接触件和第三焊盘之间的金属接合的宽度可以是第一发光二极管管芯的宽度的至少60％。

99. 外观设计

USD606948S1 LED 有权
公开(公告)号：USD606948S1
公开(公告)日：2009-12-29
申请号：US29249263
申请日：2006-09-28
申请人： Christopher Parke Hussell , David Todd Emerson
设计人： Christopher Parke Hussell , David Todd Emerson

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