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    • 100. 发明授权
    • Methods for risk-informed chip layout generation
    • 风险信息芯片布局生成方法
    • US07590968B1
    • 2009-09-15
    • US11680552
    • 2007-02-28
    • Scott T. BeckerMichael C. Smayling
    • Scott T. BeckerMichael C. Smayling
    • G06F17/50
    • G06F17/5068G06F17/5072
    • A chip layout is generated based on a quantified fabrication process capability. A minimum required value is selected for a fabrication process capability factor associated with a fabrication process to be performed on a layer sub-region within the chip. Design rules are determined for the layer sub-region within the chip that will enable the selected minimum required value for the fabrication process capability factor associated with the layer sub-region to be satisfied. A layout is then generated for the layer sub-region within the chip using the determined design rules associated with the layer sub-region. Fabrication process capability can be improved by restricting the design rules and generated layouts to a linear design style that requires features defined within the chip to be linear in shape and without bends. The linear design style enables optimization of photolithographic rendering without the need to consider two-dimensional optical effects.
    • 基于量化的制造工艺能力产生芯片布局。 选择与在芯片内的层子区域执行的制造工艺相关联的制造工艺能力因素的最小所需值。 确定芯片内的层子区域的设计规则,使得能够满足与层子区域相关联的制造工艺能力因素所选择的最小所需值。 然后使用与层子区域相关联的确定的设计规则为芯片内的层子区域生成布局。 可以通过将设计规则和生成的布局限制为线性设计风格来提高制造工艺能力,该线性设计风格需要在芯片内定义的特征是线性的,没有弯曲。 线性设计风格可以优化光刻渲染,而无需考虑二维光学效果。