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91. 发明申请

US20130289187A1 RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE 审中-公开
标题翻译：用于封装和电子元件装置的树脂组合物
公开(公告)号：US20130289187A1
公开(公告)日：2013-10-31
申请号：US13880186
申请日：2011-10-18
申请人： Masahiro Wada , Ken Ukawa , Kenji Yoshida , Yusuke Tanaka
发明人： Masahiro Wada , Ken Ukawa , Kenji Yoshida , Yusuke Tanaka
IPC分类号： H01B3/40
CPC分类号： H01B3/40 , C08G59/621 , H01L23/295 , H01L23/3107 , H01L23/3128 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01079 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00011 , H01L2924/00012 , H01L2924/20752
摘要： A resin composition for encapsulation according to the present invention includes: a phenol resin-based curing agent (A) essentially containing a polymer component (A-1) in which a biphenylene group-containing structural unit bonds a monovalent hydroxyphenylene structural unit and a polyvalent hydroxyphenylene structural unit together and a polymer component (A-2) in which the biphenylene group-containing structural unit bonds the polyvalent hydroxyphenylene structural units together; an epoxy resin (B); and an inorganic filler (C). This makes it possible to economically obtain a resin composition for encapsulation having soldering resistance, flame resistance, continuous moldability, flowability and high temperature storage stability in an excellent balanced manner, and an electronic component device produced by encapsulating an element with a cured product thereof and having high reliability.
摘要翻译：根据本发明的用于封装的树脂组合物包括：基本上含有其中含联苯基的结构单元与一价羟基亚苯基结构单元和多价基团结合的聚合物组分（A-1）的酚醛树脂基固化剂（A）羟基亚苯基结构单元以及含有亚联苯基的结构单元将多价羟基亚苯基结构单元结合在一起的聚合物组分（A-2）环氧树脂（B）; 和无机填料（C）。这使得可以以优异的平衡方式经济地获得具有耐焊接性，阻燃性，连续成型性，流动性和高温储存稳定性的封装用树脂组合物，以及通过用固化物包封元件而制造的电子部件装置，具有高可靠性。

92. 发明授权

US08446619B2 Print control apparatus, print control system and print apparatus 有权
标题翻译：打印控制装置，打印控制系统和打印装置
公开(公告)号：US08446619B2
公开(公告)日：2013-05-21
申请号：US12148541
申请日：2008-04-17
申请人： Masahiro Wada
发明人： Masahiro Wada
IPC分类号： G06F3/12
CPC分类号： G06F3/1267 , G06F3/1204 , G06F3/1212 , G06F3/1222 , G06F3/1241 , G06F3/1274 , G06F3/1288
摘要： A print control apparatus in which a plurality of print apparatuses having a hold print function are caused to hold print data, and the print data of other print apparatuses other than a print apparatus print-instructed by a user is deleted, is provided. A print server is connected to the plurality of printers having a hold print function through a network. The print server includes a print data transmission portion that transmits print data received from a PC to printers to cause the printers to hold the print data, and a print data deletion instruction portion that, when a print notification of the print data is received from any one of the plurality of the printers, instructs other printers other than the printer to delete the print data.
摘要翻译：提供了具有保持打印功能的多个打印装置保持打印数据的打印控制装置，并且删除了由用户打印指示的打印装置以外的其他打印装置的打印数据。打印服务器通过网络连接到具有保持打印功能的多个打印机。打印服务器包括将从PC接收的打印数据发送到打印机以使打印机保持打印数据的打印数据传输部分，以及当从任何方式接收到打印数据的打印通知时的打印数据删除指令部分多个打印机之一指示打印机以外的其他打印机删除打印数据。

93. 发明申请

US20130075154A1 SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION 有权
标题翻译：含硅可固化组合物，含硅固化组合物的固化产物和含硅固化组合物的引线框架基板
公开(公告)号：US20130075154A1
公开(公告)日：2013-03-28
申请号：US13700370
申请日：2011-06-06
申请人： Masako Saito , Ichiro Hiratsuka , Masahiro Wada , Ryota Chiba , Takuya Kanazawa , Osamu Yoshioka , Takehito Tsukamoto , Junko Toda
发明人： Masako Saito , Ichiro Hiratsuka , Masahiro Wada , Ryota Chiba , Takuya Kanazawa , Osamu Yoshioka , Takehito Tsukamoto , Junko Toda
IPC分类号： C08L83/06 , H01L23/057
CPC分类号： C08L83/06 , C08G77/12 , C08G77/20 , C08K5/0025 , C08K5/14 , C08K5/5425 , C08K5/549 , C08L83/04 , H01L23/057 , H01L23/49861 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.
摘要翻译：可固化组合物包括：通过包括R1SiX3，R2SiX3，R3R4SiX2和R5SiX3的有机硅烷混合物的水解缩合得到的Mw为3,000〜100,000的含硅聚合物100质量份，R2SiX3和R3R4SiX2的合计为5〜60 mol％，任选的预聚物，任选的环状硅氧烷化合物，0.0001-10质量份有机过氧化物和任选的金属催化剂，以及10-1500质量份填料，其中R1是C2-6链烯基， R2是C1-6烷基，R3和R4各自是C1-6烷基，R5是任选被C 1-6烷基取代的苯基，X是C 1-6烷氧基，一个或多个 R 2〜R 4为甲基，f表示2〜10的数，g表示0〜8的数，n表示1或2。

94. 发明申请

US20120061861A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE 有权
标题翻译：用于封装半导体和半导体器件的树脂组合物
公开(公告)号：US20120061861A1
公开(公告)日：2012-03-15
申请号：US13322037
申请日：2010-05-28
申请人： Masahiro Wada
发明人： Masahiro Wada
IPC分类号： H01L23/29 , C08K3/22 , C08L61/06 , C08L63/04 , C08K3/36 , C08L63/00 , C08L63/02
CPC分类号： H01L23/293 , C08G59/621 , C08G59/688 , C08L63/00 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/10253 , H01L2924/1301 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/20752 , H01L2924/20656
摘要： Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
摘要翻译：公开了一种包含具有一种或多种成分的酚醛树脂（A）的半导体的树脂组合物，该组分含有由具有第一结构单元和第二结构单元的聚合物组成的组分（A1），环氧树脂（B）和无机填料（C）。还公开了通过将半导体元件与用于封装半导体的树脂组合物的固化物封装而获得的半导体器件。

95. 发明授权

US07876907B2 Apparatus for fault detection for parallelly transmitted audio signals and apparatus for delay difference detection and adjustment for parallelly transmitted audio signals 有权
标题翻译：用于并行发送音频信号的故障检测装置和用于并行传输音频信号的延迟差检测和调整装置
公开(公告)号：US07876907B2
公开(公告)日：2011-01-25
申请号：US12285272
申请日：2008-10-01
申请人： Ryoichi Kawada , Atsushi Koike , Masahiro Wada , Shuichi Matsumoto
发明人： Ryoichi Kawada , Atsushi Koike , Masahiro Wada , Shuichi Matsumoto
IPC分类号： H04R29/00
CPC分类号： H04H20/12 , H04H20/22 , H04N5/04 , H04N5/60 , H04N21/439 , H04N21/44209
摘要： Characteristic amounts in each small region of audio signals transmitted in the working system and the standby system are extracted by characteristic amount calculators 6-1, 6-2. A characteristic amount comparator 7 compares the characteristic amounts and judges occurrence of fault of a fault. Characteristic amount difference calculators 9-1, 9-2, ∥D∥ comparator 10, and faulty system judging unit 11 judges the system having a fault. Majority decision processor 12 and significance judging unit 13 enhance the reliability of the judgement. Delay difference of audio signals between systems is roughly detected by sub-sampling audio signals of two systems and comparing them, and then accurately detected without sub-sampling. Delay difference between audio signals is adjusted by the detected delay difference.
摘要翻译：通过特征量计算器6-1,6-2提取在工作系统和备用系统中发送的音频信号的每个小区域中的特征量。特征量比较器7比较特征量并判断故障的发生。特征量计算器9-1,9-2，∥D‖比较器10和故障系统判断单元11判断具有故障的系统。多数决定处理器12和有效性判断单元13提高判断的可靠性。通过对两个系统的子采样音频信号进行比较，大致检测出系统之间音频信号的延迟差异，然后在不进行子采样的情况下准确检测。通过检测到的延迟差来调整音频信号之间的延迟差。

96. 发明申请

US20100303708A1 INORGANIC IODIDE, PRODUCTION METHOD THEREOF, AND PRODUCTION SYSTEM THEREOF 有权
标题翻译：无机碘，其生产方法及其生产系统
公开(公告)号：US20100303708A1
公开(公告)日：2010-12-02
申请号：US12864746
申请日：2009-01-29
申请人： Satoshi Kanbe , Kazumi Hosono , Masahiro Wada
发明人： Satoshi Kanbe , Kazumi Hosono , Masahiro Wada
IPC分类号： C01B9/06 , B01J19/00
CPC分类号： C01D3/12 , B01J23/42 , C01B9/06 , C01C1/168 , C01F11/20 , C01P2006/80
摘要： According to a method for producing an inorganic iodide in accordance with the present invention, it is possible to efficiently produce a highly pure inorganic iodide by reacting a hydrogen iodide gas with an inorganic base compound by bringing the hydrogen iodide gas into contact with the inorganic base compound. As such, it is possible to provide a simple and efficient method for producing an inorganic iodide.
摘要翻译：根据本发明的无机碘化物的制造方法，通过使碘化氢气体与无机碱接触，可以通过使碘化氢气体与无机碱性化合物反应而高效地制造高纯度的无机碘化物复合。因此，可以提供一种用于生产无机碘化物的简单有效的方法。

97. 发明申请

US20100289167A1 APPARATUS FOR PRODUCING POROUS BODY AND METHOD FOR PRODUCING POROUS BODY 有权
标题翻译：用于生产多孔体的装置和生产多孔体的方法
公开(公告)号：US20100289167A1
公开(公告)日：2010-11-18
申请号：US12446625
申请日：2007-10-23
申请人： Tetsuji Tsujimoto , Takumi Shibuya , Hiroki Ueno , Sakae Akiyama , Masahiro Wada
发明人： Tetsuji Tsujimoto , Takumi Shibuya , Hiroki Ueno , Sakae Akiyama , Masahiro Wada
IPC分类号： B29C44/16 , B29C44/34
CPC分类号： B22F3/1125 , B22F3/003 , B22F5/006
摘要： An apparatus for producing a porous body that forms an expandable slurry containing at least inorganic powder, a foaming agent, and a binder into a sheet, causes the expandable slurry sheet to be foamed and baked, and thereby produces the porous body, the apparatus includes: a mixer preparing the expandable slurry by containing inorganic powder, a foaming agent, and a binder; a die-coater that has a discharge opening which discharges the expandable slurry provided from the mixer to an external thereof so as to shape the expandable slurry into a sheet; and a carrier sheet arranged so as to face the discharge opening of the die-coater with a gap interposed therebetween, and feeding the expandable slurry discharged from the discharge opening, wherein a flow path of the expandable slurry from inside the mixer to the discharge opening of the die-coater is hermetically sealed from an outside.
摘要翻译：一种用于制造多孔体的装置，其形成至少含有无机粉末，发泡剂和粘合剂的片材的可膨胀浆料，使可膨胀浆料片发泡和烘烤，从而产生多孔体，该装置包括：通过含有无机粉末，发泡剂和粘合剂制备可膨胀浆料的混合机; 具有将从混合器提供的可膨胀浆料排出到其外部的排出口的模涂机，以将可膨胀浆料成形为片材; 以及载体片，其布置成与所述模具涂布机的排出口面对并间隔开，并且从所述排出口排出的所述可膨胀浆料供给，所述可膨胀浆料从所述混合器内部到所述排出口的涂布机与外部气密密封。

98. 发明授权

US07773674B2 Image matching device and method for motion pictures 有权
标题翻译：影像匹配装置及方法
公开(公告)号：US07773674B2
公开(公告)日：2010-08-10
申请号：US11905281
申请日：2007-09-28
申请人： Ryoichi Kawada , Osamu Sugimoto , Masahiro Wada , Atsushi Koike
发明人： Ryoichi Kawada , Osamu Sugimoto , Masahiro Wada , Atsushi Koike
IPC分类号： H04B1/66
CPC分类号： H04N5/145 , G06T7/223 , G06T2207/10016 , G06T2207/10021 , H04N7/014
摘要： A matching section performs motion estimation upon a predetermined processing unit of input video (p) by, e.g., an iterative gradient method. A motion vector (v) obtained by the iterative gradient method is obtained by the expression v=α·Δv+v0 (wherein v0 indicates an initial displacement motion vector and Δv indicates a differential vector). A characteristic amount extraction section extracts a characteristic amount from the distribution of motion vectors obtained by the motion estimation. A parameter determination section determines a conversion parameter α applied to the next processing unit by the characteristic amount. If the characteristic amount is equal to or larger than a predetermined threshold, the conversion parameter α is determined to be larger (e.g., α=1). If the characteristic amount is smaller than the threshold, the conversion parameter α is determined to be smaller (e.g., α=0.1).
摘要翻译：匹配部分通过例如迭代梯度法在输入视频（p）的预定处理单元上执行运动估计。通过表达式v =α·＆Dgr; v + v0（其中v0表示初始位移运动矢量，＆Dgr; v表示微分矢量）获得通过迭代梯度法获得的运动矢量（v）。特征量提取部从通过运动估计获得的运动矢量的分布中提取特征量。参数确定部分通过特征量确定应用于下一处理单元的转换参数α。如果特征量等于或大于预定阈值，则转换参数α被确定为较大（例如，α= 1）。如果特征量小于阈值，则转换参数α被确定为较小（例如，α= 0.1）。

99. 发明申请

US20100032616A1 MIXED MATERIAL WITH HIGH EXPANSION RATE FOR PRODUCING POROUS METALLIC SINTERED BODY 审中-公开
标题翻译：用于生产多孔金属烧结体的高膨胀率的混合材料
公开(公告)号：US20100032616A1
公开(公告)日：2010-02-11
申请号：US12446795
申请日：2007-10-23
申请人： Masahiro Wada , Eiko Kanda , Shinichi Ohmori , Takumi Shibuya , Tetsuji Tsujimoto
发明人： Masahiro Wada , Eiko Kanda , Shinichi Ohmori , Takumi Shibuya , Tetsuji Tsujimoto
IPC分类号： C09K3/00
CPC分类号： H01M4/0471 , B22F3/1125 , H01M4/661 , H01M4/669 , H01M4/745 , H01M4/80 , H01M4/801 , H01M4/806 , H01M4/808 , H01M4/8807 , H01M8/0234 , Y02P70/56
摘要： A mixed material having a high expansion rate for producing a porous metallic sintered body including: a conventional mixed material for producing a porous metallic sintered body which is formed of a mixture including a composition of 0.05 to 10% by mass of a non-water-soluble hydrocarbon-based organic solvent having 5 to 8 carbon atoms, 0.5 to 20% by mass of a water-soluble resin binder, and 5 to 80% by mass of a metal powder having an average particle size within a range of 0.5 to 500 μm, and water as the balance; and a gas, wherein the mixed material contains the gas so that the proportion of the gas is within a range of 2 to 50% by volume while the remainder is the conventional mixed material for producing a porous metallic sintered body.
摘要翻译：一种多孔金属烧结体的膨胀率高的混合材料，其特征在于，包括以下的制造多孔金属烧结体的常规的混合材料，所述多孔金属烧结体由含有0.05〜10质量％的非水溶性组合物的混合物形成，碳原子数5〜8的可溶性烃系有机溶剂，水溶性树脂粘合剂0.5〜20质量％，平均粒径0.5〜500的金属粉末5〜80质量％妈妈和水作为平衡; 和气体，其中混合材料含有气体，使得气体的比例在2至50体积％的范围内，而剩余部分是用于制备多孔金属烧结体的常规混合材料。

100. 发明申请

US20090321919A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090321919A1
公开(公告)日：2009-12-31
申请号：US11885404
申请日：2007-04-20
申请人： Mitsuo Sugino , Takeshi Hosomi , Masahiro Wada , Masataka Arai
发明人： Mitsuo Sugino , Takeshi Hosomi , Masahiro Wada , Masataka Arai
IPC分类号： H01L23/488 , H01L23/48
CPC分类号： H01L21/563 , H01L21/6835 , H01L23/293 , H01L24/16 , H01L2221/68345 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/30105 , H01L2924/00 , H01L2224/0401
摘要： The semiconductor device 1 includes a substrate 3, a semiconductor chip 4 mounted on the substrate 3, the substrate 3, a bump 5 connecting the substrate 3 and the semiconductor chip 4, and an underfill 6 filling in around the bump 5. In the case of a bump 5 composed of a high-melting-point solder having a melting point of 230° C. or more, the underfill 6 is composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bump 5 composed of a lead-free solder, the underfill 6 is composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layer 311 of buildup layers 31 of the substrate 3 has a linear expansion coefficient of 35 ppm/° C. or less in the in-plane direction of the substrate at temperatures in the range of 25° C. to the glass transition temperature.
摘要翻译：半导体器件1包括基板3，安装在基板3上的半导体芯片4，基板3，连接基板3和半导体芯片4的凸块5以及填充在凸块5周围的底部填充6。由熔点为230℃以上的高熔点焊料构成的凸块5由底部填充材料6构成，其弹性模量为30MPa〜3000MPa的范围。在由无铅焊料构成的突起5的情况下，底部填充物6由弹性模量在150MPa〜800MPa的范围内的树脂材料构成。基板3的堆积层31的绝缘层311在25℃的温度范围内的基板的面内方向的线膨胀系数为35ppm /℃以下，玻璃化转变温度。

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