会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 92. 发明授权
    • Method of in-mold coating
    • 模内涂层方法
    • US06180043B2
    • 2001-01-30
    • US09235766
    • 1999-01-25
    • Kenji YonemochiYoshiaki Yamamoto
    • Kenji YonemochiYoshiaki Yamamoto
    • B29C4514
    • B29C45/1679B29B7/76B29C37/0028B29C45/561
    • A method of in-mold coating, comprising steps of forming a molded product by applying a clamping pressure to a mold to mold a synthetic resin molding material in the mold according to an injection molding method, an injection compression molding method or an injection press molding method, then coating a surface of the molded product with a coating material in the mold, wherein the coating material is injected in such a state that the molded product has cured or solidified to such an extent that the surface of the molded product can withstand an injection pressure and a flow pressure of the coating material, and the clamping of the mold after injection of the coating material is carried out under certain multistagewise variable clamping pressures with certain clamping pressure transitional periods of time.
    • 一种模内涂布方法,包括以下步骤:通过向模具施加夹紧压力来形成模制产品,以根据注射成型方法,注射压缩模塑法或注射成型法模制合成树脂模制材料 方法,然后在模具中用涂料涂覆模制产品的表面,其中涂覆材料以这样的状态注入,即模制产品已经固化或固化到使模制产品的表面能承受的程度 注射压力和涂层材料的流动压力,并且在注射涂料之后的模具的夹紧在某些多级可变夹紧压力下以一定的夹紧压力过渡时间段进行。
    • 93. 发明授权
    • Method of fabricating semiconductor device for preventing rising-up of
siliside
    • 制造防止硅化物上升的半导体器件的方法
    • US6133122A
    • 2000-10-17
    • US89666
    • 1998-06-03
    • Yoshiaki Yamamoto
    • Yoshiaki Yamamoto
    • H01L21/28H01L21/265H01L21/324H01L21/336H01L21/8234H01L27/088H01L29/78H01L21/425
    • H01L29/665H01L21/2652H01L21/324
    • Disclosed is a manufacturing method of a semiconductor device which comprises which comprises an element isolation region formation step; a side wall formation step; a diffusion layer formation step; an activation step; a silicide formation step; and a removing step. The element isolation region formation step is the one for forming a field oxide film on a semiconductor substrate to form an element isolation region. In order to form a diffusion layer by introducing impurities into the semiconductor substrate, after injecting the fluorides (ion injection species) of elements into the semiconductor substrate, a thermal treatment is performed at a lower temperature than that of a thermal treatment for activating the diffusion layer prior to the activation of the diffusion layer, and fluorine produced from the ion injection species is discharged to the outside.
    • 公开了一种半导体器件的制造方法,包括:元件隔离区域形成步骤; 侧壁形成步骤; 扩散层形成步骤; 激活步骤; 硅化物形成步骤; 和去除步骤。 元件隔离区域形成步骤是用于在半导体衬底上形成场氧化膜以形成元件隔离区域的步骤。 为了通过将杂质引入到半导体衬底中形成扩散层,在将元件的氟化物(离子注入物质)注入半导体衬底之后,在比用于激活扩散的热处理的温度低的温度下进行热处理 在激活扩散层之前的层,并且从离子注入物质产生的氟被排出到外部。