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    • 91. 发明授权
    • Method of improving static refresh
    • 改善静态刷新的方法
    • US06482707B1
    • 2002-11-19
    • US09532094
    • 2000-03-21
    • Mark FischerCharles H. DennisonFawad AhmedRichard H. LaneJohn K. ZahurakKunal R. Parekh
    • Mark FischerCharles H. DennisonFawad AhmedRichard H. LaneJohn K. ZahurakKunal R. Parekh
    • H01L21336
    • H01L29/6659H01L21/2652H01L21/28247H01L29/6656
    • A double blanket ion implant method for forming diffusion regions in memory array devices, such as a MOSFET access device is disclosed. The method provides a semiconductor substrate with a gate structure formed on its surface Next, a first pair of diffusion regions are formed in a region adjacent to the channel region by a first blanket ion implantation process. The first blanket ion implantation process has a first energy level and dose. The device is subjected to oxidizing conditions, which form oxidized sidewalls on the gate structure. A second blanket ion implantation process is conducted at the same location as the first ion implantation process adding additional dopant to the diffusion regions. The second blanket ion implantation process has a second energy level and dose. The resultant diffusion regions provide the device with improved static refresh performance over prior art devices. In addition, the first and second energy levels and doses are substantially lower than an energy level and dose used in a prior art single implantation process.
    • 公开了一种用于在诸如MOSFET访问装置的存储器阵列器件中形成扩散区的双层覆盖离子注入方法。 该方法提供了在其表面上形成栅极结构的半导体衬底。接下来,通过第一覆盖离子注入工艺在与沟道区相邻的区域中形成第一对扩散区。 第一次毯式离子注入工艺具有第一能级和剂量。 该器件经受氧化条件,其在栅极结构上形成氧化的侧壁。 在与第一离子注入工艺相同的位置处进行第二覆盖离子注入工艺,向扩散区域添加额外的掺杂剂。 第二次毯子离子注入过程具有第二能量水平和剂量。 所得到的扩散区域提供了比现有技术的装置更好的静态刷新性能的装置。 此外,第一和第二能量水平和剂量基本上低于现有技术单一植入过程中使用的能级和剂量。
    • 93. 发明授权
    • Isolation region forming methods
    • 隔离区形成方法
    • US06406977B2
    • 2002-06-18
    • US09521095
    • 2000-03-07
    • David L. DickersonRichard H. LaneCharles H. DennisonKunal R. ParekhMark FischerJohn K. Zahurak
    • David L. DickersonRichard H. LaneCharles H. DennisonKunal R. ParekhMark FischerJohn K. Zahurak
    • H01L2176
    • H01L21/76232H01L21/0332H01L21/76235
    • In one aspect, the invention includes an isolation region forming method comprising: a) forming an oxide layer over a substrate; b) forming a nitride layer over the oxide layer, the nitride layer and oxide layer having a pattern of openings extending therethrough to expose portions of the underlying substrate; c) etching the exposed portions of the underlying substrate to form openings extending into the substrate; d) after etching the exposed portions of the underlying substrate, removing portions of the nitride layer while leaving some of the nitride layer remaining over the substrate; and e) after removing portions of the nitride layer, forming oxide within the openings in the substrate, the oxide within the openings forming at least portions of isolation regions. In another aspect, the invention includes an isolation region forming method comprising: a) forming a silicon nitride layer over a substrate; b) forming a masking layer over the silicon nitride layer; c) forming a pattern of openings extending through the masking layer to the silicon nitride layer; d) extending the openings through the silicon nitride layer to the underlying substrate, the silicon nitride layer having edge regions proximate the openings and having a central region between the edge regions; e) extending the openings into the underlying substrate; f) after extending the openings into the underlying substrate, reducing a thickness of the silicon nitride layer at the edge regions to thin the edge regions relative to the central region; and g) forming oxide within the openings.
    • 一方面,本发明包括一种隔离区形成方法,包括:a)在衬底上形成氧化物层; b)在所述氧化物层上形成氮化物层,所述氮化物层和氧化物层具有延伸穿过其中的开口图案以暴露所述下面的衬底的部分; c)蚀刻下面的衬底的暴露部分以形成延伸到衬底中的开口; d)在蚀刻下面的衬底的暴露部分之后,去除氮化物层的部分,同时留下一些保留在衬底上的氮化物层; 以及e)在去除所述氮化物层的部分之后,在所述衬底的所述开口内形成氧化物,所述开口内的氧化物形成至少部分隔离区域。 另一方面,本发明包括一种隔离区形成方法,包括:a)在衬底上形成氮化硅层; b)在氮化硅层上形成掩模层; c)形成延伸穿过掩模层的开口图案到氮化硅层; d)将开口穿过氮化硅层延伸到下面的衬底,氮化硅层具有靠近开口的边缘区域,并且在边缘区域之间具有中心区域; e)将开口延伸到下面的基底中; f)在将开口延伸到下面的基底之后,减小边缘区域处的氮化硅层的厚度,以使边缘区域相对于中心区域变薄; 和g)在开口内形成氧化物。
    • 96. 发明授权
    • Efficient pitch multiplication process
    • 高效的音调乘法过程
    • US08012674B2
    • 2011-09-06
    • US12687005
    • 2010-01-13
    • Mark FischerStephen RussellH. Montgomery Manning
    • Mark FischerStephen RussellH. Montgomery Manning
    • G03F7/26
    • H01L29/06H01L21/0338H01L21/3088
    • Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region. The protective material is removed, leaving a pattern of pitch multiplied spacers in the array region and non-pitch multiplied mask elements in the interface and periphery areas. The pattern is transferred to a hard mask layer, through which an underlying substrate is etched.
    • 通过通过掩模处理衬底来形成集成电路的间距倍增和非间距倍数特征,例如集成电路的阵列,接口和外围区域中的特征。 通过图案化光刻胶层来形成掩模,该光致抗蚀剂层同时限定对应于集成电路的阵列,界面和外围区域中的特征的掩模元件。 将图案转移到无定形碳层。 侧壁间隔物形成在图案化无定形碳层的侧壁上。 沉积一层保护材料,然后将其图案化以暴露阵列区域中的掩模元件和界面或外围区域的选定部分。 除去阵列区域或其它暴露部分中的无定形碳,从而在阵列区域中留下包括独立的,间距倍增的间隔物的图案。 去除保护材料,在阵列区域中留下间距倍数间隔物的图案,并在界面和外围区域留下非间距倍增的掩模元件。 将图案转移到硬掩模层,通过该硬掩模层蚀刻下面的基底。
    • 100. 发明授权
    • Efficient pitch multiplication process
    • 高效的音调乘法过程
    • US07666578B2
    • 2010-02-23
    • US11521851
    • 2006-09-14
    • Mark FischerStephen RussellH. Montgomery Manning
    • Mark FischerStephen RussellH. Montgomery Manning
    • G03F7/26G03F7/00
    • H01L29/06H01L21/0338H01L21/3088
    • Pitch multiplied and non-pitch multiplied features of an integrated circuit, e.g., features in the array, interface and periphery areas of the integrated circuit, are formed by processing a substrate through a mask. The mask is formed by patterning a photoresist layer which simultaneously defines mask elements corresponding to features in the array, interface and periphery areas of the integrated circuit. The pattern is transferred to an amorphous carbon layer. Sidewall spacers are formed on the sidewalls of the patterned amorphous carbon layer. A layer of protective material is deposited and then patterned to expose mask elements in the array region and in selected parts of the interface or periphery areas. Amorphous carbon in the array region or other exposed parts is removed, thereby leaving a pattern including free-standing, pitch multiplied spacers in the array region. The protective material is removed, leaving a pattern of pitch multiplied spacers in the array region and non-pitch multiplied mask elements in the interface and periphery areas. The pattern is transferred to a hard mask layer, through which an underlying substrate is etched.
    • 通过通过掩模处理衬底来形成集成电路的间距倍增和非间距倍数特征,例如集成电路的阵列,接口和外围区域中的特征。 通过图案化光刻胶层来形成掩模,该光致抗蚀剂层同时限定对应于集成电路的阵列,界面和外围区域中的特征的掩模元件。 将图案转移到无定形碳层。 侧壁间隔物形成在图案化无定形碳层的侧壁上。 沉积一层保护材料,然后将其图案化以暴露阵列区域中的掩模元件和界面或外围区域的选定部分。 除去阵列区域或其它暴露部分中的无定形碳,从而在阵列区域中留下包括独立的,间距倍增的间隔物的图案。 去除保护材料,在阵列区域中留下间距倍数间隔物的图案,并在界面和外围区域留下非间距倍增的掩模元件。 将图案转移到硬掩模层,通过该硬掩模层蚀刻下面的基底。