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    • 95. 发明授权
    • Semiconductor device and method for driving the same
    • 半导体装置及其驱动方法
    • US08634230B2
    • 2014-01-21
    • US13348950
    • 2012-01-12
    • Hideki Uochi
    • Hideki Uochi
    • G11C11/34
    • H01L27/1156G11C16/0425G11C16/26H01L21/28273H01L27/1225
    • Data is written in the following manner: potentials of first and second control gates of a transistor are set at a potential for making a storage gate of the transistor a conductor, a potential of data to be stored is supplied to the storage gate, and at least one of the potentials of the first and second control gates is set at a potential for making the storage gate an insulator. Data is read in the following manner: the potential of the second control gate is set at a potential for making the storage gate an insulator; a potential is supplied to a wiring connected to one of a source and a drain of the transistor; then, a potential for reading is supplied to the first control gate to detect a change in the potential of a bit line connected to the other of the source and the drain.
    • 数据以如下方式写入:晶体管的第一和第二控制栅极的电位被设置为使晶体管的存储栅极成为导体的电位,将存储的数据的电位提供给存储门,并且在 将第一和第二控制栅极的电位中的至少一个设置为使存储栅极成为绝缘体的可能性。 数据以如下方式读取:第二控制栅极的电位被设定为使存储栅极成为绝缘体的可能性; 电位被提供给连接到晶体管的源极和漏极之一的布线; 然后,向第一控制栅极提供读取电位,以检测连接到源极和漏极中的另一个的位线的电位变化。
    • 100. 发明授权
    • Semiconductor device and process for fabricating the same
    • 半导体器件及其制造方法
    • US6133620A
    • 2000-10-17
    • US222730
    • 1998-12-29
    • Hideki Uochi
    • Hideki Uochi
    • H01L21/28H01L21/336H01L21/768H01L21/77H01L21/84H01L29/786H01L29/04
    • H01L27/1214H01L21/28088H01L21/76838H01L21/76895H01L29/66757H01L29/78621
    • A semiconductor device comprising a thin film transistor, and a process for fabricating the same, the process comprising: a first step of forming an island-like semiconductor layer, a gate insulating film covering the semiconductor layer, and a gate electrode comprising a material containing aluminum as the principal component formed on the gate insulating film; a second step of introducing impurities into the semiconductor layer in a self-aligned manner by using the gate electrode as the mask; a third step of forming an interlayer dielectric to cover the gate electrode, and forming a contact hole in at least one of source and drain; a fourth step of forming over the entire surface, a film containing aluminum as the principal component, and then forming an anodic oxide film by anodically oxidizing the film containing aluminum as the principal component; a fifth step of etching the film containing aluminum as the principal component and the anodic oxide film, thereby forming a second layer interconnection containing aluminum as the principal component; and a sixth step of forming over the second layer interconnection, a film containing silicon nitride as the principal component thereof.
    • 一种包括薄膜晶体管的半导体器件及其制造方法,该方法包括:形成岛状半导体层的第一步骤,覆盖该半导体层的栅极绝缘膜和包含含有 铝作为主要成分形成在栅极绝缘膜上; 通过使用栅电极作为掩模,以自对准的方式将杂质引入半导体层的第二步骤; 形成覆盖栅电极的层间电介质,在源极和漏极中的至少一个中形成接触孔的第三步骤; 在整个表面上形成第四步,以铝为主要成分的膜,然后通过阳极氧化含铝的膜作为主要成分形成阳极氧化膜; 蚀刻含有铝作为主要成分的膜和阳极氧化膜的第五步骤,从而形成以铝为主要成分的第二层互连; 以及在第二层互连上形成第六步骤,包含以氮化硅为主要成分的膜。