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    • 91. 发明授权
    • Integrated flash memory systems and methods for load compensation
    • 集成闪存系统和负载补偿方法
    • US08154928B2
    • 2012-04-10
    • US12947719
    • 2010-11-16
    • Hieu Van Tran
    • Hieu Van Tran
    • G11C16/06
    • G11C16/26
    • Systems and methods are disclosed including features that compensate for variations in the magnitude of supply voltages used in memory arrays. According to some aspects, compensation circuits may provide a tunable current-limiting load for data columns, where the load can be tuned to dynamically compensate for variations in supply voltage. In certain aspects, a compensation circuit may employ an operational amplifier configured as a voltage follower. The voltage follower compensates for any variations in supply voltage, forcing a constant voltage drop across the load element(s), thus maintaining a constant load. Other circuits may also be included, such as precharge circuits, clamp circuits, buffer circuits, trimming circuit, and sense amplifier circuits with sensed body effect. System-On-Chip integrated system aspects may include a microcontroller, a mixed IP, and a flash memory system having functionality and blocks that interface and interoperate with each other for load compensation.
    • 公开了系统和方法,其包括补偿存储器阵列中使用的电源电压的幅度变化的特征。 根据一些方面,补偿电路可以为数据列提供可调谐的限流负载,其中可以调整负载来动态补偿电源电压的变化。 在某些方面,补偿电路可以采用配置为电压跟随器的运算放大器。 电压跟随器补偿电源电压的任何变化,迫使负载元件上的恒定电压降,从而保持恒定的负载。 还可以包括其他电路,例如预充电电路,钳位电路,缓冲电路,微调电路,以及感测体效应的读出放大器电路。 片上系统集成系统方面可以包括微控制器,混合IP和闪存系统,其具有彼此接口和互操作以进行负载补偿的功能和块。
    • 94. 发明申请
    • Integrated Flash Memory Systems And Methods For Load Compensation
    • 集成闪存系统和负载补偿方法
    • US20110058425A1
    • 2011-03-10
    • US12947719
    • 2010-11-16
    • Hieu Van Tran
    • Hieu Van Tran
    • G11C16/06G11C16/04
    • G11C16/26
    • Systems and methods are disclosed including features that compensate for variations in the magnitude of supply voltages used in memory arrays. According to some aspects, compensation circuits may provide a tunable current-limiting load for data columns, where the load can be tuned to dynamically compensate for variations in supply voltage. In certain aspects, a compensation circuit may employ an operational amplifier configured as a voltage follower. The voltage follower compensates for any variations in supply voltage, forcing a constant voltage drop across the load element(s), thus maintaining a constant load. Other circuits may also be included, such as precharge circuits, clamp circuits, buffer circuits, trimming circuit, and sense amplifier circuits with sensed body effect. System-On-Chip integrated system aspects may include a microcontroller, a mixed IP, and a flash memory system having functionality and blocks that interface and interoperate with each other for load compensation.
    • 公开了系统和方法,其包括补偿存储器阵列中使用的电源电压的幅度变化的特征。 根据一些方面,补偿电路可以为数据列提供可调谐的限流负载,其中可以调整负载来动态补偿电源电压的变化。 在某些方面,补偿电路可以采用配置为电压跟随器的运算放大器。 电压跟随器补偿电源电压的任何变化,迫使负载元件上的恒定电压降,从而保持恒定的负载。 还可以包括其他电路,例如预充电电路,钳位电路,缓冲电路,微调电路,以及感测体效应的读出放大器电路。 片上系统集成系统方面可以包括微控制器,混合IP和闪存系统,其具有彼此接口和互操作以进行负载补偿的功能和块。
    • 96. 发明授权
    • Method and apparatus for testing the connectivity of a flash memory chip
    • 用于测试闪存芯片连接性的方法和装置
    • US07631231B2
    • 2009-12-08
    • US11407602
    • 2006-04-19
    • Sang Thanh NguyenHieu Van TranHung O. NguyenPhil Klotzkin
    • Sang Thanh NguyenHieu Van TranHung O. NguyenPhil Klotzkin
    • G11C29/00G01R31/28G11C7/00
    • G11C29/02G11C29/022G11C2029/3202
    • In one embodiment of the invention, circuitry and hardware for connectivity testing are fabricated on an IC, and in particular an IC containing a flash memory array. This testing circuitry is electrically connected to the bond pads of the IC. In some embodiments, the testing circuitry includes a boundary scan cell connected to each bond pad, allowing for rapid connectivity testing of flash memory chips in accordance with testing standards such as the JTAG standard. The invention further includes methods in which the pins and/or memory cells of a flash memory chip are sequentially sent a series of data so as to test the connectivity of portions of the IC. The sequentially-sent data is then retrieved and compared to the original data. Discrepancies between these sets of data thus highlight connectivity problems in the IC.
    • 在本发明的一个实施例中,用于连接测试的电路和硬件被制造在IC上,特别是包含闪存阵列的IC。 该测试电路电连接到IC的接合焊盘。 在一些实施例中,测试电路包括连接到每个接合焊盘的边界扫描单元,允许根据诸如JTAG标准的测试标准对闪存芯片进行快速连接测试。 本发明还包括其中闪存芯片的引脚和/或存储单元被顺序地发送一系列数据以便测试IC的部分连通性的方法。 然后检索顺序发送的数据并将其与原始数据进行比较。 因此,这些数据集之间的差异突出了IC中的连接问题。
    • 97. 发明申请
    • Integrated Semiconductor Metal-Insulator-Semiconductor Capacitor
    • 集成半导体金属绝缘体 - 半导体电容器
    • US20090096507A1
    • 2009-04-16
    • US12270604
    • 2008-11-13
    • Feng GaoChangyuan ChenVishal SarinWilliam John SaikiHieu Van TranDana Lee
    • Feng GaoChangyuan ChenVishal SarinWilliam John SaikiHieu Van TranDana Lee
    • H03K3/01
    • H01L27/0805H01L27/0811H01L29/94
    • An integrated MIS capacitor has two substantially identical MIS capacitors. A first capacitor comprises a first region of a first conductivity type adjacent to a channel region of the first conductivity type in a semiconductor substrate. The semiconductor substrate has a second conductivity type. A gate electrode is insulated and spaced apart from the channel region of the first capacitor. The second capacitor is substantially identical to the first capacitor and is formed in the same semiconductor substrate. The gate electrode of the first capacitor is electrically connected to the first region of the second capacitor and the gate electrode of the second capacitor is electrically connected to the first region of the first capacitor. In this manner, the capacitors are connected in an anti-parallel configuration. A capacitor which has high capacitance densities, low process complexity, ambipolar operation, low voltage and temperature coefficient, low external parasitic resistance and capacitance and good matching characteristics for use in analog designs that can be integrated with existing semiconductor processes results.
    • 集成的MIS电容器具有两个基本相同的MIS电容器。 第一电容器包括在半导体衬底中与第一导电类型的沟道区相邻的第一导电类型的第一区域。 半导体衬底具有第二导电类型。 栅电极与第一电容器的沟道区隔离并隔开。 第二电容器基本上与第一电容器相同,并且形成在相同的半导体衬底中。 第一电容器的栅电极电连接到第二电容器的第一区域,并且第二电容器的栅极电连接到第一电容器的第一区域。 以这种方式,电容器以反并联配置连接。 具有高电容密度,低工艺复杂性,双极性操作,低电压和温度系数,低外部寄生电阻和电容以及用于可与现有半导体工艺结合的模拟设计的良好匹配特性的电容器。