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91. 发明申请

US20050227483A1 Planar metal electroprocessing 有权
标题翻译：平面金属电加工
公开(公告)号：US20050227483A1
公开(公告)日：2005-10-13
申请号：US10996164
申请日：2004-11-22
申请人： Bulent Basol , Homayoun Talieh , Syprian Uzoh
发明人： Bulent Basol , Homayoun Talieh , Syprian Uzoh
IPC分类号： B23H5/08 , C25D5/02 , C25D5/06 , C25D5/10 , C25D5/18 , C25D5/22 , C25D5/48 , C25D7/12 , H01L21/288 , H01L21/3205 , H01L21/321 , H01L21/768 , H01L21/44
CPC分类号： B23H5/08 , C25D5/02 , C25D5/10 , C25D5/18 , C25D5/22 , C25D7/123 , H01L21/2885 , H01L21/32125 , H01L21/7684 , H01L21/76877
摘要： The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to form a near-planar or planar copper layer on a semiconductor substrate that has features or cavities on its surface.
摘要翻译：本发明涉及使用ECMPR技术在工件表面上形成诸如铜的导电材料的近平面或平面层的方法。该方法优选使用至少两个单独的电镀溶液化学物质，以在其表面上具有特征或空腔的半导体衬底上形成近平面或平面的铜层。

92. 发明授权

US06953392B2 Integrated system for processing semiconductor wafers 有权
标题翻译：用于处理半导体晶圆的集成系统
公开(公告)号：US06953392B2
公开(公告)日：2005-10-11
申请号：US09795687
申请日：2001-02-27
申请人： Jalal Ashjaee , Homayoun Talieh
发明人： Jalal Ashjaee , Homayoun Talieh
IPC分类号： C25F7/00 , H01L21/00 , H01L21/02 , H01L21/304 , H01L21/687 , B24B7/22
CPC分类号： H01L21/67173 , H01L21/67207 , H01L21/67219 , H01L21/6723
摘要： An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system also has a wafer handling subsystem for transporting each of the wafers into or out of the appropriate one of the plurality of processing subsystems. The plurality of processing subsystems and wafer handling subsystem form an integrated system.
摘要翻译：提供了一种用于处理具有导电前表面的多个晶片的集成系统。该系统包括用于从晶片的前表面沉积或从金属表面去除金属的多个处理子系统。每个处理子系统包括处理室和清洁室。该系统还具有晶片处理子系统，用于将每个晶片传送到多个处理子系统中的适当的一个处理子系统中或从其中移出。多个处理子系统和晶片处理子系统形成集成系统。

93. 发明申请

US20050173260A1 System for electrochemical mechanical polishing 审中-公开
标题翻译：电化学机械抛光系统
公开(公告)号：US20050173260A1
公开(公告)日：2005-08-11
申请号：US11069202
申请日：2005-02-28
申请人： Bulent Basol , Homayoun Talieh
发明人： Bulent Basol , Homayoun Talieh
IPC分类号： H01L21/321 , B23H5/00
CPC分类号： H01L21/32115
摘要： A system for electrochemical mechanical polishing of a semiconductor wafer. The system includes a wafer carrier for holding the wafer, an electropolishing pad, and a showerhead for applying fluid towards the electrode. The electropolishing pad includes an electrode and a pad material layer attached to the electrode. The pad material layer includes openings to permit processing solution to wet both a conductive surface of the wafer and a surface of the electrode.
摘要翻译：一种用于半导体晶片的电化学机械抛光的系统。该系统包括用于保持晶片的晶片载体，电抛光垫和用于向该电极施加流体的喷头。电抛光垫包括附着在电极上的电极和焊盘材料层。衬垫材料层包括允许处理溶液润湿晶片的导电表面和电极表面的开口。

94. 发明授权

US06884334B2 Vertically configured chamber used for multiple processes 有权
标题翻译：垂直配置的腔室用于多个过程
公开(公告)号：US06884334B2
公开(公告)日：2005-04-26
申请号：US10041058
申请日：2001-12-28
申请人： Konstantin Volodarsky , Boguslaw A. Nigorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nigorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D7/12 , H01L21/00 , H01L21/02 , H01L21/3063 , C25D5/00
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
摘要翻译：本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。然后可以使用相同的容纳室来冲洗和清洁相同的晶片。结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

95. 发明申请

US20050040049A1 Anode assembly for plating and planarizing a conductive layer 审中-公开
标题翻译：用于电镀和平坦化导电层的阳极组件
公开(公告)号：US20050040049A1
公开(公告)日：2005-02-24
申请号：US10914490
申请日：2004-08-10
申请人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas Young
发明人： Rimma Volodarsky , Konstantin Volodarsky , Cyprian Uzoh , Homayoun Talieh , Douglas Young
IPC分类号： B23H7/00 , C25D5/08 , C25D7/12 , C25D17/10 , H01L21/288 , H01L21/768
CPC分类号： C25D17/001 , C25D5/08 , C25D17/008 , C25D17/10 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.
摘要翻译：可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。还提供了可以将溶液输送到所述阳极腔的溶液输送结构。溶液输送结构可以包含在进行操作的室内。护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

96. 发明申请

US20050034994A1 Method and apparatus for full surface electrotreating of a wafer 有权
公开(公告)号：US20050034994A1
公开(公告)日：2005-02-17
申请号：US10947628
申请日：2004-09-21
申请人： Jalal Ashjaee , Boguslaw Nagorski , Bulent Basol , Homayoun Talieh , Cyprian Uzoh
发明人： Jalal Ashjaee , Boguslaw Nagorski , Bulent Basol , Homayoun Talieh , Cyprian Uzoh
IPC分类号： C25D7/12 , C25F7/00 , C25D5/00 , B23H3/00
CPC分类号： C25F7/00 , C25D7/123 , C25D17/001 , H01L21/2885
摘要： Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

97. 发明申请

US20050016868A1 ELECTROCHEMICAL MECHANICAL PLANARIZATION PROCESS AND APPARATUS 有权
标题翻译：电化学机械平面化方法及装置
公开(公告)号：US20050016868A1
公开(公告)日：2005-01-27
申请号：US10830894
申请日：2004-04-23
申请人： Bulent Basol , Homayoun Talieh
发明人： Bulent Basol , Homayoun Talieh
IPC分类号： B23H3/00 , B23H5/08 , B24B21/04 , B24B21/22 , B24B37/04 , B24B47/04 , C25D5/02 , C25D5/06 , C25D5/22 , C25D7/12 , C25F7/00 , H01L21/288 , H01L21/321 , H01L21/768
CPC分类号： C25F7/00 , B23H5/08 , B24B21/04 , B24B21/22 , B24B37/04 , B24B37/205 , B24B47/04 , C25D5/02 , C25D5/06 , C25D5/22 , C25D7/123 , H01L21/2885 , H01L21/3212 , H01L21/76877
摘要： Abstract of the DisclosureA system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential difference between conductive surface and an electrode and establishing relative motion between the belt pad and the conductive surface result in material removal from the conductive surface. Electrical contact to the surface is provided through either contacts embedded in the belt pad or contacts placed adjacent the belt pad.
摘要翻译：发明内容提供了晶片的导电表面的电化学机械抛光系统。该系统包括用于保持晶片的晶片保持器和靠近晶片设置的用于抛光导电表面的带垫。施加导电表面和电极之间的电位差并且在皮带垫和导电表面之间建立相对运动导致从导电表面去除材料。通过嵌入在皮带垫中的触点或邻近皮带垫的触点提供与表面的电接触。

98. 发明授权

US06413388B1 Pad designs and structures for a versatile materials processing apparatus 失效
标题翻译：垫片设计和结构，用于多功能材料加工设备
公开(公告)号：US06413388B1
公开(公告)日：2002-07-02
申请号：US09511278
申请日：2000-02-23
申请人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
发明人： Cyprian Uzoh , Bulent Basol , Homayoun Talieh
IPC分类号： C25D1700
CPC分类号： B24B37/26 , B23H5/08 , C25D17/001 , C25D17/14
摘要： An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each forming a passage from the top surface to the bottom surface, and each allowing the electrolyte and electric field flow therethrough. A pad is attached to the rigid member via a fastener. The pad also allows for electrolyte and electric field flow therethrough to the substrate.
摘要翻译：提供一种能够辅助控制用于处理基板的电解质流动和电场分布的装置。它包括具有预定形状的顶表面和底表面的刚性构件。刚性构件包括多个通道，每个通道形成从顶表面到底表面的通道，并且每个通道允许电解质和电场流过其中。垫通过紧固件附接到刚性构件。衬垫还允许电解质和电场流过衬底。

99. 发明授权

US6103628A Reverse linear polisher with loadable housing 有权
标题翻译：带可装载外壳的反向线性抛光机
公开(公告)号：US6103628A
公开(公告)日：2000-08-15
申请号：US201928
申请日：1998-12-01
申请人： Homayoun Talieh
发明人： Homayoun Talieh
IPC分类号： B24B21/04 , B24B37/04 , B24B47/04 , H01L21/304 , H01L21/00
CPC分类号： B24B21/04 , B24B37/04 , B24B47/04
摘要： The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad as the pad moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having a novel wafer loading and unloading method.
摘要翻译：本发明涉及一种使用可沿正向和反向两者可移动的衬垫抛光半导体晶片的表面的方法和装置。在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。抛光垫的正向和反向运动为晶片的表面提供了优异的平面性和均匀性。当衬垫沿着正向和反向移动同时抛光晶片表面时，晶片表面被压靠在抛光垫上。在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

100. 发明申请

US20070004316A1 Integrated system for processing semiconductor wafers 审中-公开
标题翻译：用于处理半导体晶圆的集成系统
公开(公告)号：US20070004316A1
公开(公告)日：2007-01-04
申请号：US11452609
申请日：2006-06-13
申请人： Jalal Ashjaee , Boris Govzman , Bernard Frey , Boguslaw Nagorski , Douglas Young , Bulent Basol , Homayoun Talieh
发明人： Jalal Ashjaee , Boris Govzman , Bernard Frey , Boguslaw Nagorski , Douglas Young , Bulent Basol , Homayoun Talieh
IPC分类号： B24B51/00 , B24B7/00
CPC分类号： H01L21/67745 , B24B37/345 , G05B19/41865 , G05B2219/32272 , G05B2219/45031 , H01L21/67028 , H01L21/67034 , H01L21/67046 , H01L21/67051 , H01L21/67173 , H01L21/67219 , H01L21/68707 , H01L21/68728 , Y02P90/20
摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.
摘要翻译：提供了用于化学机械加工，清洁和干燥半导体工件的集成工艺工具。集成工艺工具包括CMP模块和清洁和干燥模块。在处理之后，使用可动壳体将工件从CMP模块传送到清洁和干燥模块。在清洁和干燥模块中，使用清洁机构来清洁工件，同时工件被可移动壳体的支撑结构旋转并保持。清洁和干燥模块的干燥机构从可移动的壳体上拾取工件并使其干燥。在整个CMP过程中，清洁和干燥，晶片的经处理表面面朝下。

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