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91. 发明授权

US5864946A Method of making contact tip structures 失效
标题翻译：制造接触尖端结构的方法
公开(公告)号：US5864946A
公开(公告)日：1999-02-02
申请号：US839758
申请日：1997-04-15
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： B23K1/00 , B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H01R12/00 , H05K1/14 , H05K3/20 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , H01R9/00
CPC分类号： H05K7/1069 , B23K1/0008 , B23K20/004 , C23C18/1605 , C23C18/165 , C25D7/12 , G01R1/07342 , G01R31/2884 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6835 , H01L22/20 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/27 , H01L24/72 , H01L24/81 , H01L24/94 , H01L25/0652 , H01L25/16 , H05K3/308 , H05K3/326 , H05K3/3426 , H05K3/4015 , B23K2201/40 , C25D21/02 , C25D5/08 , C25D5/22 , G01R31/2856 , G01R31/2863 , G01R31/2886 , H01L2223/54453 , H01L2224/02311 , H01L2224/03912 , H01L2224/0401 , H01L2224/04042 , H01L2224/0558 , H01L2224/05599 , H01L2224/05624 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1147 , H01L2224/1184 , H01L2224/13022 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4556 , H01L2224/45572 , H01L2224/45599 , H01L2224/48624 , H01L2224/48644 , H01L2224/48724 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/83851 , H01L2224/85201 , H01L2224/85205 , H01L2224/90 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L23/544 , H01L24/45 , H01L24/49 , H01L24/83 , H01L24/90 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/20104 , H01L2924/20105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H05K3/20 , H05K3/3421 , H05K3/368 , H05K3/4092 , Y02P70/611 , Y02P70/613 , Y10S977/712 , Y10S977/723 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , Y10T29/49171 , Y10T29/49204 , Y10T29/49208 , Y10T29/4922 , Y10T29/49812 , Y10T428/12396 , Y10T428/12528
摘要： Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.
摘要翻译：弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

92. 发明授权

US5601740A Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires 失效
标题翻译：用于引线接合的方法和装置，用于切断接合线，以及在接合线的端部上形成球
公开(公告)号：US5601740A
公开(公告)日：1997-02-11
申请号：US573945
申请日：1995-12-18
申请人： Benjamin N. Eldridge , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gaetan L. Mathieu
IPC分类号： B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/30 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40 , H05K7/10 , B23K9/06
CPC分类号： B23K20/004 , C25D7/12 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H05K3/24 , H05K3/308 , H05K3/326 , H05K3/3426 , H05K3/4015 , H05K7/1069 , B23K2201/40 , C25D21/02 , C25D5/08 , C25D5/22 , G01R3/00 , G01R31/2884 , H01L2224/1134 , H01L2224/13144 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/45565 , H01L2224/456 , H01L2224/4569 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85043 , H01L2224/851 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L24/45 , H01L24/49 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/19041 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H05K3/20 , H05K3/3421 , H05K3/368 , H05K3/4092 , Y02P70/611 , Y02P70/613
摘要： The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between an EFO electrode and the wire, one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.
摘要翻译：通过在紫外光的存在下进行放电，提高了在接合线（包括已被替代机构切断的接合线）的端部切断接合线和/或形成球的放电功效。在EFO电极和导线之间形成“火花隙”，其中一个用作火花隙的阴极。优选地，紫外线指向用作火花隙的阴极的元件。在火花间隙的阴极元件处提供光电发射使电弧/等离子体形成稳定，并产生更可靠和可预测的结果。这种技术可以与负EFO系统或正EFO系统结合使用，并可从直接或场辅助光电发射中受益。

93. 发明授权

US08427183B2 Probe card assembly having an actuator for bending the probe substrate 有权
标题翻译：探针卡组件具有用于弯曲探针基板的致动器
公开(公告)号：US08427183B2
公开(公告)日：2013-04-23
申请号：US13092709
申请日：2011-04-22
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
IPC分类号： G01R31/00
CPC分类号： G01R1/07307 , G01R3/00
摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.
摘要翻译：用于探针卡组件的平面化器。平面化器包括从探针卡组件中的衬底延伸的第一控制构件。第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

94. 发明授权

US08373428B2 Probe card assembly and kit, and methods of making same 失效
标题翻译：探针卡组装和试剂盒，以及制作方法
公开(公告)号：US08373428B2
公开(公告)日：2013-02-12
申请号：US12535070
申请日：2009-08-04
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： G01R31/00
CPC分类号： B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49155 , Y10T29/49222 , H01L2924/00
摘要： A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.
摘要翻译：探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器空间变压器和探针卡之间。空间变换器和插入器被堆叠，使得可以调节空间变换器的取向，从而可以调节探针元件的尖端的取向而不改变探针卡的取向。公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

95. 发明授权

US08033838B2 Microelectronic contact structure 有权
标题翻译：微电子接触结构
公开(公告)号：US08033838B2
公开(公告)日：2011-10-11
申请号：US12577444
申请日：2009-10-12
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H05K1/00
CPC分类号： G01R1/06727 , G01R1/06738 , H01L21/6835 , H01L2221/68359 , H01L2224/11003 , H01L2224/111 , H01L2224/11826 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13565 , H01L2224/13582 , H01L2224/819 , H01L2924/01019 , H01L2924/01074 , H01L2924/01078 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

96. 发明申请

US20100323551A1 SHARPENED, ORIENTED CONTACT TIP STRUCTURES 有权
标题翻译：锐化，面向联系提示结构
公开(公告)号：US20100323551A1
公开(公告)日：2010-12-23
申请号：US12852337
申请日：2010-08-06
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Alex Madsen , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Alex Madsen , Gaetan L. Mathieu
IPC分类号： H01R11/20
CPC分类号： H01R13/2407 , G01R1/06711 , G01R1/06727 , H01R4/26 , H01R9/091 , H01R12/57 , H01R13/2442 , H01R2201/20 , Y10T29/49004 , Y10T29/49128 , Y10T29/49165
摘要： An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.
摘要翻译：描述了提供改进的互连元件和尖端结构以实现电子部件的端子之间的压力连接的装置和方法。本发明的尖端结构具有尖端结构的上表面上定向的锋利的叶片，使得叶片的长度基本上平行于尖端结构的水平移动方向，因为尖端结构偏转穿过端部电子元件以这种方式，锋利的基本上平行的定向叶片切片通过终端表面上的任何非导电层清洁，并且在互连元件和电气部件的端子之间提供可靠的电连接。

97. 发明授权

US07845072B2 Method and apparatus for adjusting a multi-substrate probe structure 失效
标题翻译：用于调整多基板探针结构的方法和装置
公开(公告)号：US07845072B2
公开(公告)日：2010-12-07
申请号：US12343260
申请日：2008-12-23
申请人： Eric D. Hobbs , Benjamin N. Eldridge , Lunyu Ma , Gaetan L. Mathieu , Steven T. Murphy , Makarand S. Shinde , Alexander H. Slocum
发明人： Eric D. Hobbs , Benjamin N. Eldridge , Lunyu Ma , Gaetan L. Mathieu , Steven T. Murphy , Makarand S. Shinde , Alexander H. Slocum
IPC分类号： H05K3/30
CPC分类号： G01R31/2886 , G01R1/073 , G01R31/31905 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49147 , Y10T29/49208 , Y10T29/49222
摘要： A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.
摘要翻译：探针卡组件包括附接到安装组件的多个探针基板。每个探针衬底包括一组探针，并且每个探针衬底上的探针组合在一起组成一组探针，用于接触待测试的器件。调整机构构造成赋予每个探针基板以相对于安装组件分别移动每个基板的力。调节机构可以将每个探针基板转换成“x”，“y”和/或“z”方向，并且可以进一步围绕前述方向上的任何一个或多个旋转每个探针基板。调节机构可以进一步改变一个或多个探针基板的形状。因此，探针可以相对于要测试的装置上的触点对准和/或平坦化。

98. 发明授权

US07841863B2 Spring interconnect structures 有权
标题翻译：弹簧互连结构
公开(公告)号：US07841863B2
公开(公告)日：2010-11-30
申请号：US12495405
申请日：2009-06-30
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube , Richard A. Larder
IPC分类号： H01R12/00
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06761 , H01L2924/0002 , H01L2924/01005 , H01L2924/14 , H05K3/326 , H05K3/4092 , H01L2924/00
摘要： An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
摘要翻译：包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。在一个方面，互连具有适于直接接触半导体器件的尺寸。可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

99. 发明申请

US20100263432A1 METHODS FOR PLANARIZING A SEMICONDUCTOR CONTACTOR 审中-公开
标题翻译：用于平面化半导体接触器的方法
公开(公告)号：US20100263432A1
公开(公告)日：2010-10-21
申请号：US12766101
申请日：2010-04-23
申请人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
发明人： Gaetan L. Mathieu , Benjamin N. Eldridge , Gary W. Grube
IPC分类号： B21D31/00
CPC分类号： G01R1/07307 , G01R3/00
摘要： A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.
摘要翻译：用于探针卡组件的平面化器。平面化器包括从探针卡组件中的衬底延伸的第一控制构件。第一控制构件延伸穿过探针卡组件中的至少一个衬底，并且可从探针卡组件中的外部衬底的暴露侧进入。驱动第一控制构件导致连接到第一控制构件的衬底的偏转。

100. 发明授权

US07798822B2 Microelectronic contact structures 失效
标题翻译：微电子接触结构
公开(公告)号：US07798822B2
公开(公告)日：2010-09-21
申请号：US12511057
申请日：2009-07-28
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R12/00
CPC分类号： G01R1/07314 , H01H1/0036 , H01L2224/02335 , H01L2924/00013 , Y10T29/49147 , Y10T29/49204 , Y10T29/49218 , Y10T29/49316 , H01L2224/13099
摘要： Microelectronic contact structures are fabricated by separately forming, then joining together, various components thereof. Each contact structure has three components: a “post” component, a “beam” component, and a “tip” component. The resulting contact structure, mounted to an electronic component, is useful for making an electrical connection with another electronic component. The post component can be fabricated on a sacrificial substrate, joined to the electronic component and its sacrificial substrate removed. Alternatively, the post component can be formed on the electronic component. The beam and tip components can each be fabricated on a sacrificial substrate. The beam component is joined to the post component and its sacrificial substrate is removed, and the tip component is joined to the beam component and its sacrificial substrate is removed.
摘要翻译：微电子接触结构通过分别形成，然后连接在一起而制成其各种部件。每个接触结构具有三个部件：“后”部件，“梁”部件和“尖端”部件。安装到电子部件上的所得接触结构对于与另一个电子部件进行电连接是有用的。后部组件可以制造在牺牲基板上，连接到电子部件并且去除其牺牲基板。或者，可以在电子部件上形成柱部件。梁和尖端部件可以分别制造在牺牲衬底上。梁组件连接到柱部件，并且其牺牲基板被移除，并且尖端部件接合到梁部件并且其牺牲基板被移除。

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