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    • 93. 发明授权
    • Dual microstructure thermal barrier coating
    • 双组分热障涂层
    • US06716539B2
    • 2004-04-06
    • US09962734
    • 2001-09-24
    • Ramesh Subramanian
    • Ramesh Subramanian
    • B21D3900
    • C23C28/3215C23C4/02C23C4/18C23C28/3455C23C28/36Y10T428/12535Y10T428/12542Y10T428/12549Y10T428/12611Y10T428/24182Y10T428/24355Y10T428/24413
    • A multi-layer thermal barrier coating (12) having a porous first layer of ceramic insulating material (20) and a second relatively dense layer of ceramic insulating material (22) having a plurality generally vertical gaps (26) formed therein. The porous conventional as-deposited APS microstructure of the first layer provides thermal and chemical protection for the substrate, while the gaps of the columnar-grained second layer provide thermal shock resistance for the coating. An air plasma spray process may be used to deposit both the first and the second layers of material, as well as any underlying bond coat layer. The gaps of the columnar-grained second layer do not extend into the first layer. The pores (28) of the first layer function as crack-arrestors for cracks initiating at the gaps of the second layer.
    • 具有陶瓷绝缘材料多孔第一层(20)的多层热障涂层(12)和形成有多个大致垂直间隙(26)的第二相对密集的陶瓷绝缘材料层(22)。 第一层的多孔常规沉积的APS微观结构为基底提供热和化学保护,而柱状晶粒第二层的间隙为涂层提供耐热冲击性。 空气等离子体喷涂方法可以用于沉积第一层和第二层材料以及任何下面的粘结涂层。 柱状晶粒第二层的间隙不延伸到第一层。 第一层的孔(28)用作在第二层的间隙处起始裂纹的防裂器。