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91. 发明授权

US10642309B2 Laptop computer 有权
公开(公告)号：US10642309B2
公开(公告)日：2020-05-05
申请号：US16385326
申请日：2019-04-16
申请人： Acer Incorporated
发明人： Yan-Fong Cheng , Cheng-Nan Ling , Yi-Ta Huang , Pao-Min Huang
IPC分类号： G06F1/16 , G06F1/20 , E05D7/00 , E05D11/00
CPC分类号： G06F1/1616 , E05D7/00 , E05D11/00 , G06F1/166 , G06F1/203 , E05Y2900/606
摘要： A laptop computer includes a host, a hinge mechanism, and a display. The host includes a housing having a bottom surface, a raising mechanism disposed in the housing, and a pad connected to the raising mechanism, and adjacent to the bottom surface. The hinge mechanism is connected to the host and includes a first shaft connected to the raising mechanism. The display is affixed to the rotation element. When the display is rotated about the host, the first shaft drives the raising mechanism to change the distance between the top of the pad and the bottom surface.

92. 发明申请

US20180356862A1 HOUSING STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20180356862A1
公开(公告)日：2018-12-13
申请号：US16003063
申请日：2018-06-07
申请人： Acer Incorporated
发明人： Chi-Hung Lai , Cheng-Nan Ling , Kai-Teng Cheng , Pin-Chueh Lin , Wu-Chen Lee , Yung-Hui Hou
IPC分类号： G06F1/16 , B29C43/02 , B29C45/14
CPC分类号： G06F1/1656 , B29C43/02 , B29C45/14467 , B29L2031/712
摘要： A housing structure including a first part, a second part, and a film is provided. The second part is combined to the first part by injection molding, and a seam exists between the first part and the second part. The film is attached onto the first part and the second part to shield the seam. A manufacturing method of the housing structure is also provided.

93. 发明申请

US20180279494A1 HOUSING STRUCTURE OF ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20180279494A1
公开(公告)日：2018-09-27
申请号：US15695015
申请日：2017-09-05
申请人： Acer Incorporated
发明人： Yi-Mu Chang , Ching-Piao Kuan , Wen-Chieh Tai , Cheng-Nan Ling
IPC分类号： H05K5/02 , B29C45/14 , G06F1/16
CPC分类号： H05K5/0243 , B29C45/1418 , B29C63/04 , B29C63/30 , B29C2045/14237 , B29L2031/3481 , G06F1/1626 , G06F1/1656 , H04M1/0202 , H04M1/0283
摘要： A housing structure of an electronic device including a transparent housing and an opaque film is provided. The transparent housing has an inner surface and an outer surface opposite to each other, and the transparent housing has at least one opening connecting the inner and the outer surfaces. The opaque film is attached to the inner surface by vacuuming and discharging air out of the opaque film and the transparent housing through the opening. The opaque film is visually exposed via the transparent housing. A manufacturing method of the housing structure is also provided.

94. 发明申请

US20160266616A1 ELECTRONIC ASSEMBLY 有权
标题翻译：电子总成
公开(公告)号：US20160266616A1
公开(公告)日：2016-09-15
申请号：US14798476
申请日：2015-07-14
申请人： Acer Incorporated
发明人： Yi-Mu Chang , Yan-Lin Kuo , Cheng-Nan Ling , Chun-I Chen , Hsien-Wei Chen , Yu-Shih Wang , Chen-Chih Hou
IPC分类号： G06F1/16
CPC分类号： G06F1/1683 , G06F1/1632 , G06F1/1654
摘要： An electronic assembly including a first body having at least one recess, a first electronic module disposed within the first body, at least one first terminal set disposed within the recess and electrically connected to the first electronic module, a second body having at least one protruding portion, a second electronic module disposed within the second body and at least one second terminal set disposed in the protruding portion, partially exposed by the surface of the protruding portion and electrically connected to the second electronic module. The first and the second bodies are assembled to each other by the protruding portion inserting into the recess, and the first terminal set contacts the second terminal set, such that the first and the second electronic modules are electrically connected to each other through the first and the second terminal sets.
摘要翻译：一种电子组件，包括具有至少一个凹部的第一主体，设置在所述第一主体内的第一电子模块，设置在所述凹部内并电连接到所述第一电子模块的至少一个第一端子组，具有至少一个突出部设置在所述第二主体内的第二电子模块和设置在所述突出部分中的至少一个第二端子组，所述至少一个第二端子组由所述突出部分的表面部分地暴露并电连接到所述第二电子模块。第一和第二主体通过插入凹部中的突出部彼此组装，并且第一端子组接触第二端子组，使得第一和第二电子模块通过第一和第二端子组彼此电连接，第二台终端机。

95. 发明申请

US20150077914A1 ELECTRONIC PERIPHERAL AND ELECTRONIC DEVICE 审中-公开
标题翻译：电子外围和电子设备
公开(公告)号：US20150077914A1
公开(公告)日：2015-03-19
申请号：US14164275
申请日：2014-01-27
申请人： Acer Incorporated
发明人： Yi-Ta Huang , Cheng-Nan Ling , Wen-Chieh Tai , Yu-Shih Wang
IPC分类号： G06F1/16
CPC分类号： G06F1/1684 , G06F1/1632 , G06F1/1656
摘要： An electronic device adapted to be electrically connected to an electronic peripheral is provided. The electronic peripheral includes a main body and a plurality of peripheral pads. The peripheral pads are disposed on a corresponding surface of the main body. The electronic device includes a body and a plurality of device pads. The body includes a receiving surface. The device pads are disposed on the receiving surface. When the corresponding surface is disposed on the receiving surface and each of the peripheral pads is in contact with the corresponding device pad, the main body is electrically connected with the body.
摘要翻译：提供了一种适于电连接到电子外围设备的电子设备。电子外围设备包括主体和多个外围垫。外围垫片设置在主体的相应表面上。电子装置包括主体和多个装置垫。主体包括接收面。装置垫设置在接收表面上。当对应的表面设置在接收表面上并且每个外围焊盘与相应的装置焊盘接触时，主体与主体电连接。

96. 发明公开

US20240109230A1 MANUFACTURING METHOD OF HOUSING STRUCTURE OF ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20240109230A1
公开(公告)日：2024-04-04
申请号：US18317937
申请日：2023-05-16
申请人： Acer Incorporated , Nan Pao New Materials (Huaian) Co., Ltd.
发明人： Pin-Chueh Lin , Wen-Chieh Tai , Cheng-Nan Ling , Chang-Huang Huang
IPC分类号： B29C45/16 , B29C45/00
CPC分类号： B29C45/1679 , B29C45/0055 , B29L2031/3481
摘要： A manufacturing method of housing structure of electronic device is provided. The manufacturing method includes stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers. The layer stacked after the painting layer washes and squeezes at least a portion of the flowing painting layer to form a random texture pattern.

97. 发明公开

US20240069606A1 PORTABLE ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20240069606A1
公开(公告)日：2024-02-29
申请号：US18501055
申请日：2023-11-03
申请人： Acer Incorporated , Sinher Technology Inc.
发明人： Yi-Ta Huang , Cheng-Nan Ling , Chih-Chun Liu , Yung-Chang Chiang
IPC分类号： G06F1/16 , F16C11/04
CPC分类号： G06F1/1681 , F16C11/04 , G06F1/1616 , E05D3/18
摘要： A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.

98. 发明授权

US11850321B2 Casing and manufacturing method thereof 有权
公开(公告)号：US11850321B2
公开(公告)日：2023-12-26
申请号：US17182233
申请日：2021-02-23
申请人： Acer Incorporated
发明人： Wen-Hsin Lin , Wen-Chieh Tai , Cheng-Nan Ling
IPC分类号： A45C11/00 , A61L2/232 , A61L101/02
CPC分类号： A61L2/232 , A45C11/00 , A45C2011/001 , A45C2011/002 , A45C2011/003 , A61L2101/02
摘要： The disclosure provides a casing including a substrate, a transparent fluorescent identifying part, and a transparent antibacterial film. The transparent fluorescent identifying part is disposed on the substrate. The transparent antibacterial film covers the substrate and the transparent fluorescent identifying part. A method of manufacturing the casing is also provided.

99. 发明授权

US11847000B2 Portable electronic device 有权
公开(公告)号：US11847000B2
公开(公告)日：2023-12-19
申请号：US17834951
申请日：2022-06-08
申请人： Acer Incorporated , Sinher Technology Inc.
发明人： Yi-Ta Huang , Cheng-Nan Ling , Chih-Chun Liu , Yung-Chang Chiang
IPC分类号： G06F1/16 , F16C11/04 , E05D3/18 , E05D3/12
CPC分类号： G06F1/1681 , F16C11/04 , G06F1/1616 , E05D3/122 , E05D3/18 , E05Y2900/606
摘要： A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.

100. 发明授权

US11778766B2 Casing and manufacturing method thereof 有权
公开(公告)号：US11778766B2
公开(公告)日：2023-10-03
申请号：US17087634
申请日：2020-11-03
申请人： Acer Incorporated
发明人： Wen-Hsin Lin , Cheng-Nan Ling , Wen-Chieh Tai
IPC分类号： H05K5/04 , B23K26/362 , B24B19/02 , C25D13/20
CPC分类号： H05K5/04 , B23K26/362 , B24B19/02 , C25D13/20
摘要： A manufacturing method of a casing including the following steps is provided. A magnesium alloy substrate is provided first. Next, a protective film is formed on the magnesium alloy substrate. A grinding treatment, a cutting treatment, or an engraving treatment is then performed to remove portions of the protective film and portions of the magnesium alloy substrate. An electrophoretic coating treatment is performed afterwards to form a light-transmissive coating layer covering the protective film and the magnesium alloy substrate. A casing is also provided.

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