专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100319969A1 LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES 有权
标题翻译：具有导电约束线的轻型电路板
公开(公告)号：US20100319969A1
公开(公告)日：2010-12-23
申请号：US12708459
申请日：2010-02-18
申请人： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
发明人： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
IPC分类号： H05K1/03 , H05K1/00 , H05K3/00
CPC分类号： B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
摘要： Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
摘要翻译：预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。在一个实施例中，预浸料包括浸渍有导电和导热树脂的基材。在其它实施例中，预浸料坯具有包括碳的基底材料。在其它实施方案中，预浸料包括浸渍有导热树脂的基材。在其他实施例中，印刷线路板结构包括可以用作接地和/或电源平面的导电和导热的层压板。

2. 发明申请

US20050019541A1 Lightweight circuit board with conductive constraining cores 有权
标题翻译：轻型电路板，带导电约束芯
公开(公告)号：US20050019541A1
公开(公告)日：2005-01-27
申请号：US10921649
申请日：2004-08-18
申请人： Kalu Vasoya , Bharat Mangrolia , William Davis , Richard Bohner
发明人： Kalu Vasoya , Bharat Mangrolia , William Davis , Richard Bohner
IPC分类号： C08J5/24 , B32B5/26 , B32B27/04 , C08K3/38 , C08K9/08 , H05K1/02 , H05K1/03 , H05K3/42 , H05K3/44 , H05K3/46 , B32B27/12 , B32B31/08
CPC分类号： B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
摘要： Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
摘要翻译：预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。在其它实施例中，预浸料坯具有包括碳的基底材料。在其它实施方案中，预浸料包括浸渍有导热树脂的基材。在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。

3. 发明授权

US08097335B2 Lightweight circuit board with conductive constraining cores 有权
标题翻译：轻型电路板，带导电约束芯
公开(公告)号：US08097335B2
公开(公告)日：2012-01-17
申请号：US12708459
申请日：2010-02-18
申请人： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
发明人： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
IPC分类号： B32B15/00
CPC分类号： B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
摘要： Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
摘要翻译：预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。在其它实施例中，预浸料坯具有包括碳的基底材料。在其它实施方案中，预浸料包括浸渍有导热树脂的基材。在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。

4. 发明申请

US20060068660A1 Anti-radiation protection mat and relative manufacturing method 审中-公开
标题翻译：防辐射防护垫及相关制造方法
公开(公告)号：US20060068660A1
公开(公告)日：2006-03-30
申请号：US10537998
申请日：2004-02-18
申请人： Nicola Limardo
发明人： Nicola Limardo
IPC分类号： D03D15/00 , B32B15/14 , B32B5/26
CPC分类号： G21F1/00 , A61N1/16 , G21F3/02 , Y10T442/109 , Y10T442/116 , Y10T442/117
摘要： A mat for the protection against radiations is described, which comprises a mesh (2) made of copper fibres (3) interlaced with carbon fibres (4), and a solution (5) with liquid moss of oak placed on said mesh (2).
摘要翻译：描述了用于防止辐射的垫，其包括由与碳纤维（4）交织的铜纤维（3）制成的网（2）和具有放置在所述网（2）上的橡木液体苔藓的溶液（5）。

5. 发明授权

US5370921A Lightning strike composite and process 失效
标题翻译：雷击复合和过程
公开(公告)号：US5370921A
公开(公告)日：1994-12-06
申请号：US728642
申请日：1991-07-11
申请人： Calvin P. Cedarleaf
发明人： Calvin P. Cedarleaf
IPC分类号： B32B3/24 , B32B15/14 , B64D45/02 , H02G13/00 , B32B3/10 , B32B5/02 , B32B7/00
CPC分类号： B64D45/02 , B32B15/14 , Y10T428/24331 , Y10T442/117 , Y10T442/121 , Y10T442/3439 , Y10T442/475
摘要： A lightning strike coating composition for composites. The composite is multilayered and comprises (i) a prepreg containing layer, (ii) a lightweight, highly conductive metallic wire screen or foil layer, and (iii) a sheet of lightweight carrier fabric containing (a) on one side a coating of a highly filled, thermoset resin in which the filler comprises a multimodal combination of filler particles, and (b) optionally, on the other side an adhesive joining it to layer (ii); wherein the layers are bonded to each other. Also, a process for making the multilayered composite by bonding prepreg assemblies, optionally with a honeycomb structure, to at least one layer of conductive metal screen or foil, bonding the metal screen or foil to one surface of a carrier fabric sheet that is normally not conductive, the other side of the carrier sheet is bonded to the surface coating of a highly filled, thermosettable resin in which the filler comprises a multimodal combination of filler particles, whereby to form a composite assembly, subjecting the composite assembly to sufficient heat to cure the prepregs, honeycomb structures and the surface coating to form a cured composite structure.
摘要翻译：用于复合材料的雷击涂料组合物。复合材料是多层的，并且包括（i）包含预浸料的层，（ii）轻质，高导电性金属丝网或箔层，和（iii）轻质载体织物片，其包含（a）一侧的涂层高填充的热固性树脂，其中填料包括填料颗粒的多峰组合，和（b）另一侧可选地将连接到层（ii）的粘合剂; 其中所述层彼此结合。而且，制造多层复合材料的方法，可以将预浸料组合物任选地与蜂窝结构粘合到至少一层导电金属丝网或箔上，将金属丝网或箔粘合到通常不是的载体织物片的一个表面上载体片的另一侧被结合到高度填充的可热固树脂的表面涂层上，其中填料包括填料颗粒的多峰组合，由此形成复合组件，使复合组件充分热固化预浸料，蜂窝结构和表面涂层以形成固化的复合结构。

6. 发明申请

US20070117480A1 Method and apparatus for increasing a durability of a body 审中-公开
标题翻译：提高身体耐久性的方法和装置
公开(公告)号：US20070117480A1
公开(公告)日：2007-05-24
申请号：US11406892
申请日：2006-04-19
申请人： Douglas Carper , Michael Millard
发明人： Douglas Carper , Michael Millard
IPC分类号： D03D15/00
CPC分类号： F02K1/805 , F02K1/12 , F05D2240/55 , Y02T50/672 , Y10T442/109 , Y10T442/11 , Y10T442/112 , Y10T442/114 , Y10T442/116 , Y10T442/117 , Y10T442/119 , Y10T442/121 , Y10T442/122 , Y10T442/124 , Y10T442/126 , Y10T442/128 , Y10T442/129 , Y10T442/131 , Y10T442/172
摘要： An inseparable assembly includes a body including a ceramic matrix composite material, and a cover including a metallic wire mesh. The cover is bonded to the body so that the cover overlaps at least a portion of the body.
摘要翻译：不可分离的组件包括包括陶瓷基复合材料的主体和包括金属丝网的盖。盖子结合到主体，使得盖子与身体的至少一部分重叠。

7. 发明申请

US20050153613A1 Article and process for maintaining orientation of a fiber reinforced matt layer in a sandwiched urethane construction 失效
标题翻译：维持夹层聚氨酯结构中的纤维增强亚光层的取向的制品和方法
公开(公告)号：US20050153613A1
公开(公告)日：2005-07-14
申请号：US10756727
申请日：2004-01-13
申请人： Mel Bingenheimer
发明人： Mel Bingenheimer
IPC分类号： B32B5/18 , B32B5/26 , B32B5/28 , B32B17/04 , E04B1/76 , E04B1/84 , E04B1/86 , E04C2/296 , E04F13/08 , E04F15/02 , E04F15/20 , B32B17/02
CPC分类号： B32B5/26 , B32B5/18 , B32B5/28 , B32B17/04 , B32B2266/08 , B32B2307/102 , B32B2375/00 , B32B2607/00 , E04B1/86 , E04B2001/7683 , E04B2001/8461 , E04C2/296 , E04F13/08 , E04F15/02 , E04F15/20 , Y10T428/249987 , Y10T428/24999 , Y10T442/102 , Y10T442/109 , Y10T442/114 , Y10T442/117 , Y10T442/121 , Y10T442/122 , Y10T442/129 , Y10T442/131 , Y10T442/133 , Y10T442/134 , Y10T442/143 , Y10T442/15 , Y10T442/159 , Y10T442/16 , Y10T442/172 , Y10T442/188 , Y10T442/191 , Y10T442/198 , Y10T442/2992
摘要： A multiple layer fiber reinforced material and method of constructing the same including the provision of a first layer of a roll lofted glass material. Optional variants include the pre-application of plywood, OSB or fiber reinforced cement board materials prior to the first glass layer. A layer of a rolled fiber reinforced material is applied over the rolled glass material, with or without backing board material, and at least a second layer of the roll lofted glass material is applied over the rolled fiber reinforced material. A layer of a second rolled glass material is applied over the subsequent layer of the first glass material and a urethane resin syrup is intermixed with said layers of glass material and the fiber reinforced material. An application of heat and pressure results in the formation of the reinforced material. A flexural, closed cell foam material may also be applied to provide acoustical insulating properties to the multi-layer fiber material.
摘要翻译：一种多层纤维增强材料及其构造方法，包括提供第一层辊顶玻璃材料。可选的变型包括在第一玻璃层之前预先施加胶合板，OSB或纤维增强水泥板材料。将一层轧制纤维增强材料施加在轧制的玻璃材料上，具有或不具有背板材料，并且将至少第二层辊顶玻璃材料施加在轧制的纤维增强材料上。将第二轧制玻璃材料层施加在第一玻璃材料的后续层上，并将聚氨酯树脂浆与所述玻璃材料层和纤维增强材料混合。施加热和压力导致增强材料的形成。还可以应用弯曲闭孔泡沫材料以向多层纤维材料提供隔音性能。

8. 发明申请

US20050097893A1 Method and apparatus for increasing a durability of a body 审中-公开
标题翻译：提高身体耐久性的方法和装置
公开(公告)号：US20050097893A1
公开(公告)日：2005-05-12
申请号：US10703273
申请日：2003-11-07
申请人： Douglas Carper , Michael Millard
发明人： Douglas Carper , Michael Millard
IPC分类号： F01D5/28 , B32B7/02 , B32B7/04 , B32B15/02 , C04B37/02 , F02C7/00 , F02C7/24 , F02K1/12 , F02K1/80 , F02K1/00
CPC分类号： F02K1/805 , F02K1/12 , F05D2240/55 , Y02T50/672 , Y10T442/109 , Y10T442/11 , Y10T442/112 , Y10T442/114 , Y10T442/116 , Y10T442/117 , Y10T442/119 , Y10T442/121 , Y10T442/122 , Y10T442/124 , Y10T442/126 , Y10T442/128 , Y10T442/129 , Y10T442/131 , Y10T442/172
摘要： An inseparable assembly includes a body including a ceramic matrix composite material, and a cover including a metallic wire mesh. The cover is bonded to the body so that the cover overlaps at least a portion of the body.
摘要翻译：不可分离的组件包括包括陶瓷基复合材料的主体和包括金属丝网的盖。盖子结合到主体，使得盖子与身体的至少一部分重叠。

9. 发明申请

US20050019535A1 Lightweight circuit board with conductive constraining cores 有权
公开(公告)号：US20050019535A1
公开(公告)日：2005-01-27
申请号：US10921616
申请日：2004-08-18
申请人： Kalu Vasoya , Bharat Mangrolia , William Davis , Richard Bohner
发明人： Kalu Vasoya , Bharat Mangrolia , William Davis , Richard Bohner
IPC分类号： C08J5/24 , B32B5/26 , B32B27/04 , C08K3/38 , C08K9/08 , H05K1/02 , H05K1/03 , H05K3/42 , H05K3/44 , H05K3/46 , B32B3/00
CPC分类号： B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
摘要： Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

10. 发明授权

US5470413A Process of making a lighting strike composite 失效
标题翻译：制作照明复合材料的工艺
公开(公告)号：US5470413A
公开(公告)日：1995-11-28
申请号：US400070
申请日：1995-03-07
申请人： Calvin P. Cedarleaf
发明人： Calvin P. Cedarleaf
IPC分类号： B32B3/24 , B32B15/14 , B64D45/02 , B32B33/00 , B32B5/00 , B32B29/02 , B32B31/26
CPC分类号： B64D45/02 , B32B15/14 , Y10T428/24331 , Y10T442/117 , Y10T442/121 , Y10T442/3439 , Y10T442/475
摘要： A lighting strike coating composition for composites. The composite is multilayered and comprises (i) a prepreg containing layer, (ii) a lightweight, highly conductive metallic wire screen or foil layer, and (iii) a sheet of lightweight carrier fabric containing (a) on one side a coating of a highly filled, thermoset resin in which the filler comprises a multimodal combination of filler particles, and (b) optionally, on the other side an adhesive joining it to layer (ii); wherein the layers are bonded to each other. Also, a process for making the multilayered composite by bonding prepreg assemblies, optionally with a honeycomb structure, to at least one layer of conductive metal screen or foil, bonding the metal screen or foil to one surface of a carrier fabric sheet that is normally not conductive, the other side of the carrier sheet is bonded to the surface coating of a highly filled, thermosettable resin in which the filler comprises a multimodal combination of filler particles, whereby to form a composite assembly, subjecting the composite assembly to sufficient heat to cure the prepregs, honeycomb structures and the surface coating to form a cured composite structure.
摘要翻译：用于复合材料的照明涂料组合物。复合材料是多层的，并且包括（i）包含预浸料的层，（ii）轻质，高导电性金属丝网或箔层，和（iii）轻质载体织物片，其包含（a）一侧的涂层高填充的热固性树脂，其中填料包括填料颗粒的多峰组合，和（b）另一侧可选地将连接到层（ii）的粘合剂; 其中所述层彼此结合。而且，制造多层复合材料的方法，可以将预浸料组合物任选地与蜂窝结构粘合到至少一层导电金属丝网或箔上，将金属丝网或箔粘合到通常不是的载体织物片的一个表面上载体片的另一侧被结合到高度填充的可热固树脂的表面涂层上，其中填料包括填料颗粒的多峰组合，由此形成复合组件，使复合组件充分热固化预浸料，蜂窝结构和表面涂层以形成固化的复合结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式