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    • 1. 发明申请
    • LANTHANOID ALUMINATE FILM FABRICATION METHOD
    • 兰蔻酸铝薄膜制造方法
    • US20110284365A1
    • 2011-11-24
    • US13192687
    • 2011-07-28
    • Tsunehiro INOAkira Takashima
    • Tsunehiro INOAkira Takashima
    • C23C14/34
    • C23C14/3464C23C14/08
    • A method of fabricating by co-sputtering deposition a lanthanoid aluminate film with enhanced electrical insulativity owing to suppression of deviation in composition of the film is disclosed. Firstly within a vacuum chamber, hold two separate targets, one of which is made of lanthanoid aluminate (LnAlO3) and the other of which is made of aluminum oxide (Al2O3). Then, transport and load a substrate into the vacuum chamber. Next, introduce a chosen sputtering gas into this chamber. Thereafter, perform sputtering of both the targets at a time to thereby form a lanthanoid aluminate film on the substrate surface. This film is well adaptable for use as ultra-thin high dielectric constant (high-k) gate dielectrics in highly miniaturized metal oxide semiconductor (MOS) transistors.
    • 公开了一种通过共溅射沉积制造具有增强的电绝缘性的镧系铝酸盐膜的方法,这是因为抑制了膜的组成偏差。 首先在真空室内保持两个独立的靶,其中一个靶由铝酸镧(LnAlO3)制成,另一个由氧化铝(Al2O3)制成。 然后,将基板输送并加载到真空室中。 接下来,将选择的溅射气体引入该室。 此后,一次进行两个靶的溅射,从而在基板表面上形成镧系铝酸盐膜。 该薄膜适用于高度小型化的金属氧化物半导体(MOS)晶体管中的超薄高介电常数(高k)栅极电介质。