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1. 发明授权

US09173326B1 Reversible fan module for electronic enclosures 有权
标题翻译：用于电子外壳的可逆风扇模块
公开(公告)号：US09173326B1
公开(公告)日：2015-10-27
申请号：US13776159
申请日：2013-02-25
申请人： Adtran Inc.
发明人： Brian C. Smith , Jacob D. McCleary
IPC分类号： H05K7/20
CPC分类号： H05K7/20581 , H05K7/20136 , H05K7/20172 , H05K7/20727
摘要： An enclosure for electronics includes a chassis and an interface connector positioned within the chassis and configured to provide power. A fan shelf module is received within the chassis and has at least one fan to provide air flow through the chassis. The fan shelf module includes a pinout connector along a horizontal or vertical line of symmetry and configured to engage the interface connector and receive power therefrom, such that the fan shelf module is selectively installed in one of two opposing directions allowing a fan air flow direction to the chassis to be selected as either pulling air or pushing air through the chassis depending on the installed direction of the fan shelf module.
摘要翻译：用于电子设备的外壳包括机架和定位在机架内并被配置成提供电力的接口连接器。风扇架模块被容纳在机架内，并且具有至少一个风扇以提供通过底盘的气流。风扇架模块包括沿着水平或垂直对称线的引脚排列连接器，并且被配置为接合接口连接器并从其接收功率，使得风扇架模块选择性地安装在两个相反方向之一中，允许风扇空气流动方向根据风扇架模块的安装方向，选择作为拉动空气或推动空气通过机架的底盘。

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