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1. 发明授权

US6017438A Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor 失效
标题翻译：一种具有凸点接触点的电路基板的制造方法以及用于其的喷流式电镀装置
公开(公告)号：US6017438A
公开(公告)日：2000-01-25
申请号：US938555
申请日：1997-09-26
申请人： Yoshinari Takayama , Toshiki Naito , Kazuo Ouchi
发明人： Yoshinari Takayama , Toshiki Naito , Kazuo Ouchi
IPC分类号： C25D5/02 , C25D5/08 , H01L21/60
CPC分类号： C25D5/08 , C25D5/026 , H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14
摘要： A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.
摘要翻译：一种具有凸点接触点的电路基板的制造方法，其特征在于，包括以下步骤：（a）将正极放置在储存在储罐中的电镀溶液中，（b）将形成在绝缘基板上的导电电路露出，，（c）设置在电镀液表面下方开口的射流，（d）使用所述导电电路作为负极，从喷射流开口朝向负极喷射电镀溶液，以形成负极表面上的凸点接触点，以及用于其的射流式电镀装置。根据本发明，能够抑制电镀溶液中的气泡的混合，从而能够抑制增白剂成分的氧化分解。结果，凸块接触点可以具有蘑菇形状，并且可以使凸块接触点的高度的变化最小化。此外，可以避免凸块接触点的顶点滑动和凸点接触点的损失。

2. 发明授权

US6011310A Film carrier and semiconductor device using the same 失效
标题翻译：薄膜载体和半导体器件使用相同
公开(公告)号：US6011310A
公开(公告)日：2000-01-04
申请号：US722321
申请日：1996-09-27
申请人： Toshiki Naito , Kazuo Ouchi
发明人： Toshiki Naito , Kazuo Ouchi
IPC分类号： H01L21/60 , H01L23/498 , H01L23/50 , H05K3/40 , H05K3/42 , H01L23/48 , H01L23/053 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , H01L23/4985 , H05K3/4007 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H05K2201/0347 , H05K2201/0355 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/1572 , H05K3/423
摘要： Disclosed are a film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to the other surface of the insulating layer are formed and a semiconductor device prepared by mounting a semiconductor element on the insulating layer of the film carrier. The film carrier can sufficiently correspond to pitch-fining and high-density mounting of a semiconductor element wiring, can surely perform the connecting operation of inner lead bonding and outer lead bonding and gives the mounting area of as small as possible.
摘要翻译：公开了一种薄膜载体，其包括绝缘层，其中放置有导电电路，使得该电路不在其表面上露出，其中从导电电路到绝缘层的一个表面的导电通道形成在绝缘层中，并且经由形成从所述导电电路到绝缘层的另一表面的孔，以及通过将半导体元件安装在膜载体的绝缘层上而制备的半导体器件。薄膜载体可以充分地对应于半导体元件布线的节距精细和高密度安装，可以可靠地执行内引线接合和外引线接合的连接操作，并且使安装面积尽可能小。

3. 发明授权

US5374469A Flexible printed substrate 失效
标题翻译：柔性印刷基板
公开(公告)号：US5374469A
公开(公告)日：1994-12-20
申请号：US945929
申请日：1992-09-17
申请人： Atsushi Hino , Amane Mochizuki , Kazuo Ouchi , Shoji Morita , Toshiki Naito , Kazumi Higashi , Masako Maeda , Masayuki Kaneto , Munekazu Tanaka , Masakazu Sugimoto
发明人： Atsushi Hino , Amane Mochizuki , Kazuo Ouchi , Shoji Morita , Toshiki Naito , Kazumi Higashi , Masako Maeda , Masayuki Kaneto , Munekazu Tanaka , Masakazu Sugimoto
IPC分类号： H05K1/00 , H05K1/03 , H05K3/00 , H05K3/20 , H05K3/28 , H05K3/40 , H05K3/42 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4635 , H05K1/036 , H05K3/205 , H05K3/281 , H05K3/4007 , H05K3/421 , H05K3/4617 , H05K3/4632 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H05K1/0346 , H05K1/0393 , H05K2201/0129 , H05K2201/0154 , H05K2201/0195 , H05K2201/0347 , H05K2201/0355 , H05K2201/0358 , H05K2201/0367 , H05K2201/0394 , H05K2201/068 , H05K2201/09481 , H05K2201/10378 , H05K2203/0152 , H05K2203/0156 , H05K2203/0376 , H05K2203/063 , H05K2203/0726 , H05K2203/0733 , H05K2203/107 , H05K2203/1572 , H05K3/0035 , H05K3/28 , H05K3/423 , H05K3/427 , H05K3/4647 , Y10S428/901 , Y10T428/24917 , Y10T428/24942 , Y10T428/31721
摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.
摘要翻译：公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

4. 发明授权

US08487189B2 Wired circuit board assembly sheet 失效
公开(公告)号：US08487189B2
公开(公告)日：2013-07-16
申请号：US12929902
申请日：2011-02-23
申请人： Toshiki Naito , Tetsuya Ohsawa , Kouji Kataoka
发明人： Toshiki Naito , Tetsuya Ohsawa , Kouji Kataoka
IPC分类号： H05K1/00
CPC分类号： H05K1/0269 , H05K1/056 , H05K3/0052 , H05K3/225 , H05K2201/0909 , H05K2201/09127 , H05K2201/0969 , H05K2201/09781 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53022 , Y10T29/53026 , Y10T29/5303 , Y10T29/53035 , Y10T29/53039 , Y10T29/53043
摘要： A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.

5. 发明授权

US08351743B2 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US08351743B2
公开(公告)日：2013-01-08
申请号：US12458223
申请日：2009-07-06
申请人： Toshiki Naito , Jun Ishii
发明人： Toshiki Naito , Jun Ishii
IPC分类号： G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02B6/43 , G11B5/486 , G11B5/4866 , G11B2005/0021 , H05K1/0274 , H05K1/056 , Y10T29/49155
摘要： A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is provided on the metal supporting board separately from the insulating base layer, the conductive pattern, and the insulating cover layer.
摘要翻译：具有电路的悬挂板包括金属支撑板; 形成在金属支撑板上的绝缘基底层; 形成在绝缘基底层上的导电图案; 绝缘覆盖层，形成在所述绝缘基底层上以覆盖所述导电图案; 和光波导。光波导与绝缘基底层，导电图案和绝缘覆盖层分开设置在金属支撑板上。

6. 发明授权

US08208225B2 Suspension board with circuit and producing method thereof 有权
标题翻译：具有电路的悬挂板及其制造方法
公开(公告)号：US08208225B2
公开(公告)日：2012-06-26
申请号：US12588906
申请日：2009-11-02
申请人： Tetsuya Ohsawa , Toshiki Naito
发明人： Tetsuya Ohsawa , Toshiki Naito
IPC分类号： G11B5/48
CPC分类号： H05K1/189 , G11B5/484 , G11B5/4853 , G11B5/486 , H05K1/056 , H05K3/305 , H05K3/3442 , H05K2201/055 , H05K2201/09063 , H05K2201/09081 , H05K2201/10545 , H05K2201/10598 , Y10T29/49027 , Y10T29/49124
摘要： A suspension board with circuit includes a conductive pattern, a board main body portion on which a magnetic head is mounted, and an auxiliary portion capable of being folded back with respect to the board main body portion so as to face a back surface of the board main body portion. The conductive pattern includes a first conductive pattern including a first terminal electrically connected to an external circuit, and a second terminal electrically connected to the magnetic head, and a second conductive pattern including a third terminal electrically connected to the external circuit, and a fourth terminal electrically connected to an electronic element. Both of the first terminal and the second terminal are disposed on the board main body portion. The third terminal is disposed on the board main body portion or on the auxiliary portion, and the fourth terminal is disposed on the auxiliary portion.
摘要翻译：具有电路的悬挂板包括导电图案，安装有磁头的板主体部分和能够相对于板主体部分折叠以便面向板的后表面的辅助部分主体部分。导电图案包括：第一导电图案，包括电连接到外部电路的第一端子和与磁头电连接的第二端子;以及第二导电图案，其包括电连接到外部电路的第三端子，以及第四端子电连接到电子元件。第一端子和第二端子都设置在板主体部分上。第三端子设置在板主体部分或辅助部分上，第四端子设置在辅助部分上。

7. 发明申请

US20100188779A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20100188779A1
公开(公告)日：2010-07-29
申请号：US12656053
申请日：2010-01-14
申请人： Tetsuya Ohsawa , Toshiki Naito
发明人： Tetsuya Ohsawa , Toshiki Naito
IPC分类号： G11B5/48
CPC分类号： G11B5/4853 , G11B5/486
摘要： A suspension board with circuit includes a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed close to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed close to the auxiliary portion. The conductive pattern includes a first conductive pattern including a first terminal, and a second terminal connected to the magnetic head, and a second conductive pattern including a third terminal and a fourth terminal connected to the light emitting element. The first, second and third terminals are disposed on the board main body portion. The fourth terminal is disposed on the auxiliary portion. The back surface of the board main body portion is formed with a main-body-side interfitting portion. A back surface of the auxiliary portion is formed with an auxiliary-portion-side interfitting portion.
摘要翻译：具有电路的悬挂板包括板主体部分，相对于板主体部分折回的辅助部分，靠近板主体部分设置的滑块以及安装在其上的磁头和发光元件，靠近辅助部分。导电图案包括包括第一端子和连接到磁头的第二端子的第一导电图案，以及包括连接到发光元件的第三端子和第四端子的第二导电图案。第一，第二和第三端子设置在板主体部分上。第四端子设置在辅助部分上。板主体部分的背面形成有主体侧配合部分。辅助部分的后表面形成有辅助部分侧配合部分。

8. 发明申请

US20100118445A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20100118445A1
公开(公告)日：2010-05-13
申请号：US12591102
申请日：2009-11-09
申请人： Tetsuya Ohsawa , Toshiki Naito
发明人： Tetsuya Ohsawa , Toshiki Naito
IPC分类号： G11B21/16
CPC分类号： H05K1/189 , G11B5/4833 , G11B5/484 , G11B5/4853 , G11B5/486 , G11B5/4866 , G11B2005/0021 , H05K1/056 , H05K1/182 , H05K2201/048 , H05K2201/055 , H05K2201/0969 , H05K2201/10106 , H05K2201/10537 , H05K2201/10727
摘要： A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.
摘要翻译：具有电路的悬挂板包括导电图案，板主体部分，相对于板主体部分折回的辅助部分，设置在悬挂板侧面的滑块，该滑块更靠近板主体并安装在磁头上的发光元件和配置在靠近辅助部分的电路的悬挂板侧的发光元件。导电图案包括第一导电图案，包括连接到外部电路和磁头的第一和第二端子，以及包括连接到外部电路和发光元件的第三和第四端子的第二导电图案。第一端子和第二端子都设置在板主体部分上。第三和第四端子分别设置在板主体部分和辅助部分上。

9. 发明申请

US20090285524A1 Suspension board with circuit 有权
标题翻译：悬挂板带电路
公开(公告)号：US20090285524A1
公开(公告)日：2009-11-19
申请号：US12453506
申请日：2009-05-13
申请人： Jun Ishii , Toshiki Naito
发明人： Jun Ishii , Toshiki Naito
IPC分类号： G02B6/12
CPC分类号： G11B5/484 , G02B6/4214 , G02B6/4296 , G11B2005/0021 , H05K1/0274 , H05K1/056
摘要： A suspension board with circuit includes a metal supporting board including a board trench portion, an insulating base layer formed on a surface of the metal supporting board, a conductive pattern formed on a surface of the insulating base layer, and an optical waveguide provided to overlap the board trench portion when projected in a thickness direction of the metal supporting board. At least a part of the optical waveguide is positioned closer to the conductive pattern than to a back surface of the metal supporting board.
摘要翻译：具有电路的悬挂板包括金属支撑板，该金属支撑板包括板沟槽部分，形成在金属支撑板的表面上的绝缘基底层，形成在绝缘基底层的表面上的导电图案和设置成重叠的光波导当在金属支撑板的厚度方向上投影时，板沟槽部分。光波导的至少一部分比金属支撑板的后表面更靠近导电图案。

10. 发明申请

US20090261060A1 Production Method of Suspension Board with Circuit 有权
标题翻译：带电路的悬架板的生产方法
公开(公告)号：US20090261060A1
公开(公告)日：2009-10-22
申请号：US12385576
申请日：2009-04-13
申请人： Aya Mizushima , Toshiki Naito
发明人： Aya Mizushima , Toshiki Naito
IPC分类号： C23F1/00
CPC分类号： H05K3/243 , H05K1/056 , H05K3/06 , H05K3/242 , H05K3/4007 , H05K2201/0367 , H05K2201/09554 , H05K2201/0969 , H05K2201/09718
摘要： A production method of a suspension board with circuit includes the steps of forming, on a metal supporting board, an insulating layer formed with a first opening, forming a metal thin film on the insulating layer and on the metal supporting board exposed from the first opening, forming, on a surface of the metal thin film, a conductive layer having terminal portions forming, on the terminal portions, a metal plating layer by electrolytic plating using the metal supporting board as a lead, forming a second opening in a portion of the metal supporting board opposing the first opening, and partially etching the metal supporting board to form the suspension board with circuit and a support frame. In the step of forming the insulating layer, the first opening is formed in the insulating layer in which the supporting frame is formed.
摘要翻译：具有电路的悬挂板的制造方法包括以下步骤：在金属支撑板上形成由第一开口形成的绝缘层，在绝缘层上形成金属薄膜和在第一开口露出的金属支撑板上在所述金属薄膜的表面上形成具有端子部分的导电层，所述端子部分在所述端子部分上使用所述金属支撑板作为引线通过电解电镀形成金属镀层，在所述金属镀层的一部分中形成第二开口金属支撑板与第一开口相对，并且部分地蚀刻金属支撑板以形成具有电路和支撑框架的悬挂板。在形成绝缘层的步骤中，第一开口形成在形成支撑框架的绝缘层中。

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