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    • 6. 发明授权
    • Plating method and apparatus
    • 电镀方法和装置
    • US06221230B1
    • 2001-04-24
    • US09078572
    • 1998-05-14
    • Hiromitsu TakeuchiMasahiro OkumiyaYoshiki TsunekawaYutaka Kawai
    • Hiromitsu TakeuchiMasahiro OkumiyaYoshiki TsunekawaYutaka Kawai
    • C25D508
    • C25D5/08C25D1/00C25D1/003C25D5/026
    • A method and apparatus for forming a layer of plating on a base material and a method for manufacturing a three dimensional object. The plating apparatus includes a nozzle for delivering a stream of plating fluid and an electric source for applying a voltage between the base material and the nozzle. The nozzle has an outer wall and a stem located at its center. The nozzle delivers plating fluid from the opening of the nozzle in an annular manner to produce a stream that has a substantially uniform flow velocity when the stream hits the base material. In an another embodiment, the nozzle has surrounding conduit for conducting air. The air increases the velocity of a peripheral portion of the stream. To manufacture a three dimensional object, a plating layer is deposited, and the nozzle is moved to form a desired shape while piling the layer.
    • 一种用于在基材上形成电镀层的方法和装置以及用于制造三维物体的方法。 电镀装置包括用于输送电镀液流的喷嘴和用于在基材和喷嘴之间施加电压的电源。 喷嘴具有位于其中心的外壁和杆。 喷嘴以环形方式从喷嘴的开口输送电镀液,以产生当料流撞击基材时具有基本均匀流速的流。 在另一个实施例中,喷嘴具有用于传导空气的周围导管。 空气增加了流的周边部分的速度。 为了制造三维物体,沉积镀层,并且在堆叠层时使喷嘴移动以形成期望的形状。
    • 7. 发明授权
    • Plating method
    • 电镀方法
    • US5865976A
    • 1999-02-02
    • US788977
    • 1997-01-24
    • Hiromitsu TakeuchiYoshiki TsunekawaMasahiro Okumiya
    • Hiromitsu TakeuchiYoshiki TsunekawaMasahiro Okumiya
    • C23C4/12C23C24/04C25D5/08C25D5/44C25D15/02
    • C23C24/04C23C4/123C25D15/02C25D5/08C25D5/44
    • A method of making a composite structure including at least a plating film disposed on a substrate having at least a surface portion formed from a metallic base material. The method includes the steps of discharging a composite plating solution containing insoluble particles from a nozzle and impacting the composite plating solution on the surface portion of the substrate at a predetermined flow rate. During at least a portion of the discharging and impacting steps, the surface portion of the substrate is abraded with the insoluble particles in the plating solution discharged from the nozzle. A voltage can be applied between the base material and the nozzle, which are electrically connected by the plating solution, to thereby deposit a plating film on the surface portion of the substrate by electroplating.
    • 一种制造复合结构体的方法,该复合结构至少包括设置在至少具有由金属基材形成的表面部分的基板上的镀膜。 该方法包括以下步骤:从喷嘴排出含有不溶性颗粒的复合镀液,并以预定的流速冲击基板的表面部分上的复合镀液。 在排放和冲击步骤的至少一部分期间,基板的表面部分被从喷嘴排出的镀液中的不溶性颗粒磨损。 可以在通过电镀液电连接的基材和喷嘴之间施加电压,由此通过电镀将镀膜沉积在基板的表面部分上。