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1. 发明授权

US07767574B2 Method of forming micro metal bump 有权
标题翻译：形成微金属凸块的方法
公开(公告)号：US07767574B2
公开(公告)日：2010-08-03
申请号：US12225741
申请日：2007-03-30
申请人： Yoshihiro Gomi , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi , Yoshikuni Okada , Hirotaka Oosato
发明人： Yoshihiro Gomi , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi , Yoshikuni Okada , Hirotaka Oosato
IPC分类号： H01L21/44
CPC分类号： C23C14/541 , B23K1/0016 , B23K3/0607 , C23C14/042 , C23C14/228 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/742 , H01L2224/0401 , H01L2224/0603 , H01L2224/1131 , H01L2224/1147 , H01L2224/13012 , H01L2224/13016 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079
摘要： The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate. The method comprises the steps of: forming a straight hole (34) in a mask layer (30) covering one side surface of a substrate (10) on which a wiring pattern (12) is formed, wherein a prescribed position of the wiring pattern (12) is exposed in a bottom surface of the straight hole and the straight hole has an inner wall perpendicular to the one side surface of the substrate (10) and a sharp top opening portion; providing a metal plate, whose area is larger than that of the substrate (10), on the other side surface of the substrate (10) as a heat sink; placing the substrate (10) and the metal plate in a vacuum; forming a tapered metal bump (14) on the exposed surface of the wiring pattern (12), which is exposed in the bottom surface of the straight hole (34), by a gas deposition process, in which metal nanoparticles obtained by evaporating a metal are ejected from a nozzle together with a carrier gas so as to deposit on the prescribed position, with cooling the substrate (10) to a temperature lower than upper temperature limit of resin constituting the mask layer (30), by the metal plate as the heat sink, so as to retain a configuration of the straight hole (34); and removing the mask layer (30) from the one side surface of the substrate so as to complete the tapered metal bump (14) at the prescribed position of the wiring pattern (12).
摘要翻译：本发明提供一种通过气相沉积工艺在形成在基板的一个侧表面上的金属部件的规定位置上形成能够稳定地和工业上形成微小金属凸块的微型金属凸块的方法。该方法包括以下步骤：在覆盖其上形成有布线图案（12）的基板（10）的一个侧表面的掩模层（30）中形成直孔（34），其中布线图案（12）暴露在直孔的底面上，直孔具有与基板（10）的一个侧面垂直的内壁和尖锐的开口部; 在作为散热器的基板（10）的另一侧表面上设置面积比基板（10）的面积大的金属板; 将基板（10）和金属板放置在真空中; 在通过气相沉积工艺暴露在直孔（34）的底表面中的布线图案（12）的暴露表面上形成锥形金属凸块（14），其中通过蒸发金属与载气一起从喷嘴喷射，以便沉积在规定位置，通过金属板作为基板（10）冷却至低于构成掩模层（30）的树脂的上限温度的温度散热器，以保持直孔（34）的构造; 以及从所述基板的一个侧表面去除所述掩模层（30），以在所述布线图案（12）的规定位置处完成所述锥形金属凸块（14）。

2. 发明申请

US20090104766A1 Method of Forming Micro Metal Bump 有权
标题翻译：微金属凸块的形成方法
公开(公告)号：US20090104766A1
公开(公告)日：2009-04-23
申请号：US12225741
申请日：2007-03-30
申请人： Yoshihiro Gomi , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi , Yoshikuni Okada , Hirotaka Oosato
发明人： Yoshihiro Gomi , Masahiro Aoyagi , Hiroshi Nakagawa , Katsuya Kikuchi , Yoshikuni Okada , Hirotaka Oosato
IPC分类号： H01L21/443
CPC分类号： C23C14/541 , B23K1/0016 , B23K3/0607 , C23C14/042 , C23C14/228 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/742 , H01L2224/0401 , H01L2224/0603 , H01L2224/1131 , H01L2224/1147 , H01L2224/13012 , H01L2224/13016 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079
摘要： The present invention provides a method of forming a micro metal bump, which is capable of stably and industrially forming a micro metal bump, by a gas deposition process, at a prescribed position of a metal part formed on one side surface of a substrate. The method comprises the steps of: forming a straight hole (34) in a mask layer (30) covering one side surface of a substrate (10) on which a wiring pattern (12) is formed, wherein a prescribed position of the wiring pattern (12) is exposed in a bottom surface of the straight hole and the straight hole has an inner wall perpendicular to the one side surface of the substrate (10) and a sharp top opening portion; providing a metal plate, whose area is larger than that of the substrate (10), on the other side surface of the substrate (10) as a heat sink; placing the substrate (10) and the metal plate in a vacuum; forming a tapered metal bump (14) on the exposed surface of the wiring pattern (12), which is exposed in the bottom surface of the straight hole (34), by a gas deposition process, in which metal nanoparticles obtained by evaporating a metal are ejected from a nozzle together with a carrier gas so as to deposit on the prescribed position, with cooling the substrate (10) to a temperature lower than upper temperature limit of resin constituting the mask layer (30), by the metal plate as the heat sink, so as to retain a configuration of the straight hole (34); and removing the mask layer (30) from the one side surface of the substrate so as to complete the tapered metal bump (14) at the prescribed position of the wiring pattern (12).
摘要翻译：本发明提供一种通过气相沉积工艺在形成在基板的一个侧表面上的金属部件的规定位置上形成能够稳定地和工业上形成微小金属凸块的微型金属凸块的方法。该方法包括以下步骤：在覆盖其上形成有布线图案（12）的基板（10）的一个侧表面的掩模层（30）中形成直孔（34），其中布线图案（12）暴露在直孔的底面上，直孔具有与基板（10）的一个侧面垂直的内壁和尖锐的开口部; 在作为散热器的基板（10）的另一侧表面上设置面积比基板（10）的面积大的金属板; 将基板（10）和金属板放置在真空中; 在通过气相沉积工艺暴露在直孔（34）的底表面中的布线图案（12）的暴露表面上形成锥形金属凸块（14），其中通过蒸发金属与载气一起从喷嘴喷射，以便沉积在规定位置，通过金属板作为基板（10）冷却至低于构成掩模层（30）的树脂的上限温度的温度散热器，以保持直孔（34）的构造; 以及从所述基板的一个侧表面去除所述掩模层（30），以在所述布线图案（12）的规定位置处完成所述锥形金属凸块（14）。

3. 发明申请

US20070065956A1 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe 有权
公开(公告)号：US20070065956A1
公开(公告)日：2007-03-22
申请号：US11602240
申请日：2006-11-21
申请人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Shigeo Kiyota
发明人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Shigeo Kiyota
IPC分类号： H01L21/66
CPC分类号： G01R1/06772 , H05K1/0219 , H05K1/117 , Y10T29/49117
摘要： There is provided a contact probe that is smaller than 50 μm in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor la electrically connected to the ground electrode 11a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.

4. 发明申请

US20080044950A1 Multi-layer fin wiring interposer fabrication process 有权
标题翻译：多层翅片接线插件制造工艺
公开(公告)号：US20080044950A1
公开(公告)日：2008-02-21
申请号：US11890502
申请日：2007-08-07
申请人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada
发明人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada
IPC分类号： H01L21/00
CPC分类号： H01L25/0657 , H01L21/486 , H01L21/768 , H01L21/76898 , H01L23/3114 , H01L23/49827 , H01L25/0655 , H01L2225/06513 , H01L2225/06541 , H01L2225/06572 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An interposer having multi-layer fine wiring structure which comprises an insulating layer made of photosensitive polyimide which is photosensitive organic material and a wiring layer portion made of metal, such as copper, silver, gold, aluminum, palladium, indium, titanium, tantalum, and niobium, functions as wiring in an integrated circuit chip, wherein junctions between the integrated circuit chip and the interposer are formed by micron to submicron size fine connection metal pads or bumps which are formed on both the integrated circuit chip and the interposer.
摘要翻译：具有多层精细布线结构的插入件，其包括由感光性有机材料构成的感光性聚酰亚胺构成的绝缘层和铜，银，金，铝，钯，铟，钛，钽等金属制的布线层部，和铌，用作集成电路芯片中的布线，其中集成电路芯片和插入器之间的接合部由形成在集成电路芯片和插入器两者上的微米至亚微米尺寸的精细连接金属焊盘或凸块形成。

5. 发明授权

US09134346B2 Method of making contact probe 有权
标题翻译：制作接触探针的方法
公开(公告)号：US09134346B2
公开(公告)日：2015-09-15
申请号：US13168136
申请日：2011-06-24
申请人： Masahiro Aoyagi , Katsuya Kikuchi , Hiroshi Nakagawa , Yoshikuni Okada , Hiroyuki Fujita , Shouichi Imai , Shigeo Kiyota
发明人： Masahiro Aoyagi , Katsuya Kikuchi , Hiroshi Nakagawa , Yoshikuni Okada , Hiroyuki Fujita , Shouichi Imai , Shigeo Kiyota
IPC分类号： H01R43/00 , G01R3/00 , G01R1/067 , G01R1/073
CPC分类号： G01R3/00 , G01R1/06772 , G01R1/07342 , Y10T29/49117 , Y10T29/49126 , Y10T156/10
摘要： A method of making a contact probe including a step of making a first printed wiring board having a signal electrode and a ground electrode used as a contact part of the contact probe with respect to a measuring object, in which the signal electrode and ground electrode are formed of a metal wiring pattern, and making a second printed wiring board with a coaxial line structure having a shield electrode which encloses a signal line and the surroundings of the signal line through an insulating layer. The signal electrode of the first printed wiring board and the signal line of the second printed wiring board are electrically connected together, and the ground electrode of the first printed wiring board and the shield electrode of the second printed wiring board are electrically connected together.
摘要翻译：一种制造接触探针的方法，包括以下步骤：制作具有信号电极和接地电极的第一印刷线路板，所述信号电极和接地电极相对于测量对象用作接触探针的接触部分，其中信号电极和接地电极为由金属布线图案形成，并且制造具有同轴线结构的第二印刷布线板，其具有通过绝缘层包围信号线和信号线周围的屏蔽电极。第一印刷电路板的信号电极和第二印刷电路板的信号线电连接在一起，并且第一印刷线路板的接地电极和第二印刷线路板的屏蔽电极电连接在一起。

6. 发明申请

US20090224781A1 CONTACT PROVE AND METHOD OF MAKING THE SAME 有权
标题翻译：联系方式及其制作方法
公开(公告)号：US20090224781A1
公开(公告)日：2009-09-10
申请号：US12297732
申请日：2007-04-19
申请人： Masahiro Aoyagi , Katsuya Kikuchi , Hiroshi Nakagawa , Yoshikuni Okada , Hiroyuki Fujita , Shouichi Imai , Shigeo Kiyota
发明人： Masahiro Aoyagi , Katsuya Kikuchi , Hiroshi Nakagawa , Yoshikuni Okada , Hiroyuki Fujita , Shouichi Imai , Shigeo Kiyota
IPC分类号： G01R31/02 , B32B37/00 , H01R43/00
CPC分类号： G01R3/00 , G01R1/06772 , G01R1/07342 , Y10T29/49117 , Y10T29/49126 , Y10T156/10
摘要： [Problem]To provide a contact probe which can easily be connected with a measurement apparatus electrically, can measure a high speed and high frequency signal with a fine pitch easily and correctly, and can easily cope with signal measurement for a plurality of channels, and a method of making the contact probe. [Means to Solve Problem] It includes a first printed wiring board 3 having a signal electrode 10a and a ground electrode 10b used as a contact part with respect to a measuring object, in which the signal electrode 10a and ground electrode 10b are formed of a metal wiring pattern on a substrate, and a second printed wiring board 2 with a coaxial line structure having shield electrodes 12, 17, 18 which enclose a signal line 15a and the surroundings of the signal line 15a through an insulating layer. The signal electrode 10a of the first printed wiring board 3 and the signal line 15a of the second printed wiring board 2 are electrically connected together, and the ground electrode 10b of the first printed wiring board 3 and the shield electrodes 12, 17, 18 of the second printed wiring board 2 are electrically connected together.
摘要翻译： [问题]为了提供可以容易地与测量装置电连接的接触探针，可以容易且准确地测量具有细间距的高速和高频信号，并且可以容易地处理多个通道的信号测量，以及制作接触探针的方法。解决问题的手段包括：第一印刷线路板3，其具有信号电极10a和接地电极10b，该接地电极用作相对于测量对象的接触部分，其中信号电极10a和接地电极10b由金属布线图案和具有同轴线结构的第二印刷布线板2，其具有通过绝缘层包围信号线15a和信号线15a的周围的屏蔽电极12,17,18。第一印刷线路板3的信号电极10a和第二印刷线路板2的信号线15a电连接在一起，第一印刷线路板3的接地电极10b和屏蔽电极12,17,18的第二印刷线路板2电连接在一起。

7. 发明授权

US07227352B2 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe 有权
标题翻译：接触式探针，用于接触式探针的测量垫以及接触式探头的制造方法
公开(公告)号：US07227352B2
公开(公告)日：2007-06-05
申请号：US11602240
申请日：2006-11-21
申请人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Shigeo Kiyota
发明人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Shigeo Kiyota
IPC分类号： G01R31/02 , H01R43/00
CPC分类号： G01R1/06772 , H05K1/0219 , H05K1/117 , Y10T29/49117
摘要： There is provided a contact probe that is smaller than 50 μm in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor la electrically connected to the ground electrode 11a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.
摘要翻译：提供了在信号电极和接地电极之间以间距小于50um的接触探针，并且可以正确地进行高速高频测量，用于接触探针的测量垫以及制造方法接触探头。接触探针包括：具有与被测量物体接触的信号电极10a和接地电极11a的尖端部件; 以及具有电连接到信号电极10a的芯1b和电连接到接地电极11a的外覆盖导体1a的同轴电缆1，其中尖端构件形成在印刷线路板2上，并且其中信号电极10a和接地电极11a由形成在绝缘板2a上的细共面带状线构成。

8. 发明授权

US07414422B2 System in-package test inspection apparatus and test inspection method 失效
标题翻译：系统包装试验检验装置及试验检验方法
公开(公告)号：US07414422B2
公开(公告)日：2008-08-19
申请号：US11108861
申请日：2005-04-19
申请人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Hiroyuki Fujita , Kenichi Kobayashi
发明人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Hiroyuki Fujita , Kenichi Kobayashi
IPC分类号： G01R31/26
CPC分类号： G01R31/2822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/15192 , H01L2924/15311 , H01L2224/05599 , H01L2924/00012
摘要： A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.
摘要翻译：一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置，在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时，多个LSI芯片被堆叠在多个层中，该系统的封装测试检查装置包括：印刷布线基板，连接系统内置的I / O端子，实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置，用于向接触探针提供高频评估信号; 输出信号检测装置，用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置，用于分析由输出信号检测装置检测到的信号，其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触，评估信号不通过金属布线输入到LSI芯片 LSI封装。

9. 发明申请

US20050264313A1 Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe 有权
标题翻译：接触式探针，用于接触式探针的测量垫以及接触式探头的制造方法
公开(公告)号：US20050264313A1
公开(公告)日：2005-12-01
申请号：US11136572
申请日：2005-05-25
申请人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Shigeo Kiyota
发明人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Shigeo Kiyota
IPC分类号： G01R1/067 , G01R31/02 , H05K1/02 , H05K1/11
CPC分类号： G01R1/06772 , H05K1/0219 , H05K1/117 , Y10T29/49117
摘要： There is provided a contact probe that is smaller than 50 μm in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode 10a and a ground electrode 11a that are put into contact with an object to be measured; and a coaxial cable 1 having a core 1b electrically connected to the signal electrode 10a and an outer covering conductor 1a electrically connected to the ground electrode 1a, wherein the tip member is formed on a printed wiring board 2, and wherein the signal electrode 10a and the ground electrode 11a are constructed of fine coplanar strip lines formed on an insulating board 2a.
摘要翻译：提供了在信号电极和接地电极之间以间距小于50um的接触探针，并且可以正确地进行高速高频测量，用于接触探针的测量垫以及制造方法接触探头。接触探针包括：具有与被测量物体接触的信号电极10a和接地电极11a的尖端部件; 以及具有电连接到信号电极10a的芯1b和电连接到接地电极1a的外部覆盖导体1A的同轴电缆1，其中尖端构件形成在印刷线路板2上，并且其中，信号电极10a和接地电极11a由形成在绝缘板2a上的精细共面带状线构成。

10. 发明申请

US20050236717A1 System in-package test inspection apparatus and test inspection method 失效
标题翻译：系统包装试验检验装置及试验检验方法
公开(公告)号：US20050236717A1
公开(公告)日：2005-10-27
申请号：US11108861
申请日：2005-04-19
申请人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Hiroyuki Fujita , Kenichi Kobayashi
发明人： Masahiro Aoyagi , Hiroshi Nakagawa , Kazuhiko Tokoro , Katsuya Kikuchi , Yoshikuni Okada , Hiroyuki Fujita , Kenichi Kobayashi
IPC分类号： G01R1/073 , G01R31/28 , H01L23/48
CPC分类号： G01R31/2822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2924/00014 , H01L2924/15192 , H01L2924/15311 , H01L2224/05599 , H01L2924/00012
摘要： A system in-package test inspection apparatus for measuring and evaluating the high-speed/high frequency characteristic of a system in-package through an electrode pad in which I/O terminals are formed on one side of an LSI package containing metallic wiring internally and plural LSI chips are stacked in multiple layers on the other face while electric connection between the LSI chip and the LSI package and the electric connection between the LSI chips are implemented, the system in-package test inspection apparatus comprising: a printed wiring substrate to which the I/O terminals of the system in-package are connected to enable transmission of high speed and high frequency signals; LSI chip driving means for driving the LSI chip; a contact probe having a contact electrode and for transmitting a high frequency signal; evaluation signal generating means for supplying a high frequency evaluation signal to the contact probe; output signal detecting means for detecting an output signal of the system in-package through the printed wiring board; and analyzing means for analyzing a signal detected by the output signal detecting means, wherein by contacting the contact electrode of the contact probe with an electrode pad formed on the LSI chip, the evaluation signal is inputted to the LSI chip not through metallic wiring within the LSI package.
摘要翻译：一种用于测量和评估通过其内部形成有包含金属布线的LSI封装的一侧上的I / O端子的电极焊盘的系统的封装中的高速/高频特性的系统级封装测试检查装置，在LSI芯片和LSI封装之间的电连接和LSI芯片之间的电连接被实现的同时，多个LSI芯片被堆叠在多个层中，该系统的封装测试检查装置包括：印刷布线基板，连接系统内置的I / O端子，实现高速和高频信号的传输; 用于驱动LSI芯片的LSI芯片驱动装置; 具有接触电极并用于发送高频信号的接触探针; 评估信号发生装置，用于向接触探针提供高频评估信号; 输出信号检测装置，用于检测通过印刷电路板的封装中的系统的输出信号; 以及分析装置，用于分析由输出信号检测装置检测到的信号，其中通过使接触探针的接触电极与形成在LSI芯片上的电极焊盘接触，评估信号不通过金属布线输入到LSI芯片 LSI封装。

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