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1. 发明申请

US20080190657A1 Circuit Board 有权
标题翻译：电路板
公开(公告)号：US20080190657A1
公开(公告)日：2008-08-14
申请号：US10597306
申请日：2005-01-06
申请人： Yoshifumi Kanetaka , Naomi Ishizuka
发明人： Yoshifumi Kanetaka , Naomi Ishizuka
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H05K1/116 , H05K3/3447 , H05K2201/094 , H05K2201/09854 , H05K2201/10189 , Y10T29/49139
摘要： A circuit board includes a plurality of through holes (14, 44) into which a plurality of leads (18) of one electronic devices are inserted and soldered. Among these through holes (14, 44), the volume of through hole (14b, 24b, 34b, 44b, 54, 64b) into which the outermost end lead of leads (18) of the electronic device is inserted, is set greater than the volume of through hole (14a, 44a), into which the lead at the position nearest to the center of the electronic device is inserted. Alternatively, the size of through hole (14b, 24b, 34b, 44b, 54, 64b), into which the outermost end lead of leads (18) is inserted, the size being measured in a direction of a straight line that connects a position of the outermost end lead of leads (18) of the electronic device, which is mounted before being soldered, and a center position of the electronic device at the time when the electronic device is mounted, is larger than the size of through hole (14a, 44a), into which the lead of leads (18) which is located at the position nearest to the center of the electronic device is inserted, the size being measured in any direction in a plane. Alternatively, the center position of through hole (74b), into which outermost end lead (18) of the electronic device is inserted, is shifted in a direction away from or approaching the center position of the electronic device at the time when the electronic device is mounted, from the position of outermost end lead (18) of the electronic device, which is mounted before being soldered, in accordance with the relationship between the amount of thermal expansion of the electronic device and that of the circuit board.
摘要翻译：电路板包括多个通孔（14,44），一个电子设备的多个引线（18）插入并焊接到其中。在这些通孔（14,44）中，插入电子装置的引线（18）的最外端引线的通孔（14b，24b，34b，44b，54,64b）的容积被设定为大于通孔（14a，44a）的体积，最靠近电子设备中心的位置处的引线插入其中。或者，引线（18）的最外端引线插入的贯通孔（14b，24b，34b，44b，54bbb）的尺寸在直线方向上测量的尺寸连接安装在焊接前的电子设备的引线（18）的最外端引线的位置与安装电子设备时的电子设备的中心位置的线大于尺寸的通孔（14a，44a），其中位于最靠近电子设备中心的位置处的引线（18）的引线插入其中，该尺寸被测量在平面中的任何方向上。或者，电子设备的最外端引线（18）插入其中的通孔（74b）的中心位置在电子设备的电子设备时沿远离或接近电子设备的中心位置的方向移动装置根据电子装置的热膨胀量与电路板的热膨胀量之间的关系，从焊接前安装的电子装置的最外端引线（18）的位置安装。

2. 发明授权

US07820917B2 Circuit board 有权
标题翻译：电路板
公开(公告)号：US07820917B2
公开(公告)日：2010-10-26
申请号：US10597306
申请日：2005-01-06
申请人： Yoshifumi Kanetaka , Naomi Ishizuka
发明人： Yoshifumi Kanetaka , Naomi Ishizuka
IPC分类号： H05K1/16
CPC分类号： H05K1/116 , H05K3/3447 , H05K2201/094 , H05K2201/09854 , H05K2201/10189 , Y10T29/49139
摘要： A circuit board includes a plurality of through holes into which a plurality of leads of one electronic devices are inserted and soldered with lead free solder. Among these through holes, the volume of through hole into which the outermost end lead of leads of the electronic device is inserted, is set greater than the volume of through hole, into which the lead at the position nearest to the center of the electronic device is inserted.
摘要翻译：电路板包括多个通孔，一个电子设备的多个引线插入并焊接到无铅焊料中。在这些通孔中，电子装置的引线的最外端引线插入其中的通孔的容积被设定为大于通孔的容积，最靠近电子装置的中心的位置处的引线被插入。

3. 发明授权

US06940023B2 Printed-wiring board and electronic device 失效
标题翻译：印刷电路板和电子设备
公开(公告)号：US06940023B2
公开(公告)日：2005-09-06
申请号：US10894456
申请日：2004-07-16
申请人： Naomi Ishizuka , Eiichi Kono
发明人： Naomi Ishizuka , Eiichi Kono
IPC分类号： H05K3/28 , H05K1/11 , H05K1/18 , H05K3/34 , H05K3/42 , H05K3/46 , H05K1/16
CPC分类号： H05K1/116 , H05K3/3447 , H05K3/3463 , H05K3/429 , H05K2201/09454 , H05K2201/09781
摘要： The present invention provides a board ensuring no peel-off of a wall and a land, even if a part is soldered to the board with lead-free solder. The board 10 is comprised of N (N≧3) layer patterns electrically insulated from one another, and is formed with a through-hole 14 into which an electrode 19 of an electronic part 18 is to be inserted. An external land 15 is formed on a surface of each of the first and N-th layer patterns. An electrically conductive layer 17 is formed on an inner wall of the through-hole 14 such that the electrically conductive layer is electrically connected to the external land 15 of each of the first and N-th layer patterns. The electronic part 18 is fixed in the through-hole 14 with lead-free solder 20 filled in the through-hole 14. At least one internal land 16 extending from the electrically conductive layer 17 is formed in the same layer as a M-th layer pattern (2≦M≦(N−1)). The internal land 16 is not electrically connected to the M-th layer pattern.
摘要翻译：本发明提供一种确保墙壁和焊盘不会剥离的板，即使用无铅焊料将部件焊接到板上也是如此。板10由彼此电绝缘的N（N> = 3）层图案组成，并且形成有通孔14，电子部件18的电极19将被插入到该通孔14中。在第一和第N层图案中的每一个的表面上形成外部平台15。导电层17形成在通孔14的内壁上，使得导电层电连接到第一和第N层图案中的每一个的外部焊盘15。电子部件18通过填充在通孔14中的无铅焊料20固定在通孔14中。从导电层17延伸的至少一个内部区域16形成在与第M层图案相同的层中（2≤M≤=（N-1））。内部平台16不与M层图案电连接。

4. 发明授权

US06617529B2 Circuit board and electronic equipment using the same 有权
公开(公告)号：US06617529B2
公开(公告)日：2003-09-09
申请号：US09985727
申请日：2001-11-06
申请人： Naomi Ishizuka , Akihito Matsumoto , Eiichi Kono , Motoji Suzuki , Akihiro Sato , Hiroshi Matsuoka , Masafumi Kanai
发明人： Naomi Ishizuka , Akihito Matsumoto , Eiichi Kono , Motoji Suzuki , Akihiro Sato , Hiroshi Matsuoka , Masafumi Kanai
IPC分类号： H01R1204
CPC分类号： H05K3/3447 , H01R4/023 , H05K1/116 , H05K3/3463 , H05K2201/0939 , H05K2201/099
摘要： In a circuit board having lands 2 each of which has a through hole 4 through which a lead of an electrical part is inserted, the lead 3 and the land 2 being mounted in the circuit board by using lead-free solder 6, the width of the land 2 corresponding to the difference in radius between the land 2 and the through hole 4 is set to about 0.40 mm or more. The width of the land 2 is set to such a value that the land exfoliation due to the solidification/shrinkage of the lead-free solder 6 and the shrinkage of the circuit board in the thickness direction can be prevented. The circuit board 1 has circuit wires at least on both the surface and the back surface.

5. 发明申请

US20100319974A1 PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE 审中-公开
标题翻译：印刷线路板，电子设备及制造电子设备的方法
公开(公告)号：US20100319974A1
公开(公告)日：2010-12-23
申请号：US12865203
申请日：2009-02-12
申请人： Naomi Ishizuka
发明人： Naomi Ishizuka
IPC分类号： H05K1/16 , H05K1/11 , B32B37/02
CPC分类号： H05K1/0271 , H01L24/13 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/16237 , H01L2224/37599 , H01L2224/81191 , H01L2224/8159 , H01L2224/816 , H01L2224/90 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/00 , H05K3/321 , H05K3/3421 , H05K3/3436 , H05K3/3452 , H05K13/0465 , H05K2201/09845 , H05K2201/10719 , H05K2201/10734 , H05K2203/0594 , Y10T156/10 , H01L2224/83851 , H01L2924/00 , H01L2224/05599 , H01L2224/37099 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads are formed; and an electronic element that comprises external terminals electrically connected to the pads and that is mounted on the printed wiring board. The insulating film layer comprises at least one connecting opening section each exposing at least part of one of the pads. At least part of an inner wall of the connecting opening section comprises at least one step section.
摘要翻译：电子装置包括：印刷布线板，其包括基板，形成在基板上的焊盘和覆盖其上形成焊盘的基板的表面的绝缘膜层; 以及电子元件，其包括电连接到所述焊盘并且安装在所述印刷线路板上的外部端子。绝缘膜层包括至少一个连接开口部分，每个连接开口部分暴露其中一个焊盘的至少一部分。连接开口部分的内壁的至少一部分包括至少一个台阶部分。

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