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1. 发明授权

US06420476B1 Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom 失效
标题翻译：复合介电材料组合物，以及由其制成的膜，基材，电子部件和模塑制品
公开(公告)号：US06420476B1
公开(公告)日：2002-07-16
申请号：US09292842
申请日：1999-04-16
申请人： Toshiaki Yamada , Hiroaki Hasegawa , Yoshiyuki Yasukawa , Kenji Endou , Michihisa Yamada , Yasuo Moriya , Tomiho Yamada , Tetsuya Itoh
发明人： Toshiaki Yamada , Hiroaki Hasegawa , Yoshiyuki Yasukawa , Kenji Endou , Michihisa Yamada , Yasuo Moriya , Tomiho Yamada , Tetsuya Itoh
IPC分类号： C08L900
CPC分类号： H01B3/442 , H05K1/024 , H05K1/032 , H05K1/0373 , H05K2201/0209
摘要： The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.
摘要翻译：本发明的目的是提供一种具有从高频带和低介电损耗角正切相对较宽范围内选择的任何所需介电常数的复合电介质材料，以及膜，基片，电子部件或模制或其它形成的制品使用相同为了实现该目的，提供了一种复合介电材料组合物，其包括耐热低介电聚合物材料，其是包含一种或两种或更多种重均分子量绝对分子量至少为1,000的树脂组合物，其中所述组合物中碳原子和氢原子的总和为至少99％，并且部分或全部树脂分子之间具有化学键和填料。使用该组合物获得薄膜，基材，电子部件或模制或其它成型制品。

2. 发明授权

US06500535B1 Heat resistant, low dielectric polymers, and films, substrates, electronic parts and heat resistant resin molded parts using the same 有权
标题翻译：耐热，低介电聚合物和薄膜，基材，电子部件和使用其的耐热树脂模制件
公开(公告)号：US06500535B1
公开(公告)日：2002-12-31
申请号：US09140533
申请日：1998-08-26
申请人： Toshiaki Yamada , Takeshi Takahashi , Yoshiyuki Yasukawa , Kenji Endou , Shigeru Asami , Michihisa Yamada , Yasuo Moriya
发明人： Toshiaki Yamada , Takeshi Takahashi , Yoshiyuki Yasukawa , Kenji Endou , Shigeru Asami , Michihisa Yamada , Yasuo Moriya
IPC分类号： B32B2732
CPC分类号： C08J5/18 , B32B27/00 , C08F255/00 , C08L23/08 , C08L23/0838 , C08L51/06 , C08L53/00 , C08L2203/202 , H01B3/442 , H05K1/032 , Y10T428/254 , Y10T428/31913 , Y10T428/31917 , Y10T428/31924 , C08L2666/04
摘要： The invention provides a heat-resistant, low-dielectric polymeric material that is preferably a copolymer in which a non-polar &agr;-olefin base polymer segment and a vinyl aromatic copolymer segment are chemically combined with each other, and that is a thermoplastic resin showing a multi-phase structure in which a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment. It is thus possible to achieve a polymeric material that is excellent in heat resistance, has high strength, and has a low dielectric constant and a reduced dielectric loss, and so is suitable for an electrical insulating material for high-frequency purposes.
摘要翻译：本发明提供一种耐热低介电聚合物材料，其优选是其中非极性α-烯烃基聚合物链段和乙烯基芳族共聚物链段彼此化学结合的共聚物，并且是热塑性树脂，其表现出其中由一段形成的分散相被细分散在由另一段形成的连续相中的多相结构。因此，可以实现耐热性优异，强度高，介电常数低，介电损耗降低的聚合材料，因此适用于高频用电绝缘材料。

3. 发明授权

US4607087A Method for producing a plastic lens 失效
标题翻译：塑料透镜的制造方法
公开(公告)号：US4607087A
公开(公告)日：1986-08-19
申请号：US478023
申请日：1983-03-23
申请人： Yasuo Moriya , Kyosuke Fukushi , Masaharu Nakayama
发明人： Yasuo Moriya , Kyosuke Fukushi , Masaharu Nakayama
IPC分类号： B29C39/02 , B29C39/00 , B29C39/22 , B29C39/26 , B29C41/46 , B29C61/00 , B29D11/00 , B29K69/00 , B29K105/24 , C08F18/00 , C08F18/24 , C08F218/00 , G02B1/04 , C08F4/28
CPC分类号： C08F18/24 , G02B1/041
摘要： A plastic lens which has high hardness and excellent scratch resistance and can form a transparent and uniform reflection preventing film through vacuum deposition, is produced by mixing(a) diethylene glycol bis(allyl carbonate) with(b) at least one of organic peroxides having a decomposition temperature at selected half-life value for ten hours of not higher than 80.degree. C. and(c) at least one of organic peroxides having a decomposition temperature at selected half-life value for ten hours of 90.degree.-110.degree. C., which have no copolymerizability to the diethylene glycol bis(allyl carbonate) (a), as a polymerization initiator, and polymerizing and casting the resulting mixture in a desired lens-forming mold.
摘要翻译：通过将（a）二甘醇双（碳酸烯丙酯）与（b）至少一种有机过氧化物混合（a）具有高硬度和优异的耐擦伤性并且可以通过真空沉积形成透明均匀防反射膜的塑料透镜，选择的半衰期值为不高于80℃的10小时的分解温度和（c）在90℃-110℃下10分钟的分解温度在选定的半衰期值的有机过氧化物中的至少一种对于二甘醇双（碳酸烯丙酯）（a），作为聚合引发剂不具有共聚性，并将所得混合物聚合并浇注到所需的透镜成形模具中。

4. 发明申请

US20070119045A1 Method of assembling a carriage assembly and assembling apparatus 失效
标题翻译：组装支架组件和组装装置的方法
公开(公告)号：US20070119045A1
公开(公告)日：2007-05-31
申请号：US11375210
申请日：2006-03-15
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
IPC分类号： G11B5/48 , G11B21/16 , G11B5/127 , B23P19/00 , G11C5/12
CPC分类号： G11B5/4813 , Y10T29/49025 , Y10T29/49027 , Y10T29/49915 , Y10T29/49934 , Y10T29/49938 , Y10T29/53165
摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure applying member, the pressure applying member is caused to vibrate on a two dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.
摘要翻译：一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。通过将两个轴向的超声波振动施加到压力施加构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。

5. 发明授权

US06984254B2 Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy 失效
标题翻译：无铅焊料合金以及使用这种无铅焊料合金的电气和电子设备的制造过程
公开(公告)号：US06984254B2
公开(公告)日：2006-01-10
申请号：US10337373
申请日：2003-01-07
申请人： Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
发明人： Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC分类号： B23K35/26
CPC分类号： B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
摘要： A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 μm. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.
摘要翻译：一种无铅焊料粉末，其可以包括多个直径为20-60μm的一般球形的无铅焊料颗粒。每个无铅焊料颗粒可以含有Sn，Ag和Bi，其各自的浓度设定为使得无铅焊料合金的熔融温度低于要焊接的工件的预定耐热温度。

6. 发明授权

US4879347A Graft polymerization preformer and method of manufacturing the same 失效
标题翻译：接枝聚合预成型剂及其制造方法
公开(公告)号：US4879347A
公开(公告)日：1989-11-07
申请号：US339057
申请日：1989-04-14
申请人： Yasuo Moriya , Nobuyoshi Suzuki , Hiroshi Goto
发明人： Yasuo Moriya , Nobuyoshi Suzuki , Hiroshi Goto
IPC分类号： C08F4/34 , C08F255/02
CPC分类号： C08F255/02 , C08F4/34 , Y10S525/913
摘要： Resin compositions obtained by causing copolymerization of particular radical polymerizable organic peroxide and vinyl monomer in an ethylene polymer and that it is a best way to use a water suspension in the manufacture.

7. 发明授权

US07581309B2 Method of assembling a carriage assembly 失效
标题翻译：组装滑架组件的方法
公开(公告)号：US07581309B2
公开(公告)日：2009-09-01
申请号：US11375210
申请日：2006-03-15
申请人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
发明人： Takayoshi Matsumura , Naoki Ishikawa , Hiroshi Kobayashi , Yasuo Moriya , Hidehiko Kira
IPC分类号： G11B5/48 , B23P11/00
CPC分类号： G11B5/4813 , Y10T29/49025 , Y10T29/49027 , Y10T29/49915 , Y10T29/49934 , Y10T29/49938 , Y10T29/53165
摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure-applying member, the pressure-applying member is caused to vibrate on a two-dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.
摘要翻译：一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。通过将两个轴向的超声波振动施加到施加压力的构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。

8. 发明授权

US4923956A Graft polymerization precursor and method of manufacturing the same 失效
标题翻译：接枝聚合前体及其制造方法
公开(公告)号：US4923956A
公开(公告)日：1990-05-08
申请号：US184260
申请日：1988-04-21
申请人： Yasuo Moriya , Nobuyoshi Suzuki , Hiroshi Goto
发明人： Yasuo Moriya , Nobuyoshi Suzuki , Hiroshi Goto
IPC分类号： C08F4/34 , C08F255/02 , C08G81/02 , C08L23/00 , C08L23/12 , C08L25/00 , C08L25/08 , C08L29/04 , C08L33/04 , C08L33/18 , C08L33/20
CPC分类号： C08F255/02 , C08F4/34
摘要： Resin compositions obtained by causing copolymerization of particular radical (co-and/or) polymerizable organic peroxide and vinyl monomer in particular propylene polymers and that it is a best way to use an aqueous suspension in the manufacture.

9. 发明授权

US4877841A Graft polymerization preformer and method of manufacturing the same 失效
公开(公告)号：US4877841A
公开(公告)日：1989-10-31
申请号：US149746
申请日：1988-01-29
申请人： Yasuo Moriya , Nobuyoshi Suzuki , Hiroshi Goto
发明人： Yasuo Moriya , Nobuyoshi Suzuki , Hiroshi Goto
IPC分类号： C08F4/34 , C08F255/02
CPC分类号： C08F255/02 , C08F4/34 , Y10S525/913
摘要： Resin compositions obtained by causing copolymerization obtained by causing copolymerization of particular radial (co-and/or) polymerizable organic peroxide and vinyl monomer in particular ethylene (co-and/or) polymers and that it is a best way to use a water suspension in the manufacture.

10. 发明授权

US06184475B2 Lead-free solder composition with Bi, In and Sn 失效
标题翻译：具有Bi，In和Sn的无铅焊料组成
公开(公告)号：US06184475B2
公开(公告)日：2001-02-06
申请号：US08526929
申请日：1995-09-12
申请人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
发明人： Masayuki Kitajima , Masakazu Takesue , Yasuo Moriya , Yoshinori Nemoto , Yumiko Fukushima
IPC分类号： A05K116
CPC分类号： B23K35/025 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3615 , B23K35/3616 , B23K35/3618 , H05K3/3463
摘要： A lead-free solder alloy composition contains Sn, Bi and In, with respective contents such that the solder alloy composition provides a liquidus temperature below the heat resistant temperature of a work to be soldered. The alloy contains not more than about 60 wt % Bi; not more than about 50 wt % In; optionally at least one element selected from Ag, Zn, Ge, Ga, Sb, and P; and Sn. Also, lead-free solder powders containing same, and printed circuit boards, electronic components and electronic apparati employing such alloy.
摘要翻译：无铅焊料合金组合物含有Sn，Bi和In，各自的含量使得焊料合金组合物的液相线温度低于要焊接的工件的耐热温度。该合金含有不超过约60重量％的Bi; 不超过约50重量％的In; 可选地，选自Ag，Zn，Ge，Ga，Sb和P中的至少一种元素; 和Sn。另外，含有这种合金的无铅焊料粉末，以及印刷电路板，电子元件和使用这种合金的电子设备。

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