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1. 发明申请

US20210384058A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
公开(公告)号：US20210384058A1
公开(公告)日：2021-12-09
申请号：US17336322
申请日：2021-06-02
申请人： Tokyo Electron Limited
发明人： Hiroki HARADA , Tatsuhiko TSUJIHASHI , Tokutarou HAYASHI , Tsuyoshi OTSUKA , Yuji KAWAGUCHI
IPC分类号： H01L21/68 , H01L21/687 , B65G47/90
摘要： A substrate processing apparatus according to an aspect of the present disclosure includes a substrate processing unit, a substrate transfer unit, a first detection unit, a second detection unit, and a third detection unit. The substrate processing unit holds and processes a substrate. The substrate transfer unit has a rotational axis and carries the substrate in the substrate processing unit. The first detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction of travel thereof when the substrate is carried in the substrate processing unit in the direction of travel. The second detection unit detects a position of the substrate transfer unit relative to the substrate processing unit in a direction that is perpendicular to the direction of travel. The third detection unit detects an inclination of the rotational axis of the substrate transfer unit relative to the substrate processing unit.

2. 发明公开

US20230207344A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 审中-公开
公开(公告)号：US20230207344A1
公开(公告)日：2023-06-29
申请号：US17996507
申请日：2021-03-16
申请人： Tokyo Electron Limited
发明人： Yohei YAMAWAKI , Seiji NAKANO , Tokutarou HAYASHI
IPC分类号： H01L21/67 , H01L21/304 , B23K26/53
CPC分类号： H01L21/67092 , H01L21/67259 , H01L21/304 , B23K26/53
摘要： A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a holding member configured to hold the combined substrate; a removing member configured to separate at least a peripheral portion of the first substrate from the second substrate by being inserted between the first substrate and the second substrate; an elevating mechanism configured to adjust a relative height position of the removing member with respect to the holding member; and a controller configured to control an operation of the elevating mechanism. The controller controls the operation of the elevating mechanism such that the relative height position of the removing member with respect to a target insertion position of the removing member is adjusted in an entire circumference of the combined substrate.

3. 发明申请

US20230086738A1 BONDING APPARATUS AND BONDING METHOD 有权
公开(公告)号：US20230086738A1
公开(公告)日：2023-03-23
申请号：US17759517
申请日：2021-01-21
申请人： Tokyo Electron Limited
发明人： Tokutarou HAYASHI , Yoshitaka OTSUKA , Yasutaka MIZOMOTO , Kazuya IKEUE , Munehisa KODAMA
IPC分类号： H01L21/67 , H01L21/66 , H01L21/68
摘要： A bonding apparatus is configured to bond a first substrate and a second substrate to prepare a combined substrate. The first substrate includes a base substrate, and a device layer formed on a surface of the base substrate facing the second substrate. The bonding apparatus includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a moving unit configured to move the first holder and the second holder relative to each other; and a total thickness measurement controller configured to control a thickness detector, which is configured to measure a total thickness of the combined substrate, to measure the total thickness at multiple points.

4. 发明申请

US20170018444A1 SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD, AND NON-TRANSITORY STORAGE MEDIUM 审中-公开
标题翻译：基板传输设备，基板传输方法和非接收式存储介质
公开(公告)号：US20170018444A1
公开(公告)日：2017-01-19
申请号：US15278155
申请日：2016-09-28
申请人： Tokyo Electron Limited
发明人： Tokutarou HAYASHI , Yuichi DOUKI , Hiromitsu MAEJIMA
IPC分类号： H01L21/67 , G05B19/418 , H01L21/68 , G05D3/12 , H01L21/677
CPC分类号： H01L21/67259 , G05B19/4189 , G05B2219/45032 , G05B2219/45051 , G05D3/125 , H01L21/67742 , H01L21/681
摘要： A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.
摘要翻译：一种用于在其边缘部分传送设置有切口的圆形基板的基板传送装置，包括：传感器部分，包括三个光源部分，该光源部分将光施加到边缘部分处彼此不同的位置，以及三个光接收部分光源部件; 以及用于移动所述基板保持部的驱动部，其中，所述三个光源部向所述受光部施加光，使得所述传感器部的检测范围是否与所述基板的切口重叠，基于每个光接收部分的接收光量，并且当确定在任何位置处存在重叠时，基板的边缘部分的位置被进一步检测到基板相对于传感器部分移位的位置。

5. 发明申请

US20140234991A1 Thermal processing apparatus for thermal processing substrate and positioning method of positioning substrate transfer position 审中-公开
标题翻译：用于热处理基板的热处理装置和定位基板转印位置的定位方法
公开(公告)号：US20140234991A1
公开(公告)日：2014-08-21
申请号：US14248765
申请日：2014-04-09
申请人： TOKYO ELECTRON LIMITED
发明人： Yuichi DOUKI , Tokutarou HAYASHI , Naruaki IIDA , Suguru ENOKIDA
IPC分类号： H01L21/68 , H01L21/66
CPC分类号： H01L21/68 , H01L21/6715 , H01L21/67748 , H01L21/681 , H01L21/68707 , H01L22/10 , H01L2924/0002 , H01L2924/00
摘要： A substrate holder positioning method, capable of positioning a substrate holder without using any positioning jig, includes: measuring a first position of a substrate held on a substrate holder included in a substrate carrying mechanism; carrying the substrate held on the substrate holder to a substrate rotating unit for holding and rotating the substrate; turning the substrate held by the substrate rotating unit through a predetermined angle by the substrate rotating unit; transferring the substrate turned by the substrate rotating unit from the substrate rotating unit to the substrate holder; measuring a second position of the substrate transferred from the substrate rotating unit to the substrate holder; determining the position of the center of rotation of the substrate rotating unit on the basis of the first and the second position; and positioning the substrate holder on the basis of the position of the center of rotation.
摘要翻译：一种能够在不使用任何定位夹具的情况下定位基板支架的基板支架定位方法，包括：测量保持在基板承载机构中的基板保持器上的基板的第一位置; 将保持在所述基板保持器上的所述基板承载到用于保持和旋转所述基板的基板旋转单元; 通过基板旋转单元将由基板旋转单元保持的基板转动预定角度; 将由基板旋转单元转动的基板从基板旋转单元传送到基板保持器; 测量从所述基板旋转单元转移到所述基板保持器的所述基板的第二位置; 基于第一位置和第二位置确定基板旋转单元的旋转中心的位置; 并且基于旋转中心的位置来定位衬底保持器。

6. 发明申请

US20130211571A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20130211571A1
公开(公告)日：2013-08-15
申请号：US13759515
申请日：2013-02-05
申请人： TOKYO ELECTRON LIMITED
发明人： Akihiro TERAMOTO , Tokutarou HAYASHI
IPC分类号： G05B19/418
CPC分类号： G05B19/4189 , B25J9/1612 , G05B2219/39479 , G05B2219/39508
摘要： A technique which, when transporting a substrate from one module to another, detects a displacement of the substrate on a holding member and transfers the substrate to another module with the displacement within an acceptable range. Displacement of a wafer on a fork of a transport arm from a reference position is determined when the fork has received the wafer from one module and, when the displacement is within an acceptable range, the wafer is transported by the transport arm to another module. When the displacement is out of the acceptable range, the wafer is transported by the transport arm to a wafer stage module, and then the transport arm receives the wafer from the wafer stage module so that the displacement comes to fall within the acceptable range. The wafer can therefore be transferred to another module with the displacement within the acceptable range.
摘要翻译：一种将基板从一个模块传送到另一个模块的技术是检测基板在保持部件上的位移，并且将该基板转移到另一个位移在可接受范围内的模块。当叉子从一个模块接收到晶片时，确定了从基准位置移动臂的叉子上的晶片的位移，并且当位移在可接受的范围内时，晶片被传送臂传送到另一个模块。当位移超出可接受范围时，晶片由传送臂传送到晶片台模块，然后传输臂从晶片台模块接收晶片，使得位移落入可接受的范围内。因此，晶片可以被转移到具有在可接受范围内的位移的另一个模块。

7. 发明申请

US20130204421A1 SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD, AND NON-TRANSITORY STORAGE MEDIUM 有权
标题翻译：基板传输设备，基板传输方法和非接收式存储介质
公开(公告)号：US20130204421A1
公开(公告)日：2013-08-08
申请号：US13752440
申请日：2013-01-29
申请人： Tokyo Electron Limited
发明人： Tokutarou HAYASHI , Yuichi DOUKI , Hiromitsu MAEJIMA
IPC分类号： G05D3/12
CPC分类号： H01L21/67259 , G05B19/4189 , G05B2219/45032 , G05B2219/45051 , G05D3/125 , H01L21/67742 , H01L21/681
摘要： A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three light source parts applying light to positions different from one another at the edge portion, and three light receiving parts paired with the light source parts; and a drive part for moving the substrate holding part, wherein the three light source parts apply light to the light receiving parts so that whether or not a detection range of the sensor part overlaps with the cutout of the substrate is determined on the basis of an amount of received light by each light receiving part, and when it is determined that there is an overlap at any position, positions of the edge portion of the substrate are further detected with the position of the substrate displaced with respect to the sensor part.
摘要翻译：一种用于在其边缘部分传送设置有切口的圆形基板的基板传送装置，包括：传感器部分，包括三个光源部分，该光源部分将光施加到边缘部分处彼此不同的位置，以及三个光接收部分光源部件; 以及用于移动所述基板保持部的驱动部，其中，所述三个光源部向所述受光部施加光，使得所述传感器部的检测范围是否与所述基板的切口重叠，基于每个光接收部分的接收光量，并且当确定在任何位置处存在重叠时，基板的边缘部分的位置被进一步检测到基板相对于传感器部分移位的位置。

8. 发明申请

US20130202388A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND NON-TRANSITORY STORAGE MEDIUM 有权
标题翻译：基板处理设备，基板处理方法和非接收式存储介质
公开(公告)号：US20130202388A1
公开(公告)日：2013-08-08
申请号：US13759471
申请日：2013-02-05
申请人： TOKYO ELECTRON LIMITED
发明人： Tokutarou HAYASHI , Yuichi DOUKI , Hirotoshi MORI , Akihiro TERAMOTO
IPC分类号： H01L21/677 , H01L21/673
CPC分类号： H01L21/677 , H01L21/67178 , H01L21/67184 , H01L21/67259 , H01L21/67288 , H01L21/673 , H01L21/67742
摘要： There is provided a technique which can prevent poor processing of successive substrates in the event of a failure of a module or a transport mechanism for transporting a substrate between modules. A substrate processing apparatus includes: a plurality of modules from which a substrate holder of a substrate transport mechanism receives a substrate; a sensor section for detecting a displacement of the holding position of a substrate, held by the substrate holder, from a reference position preset in the substrate holder; and a storage section for storing the displacement, detected when the substrate holder receives a substrate from each of the modules, in a chronological manner for each module. A failure of one of the modules or the substrate transport mechanism is estimated based on the chronological data on the displacement for each module, stored in the storage section. This enables an early detection of a failure or abnormality.
摘要翻译：提供了一种技术，其可以防止在模块故障或用于在模块之间传送基板的输送机构的情况下连续的基板的加工不良。基板处理装置包括：多个模块，基板传送机构的基板保持器从该多个模块接收基板; 传感器部分，用于检测由衬底保持器保持的衬底的保持位置从预设在衬底保持器中的参考位置的位移; 以及存储部，用于存储当基板保持器从每个模块接收到基板时检测到的位移，用于每个模块的按时间顺序排列。基于存储在存储部中的每个模块的位移的时间顺序数据来估计模块或基板传送机构中的一个的故障。这使得能够及早发现故障或异常。

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