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1. 发明申请

US20050088350A1 Multi piece puzzle-lock antenna using flex film radiator 失效
标题翻译：多功能拼图锁天线采用柔性薄膜散热器
公开(公告)号：US20050088350A1
公开(公告)日：2005-04-28
申请号：US10939738
申请日：2004-09-13
申请人： Thomas Murry , Ying Song , Cheryl Mayer , Brian Potter
发明人： Thomas Murry , Ying Song , Cheryl Mayer , Brian Potter
IPC分类号： H01Q1/24 , H01Q1/38 , H01Q9/40 , H01Q9/42
CPC分类号： H01Q1/242 , H01Q1/38 , H01Q9/40 , H01Q9/42
摘要： The present invention provides a flexible film antenna. The flexible film antenna includes a radiating element comprising a conductive trace on a flexible film. Flexible film is mounted on a core. The core comprises at least two parts that are releasably coupled together in snap or sliding relation. A feed post extends out a base of the core to connect to a power feed. Finally, a protective housing can be molded over the antenna.
摘要翻译：本发明提供一种柔性薄膜天线。柔性膜天线包括在柔性膜上包括导电迹线的辐射元件。柔性膜安装在芯上。芯部包括至少两个部件，其以卡扣或滑动关系可释放地联接在一起。进料柱延伸出芯的基部以连接到电源。最后，可以在天线上模制保护壳体。

2. 发明申请

US20070023387A1 PRINTED CIRCUIT BOARD INTERCONNECTION AND METHOD 审中-公开
标题翻译：印刷电路板互连和方法
公开(公告)号：US20070023387A1
公开(公告)日：2007-02-01
申请号：US11164388
申请日：2005-11-21
申请人： Thomas Murry
发明人： Thomas Murry
IPC分类号： H01B13/00
CPC分类号： H05K3/4614 , H05K3/3452 , H05K3/4038 , H05K2201/0195 , H05K2201/0305 , H05K2201/0949 , H05K2201/099 , H05K2201/09909 , H05K2203/061 , H05K2203/063
摘要： A product of and method for laminating and interconnecting multiple layer printed circuit boards (14) includes at least two complementary substrates (10 and 12) each having a solder bump (30) formed from conductive material (28) applied to a desired component (22). A dam network (34) is formed about the bumps (30) to prevent undesired spreading of the conductive material (28). Bonding material (36) between the surfaces (38a and 38b) of the substrates (10 and 12) bonds the multiple layers. The bonding material (36) has apertures through which the solder bumps (30) are connected.
摘要翻译：用于层压和互连多层印刷电路板（14）的产品和方法包括至少两个互补基板（10和12），每个互补基板具有由施加到期望部件（22）的导电材料（28）形成的焊料凸块（30））。围绕凸块（30）形成坝网（34），以防止导电材料（28）的不期望的扩散。衬底（10和12）的表面（38a和38b）之间的粘结材料（36）将多层粘结。接合材料（36）具有孔，焊料凸块（30）连接在该孔上。

3. 发明申请

US20070062730A1 CONTROLLED DEPTH ETCHED VIAS 审中-公开
标题翻译：控制深度蚀刻VIAS
公开(公告)号：US20070062730A1
公开(公告)日：2007-03-22
申请号：US11306730
申请日：2006-01-09
申请人： Thomas Murry
发明人： Thomas Murry
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K3/062 , H05K3/064 , H05K3/427 , H05K3/429 , H05K2201/09645 , H05K2203/1184 , H05K2203/1394 , H05K2203/1476
摘要： A printed circuit board (20) includes a sub-assembly having dielectric (22) and conductive layers (24). A hole (26) extends into the sub-assembly. Metal plating (32) is applied on a barrel (27) of the hole (26). A conductive layer (32) and an etch resist (34) are applied to a first photoresist (30) on the hole barrel (27). The first photoresist (30) is removed and a second photoresist (36) is applied leaving areas to be controlled depth etched exposed. The exposed areas (38) are chemically etched. The second layer of photoresist (36) is removed and a second chemical etch operation is performed to define previously plated features (40) on the sub-assembly (20). The etch resist (34) is then removed.
摘要翻译：印刷电路板（20）包括具有电介质（22）和导电层（24）的子组件。孔（26）延伸到子组件中。金属电镀（32）施加在孔（26）的筒体（27）上。将导电层（32）和抗蚀剂（34）施加到孔镜筒（27）上的第一光致抗蚀剂（30）上。去除第一光致抗蚀剂（30）并施加第二光致抗蚀剂（36），留下要被深度蚀刻曝光的区域。曝光区域（38）被化学蚀刻。去除第二层光致抗蚀剂（36），并执行第二化学蚀刻操作以在子组件（20）上限定先前镀覆的特征（40）。然后除去抗蚀剂（34）。

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